Datasheet

Page 1 of 2
The information contained herein does not form part of
a contract and is subject to change without notice. Arcol
operate a policy of continual product development, therefore,
specifications may change.
It is the responsibility of the customer to ensure that the
component selected from our range is suitable for the intended
application. If in doubt please ask Arcol.
ARCOL UK Limited,
Threemilestone Ind. Estate,
Truro, Cornwall, TR4 9LG, UK.
T [phone]
F [phone]
E sales
@
arcolresistors.com
www.arcolresistors.com
1/18.33
FPA2K Thick Film Power Resistor
For variable speed drivers, power supplies, control devices, robotics, motor
control and other power designs. The easy mounting fixture guarantees an
auto calibrated pressure to the cooling plate of approx 300 N
• 2000 Watt operating power
• Non- Inductive Design
• High insulation and partial discharge performance
• Materials in accordance with UL94-V0
• RoHS Compliant
Characteristics
Resistance values
Resistance tolerance
Temperature coefficient
Maximum working voltage
Short time overload
Power rating
Maximum continous current
Electric strength voltage
Single shot voltage
Partial discharge
Insulation resistance
Creepage distance
Air distance
Inductance
Capacity/Mass
Capapcity/Parallel
Operating temperature
Max torque for contacts
Max torque for mounting
Weight
1R to 6K
J (5%) and K (10%)
±150ppm/˚C - others available on request, measured +25˚C to +85˚C
5kVdc - others available on request not exceeding maximum power
2400W at 70˚C for 10 sec ∆R = 0.4% max
2000W at 125˚C bottom case temperature resp. 60°C heat sink temp
120 A
7kVrms/50Hz/500VA , test time 1 min between case and terminal
up to 12kV normwave (1.5/50 μsec)
4kVrms < 10pC
10GΩ min at 1000V
>42mm min
>14mm min
≥80nH typical, measuring frequecy 10kHz
≥120pF typical, measuring frequecy 10kHz
≥40pF typical, measuring frequecy 10kHz
-55˚C to +150˚C
1.8 Nm to 2Nm
1.6Nm to 1.8 Nm M4 screws
~120 g
Derating Curve
Derating (thermal resist.)FPA2K: 66.6 W/K (0.015K/W)
Power Rating:2000 W at 125°C bottom case temperture.
Best results can be reached by using a thermal conduction to
the heatsink R
th
-cs<0.025˚K/W, which can be reached by using
thermal transfer compound with a head conductivity of 1W/mK
The flatness of the cooling plate must be better than 0.05mm
overall. The roughness of the surface should not exceed 6.4μm