Datasheet

AD9577 Data Sheet
Rev. 0 | Page 16 of 44
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 13.
Parameter
Thermal impedance measurements were taken on a 4-layer
board in still air in accordance with EIA/JESD51-7.
Rating
V
S
to GND −0.3 V to +3.6 V
REFCLK to GND −0.3 V to V
S
+ 0.3 V
Table 14. Thermal Resistance
Package Type θ
JA
LDO to GND −0.3V to V
S
+ 0.3 V
Unit
XT1, XT2 to GND −0.3 V to V
S
+ 0.3 V
40-Lead LFCSP 27.5 °C/W
−0.3 V to V
S
+ 0.3 V
SSCG, MAX_BW, MARGIN, SCL, SDA,
REFSEL to GND
REFOUT, OUTxP, OUTxN to GND −0.3 V to V
S
+ 0.3 V
ESD CAUTION
Junction Temperature
1
150°C
Storage Temperature −65°C to+150°C
Lead Temperature (10 sec) 300°C
1
See the Thermal Characteristics section for θ
JA
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.