MDS-JB930 SERVICE MANUAL US Model Canadian Model AEP Model UK Model Photo: Black model U.S. and foreign patents licensed form Dolby Laboratories Licensing Corporation.
SELF-DIAGNOSIS FUNCTION The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codes which show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to the following box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure for using the Self-Diagnosis Function (Error History Display Mode)”.
ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS Selecting the Test Mode Display Details of History total rec Displays the recording time. Displayed as “rππππππh”. The displayed time is the total time the laser is set to the high power state. This is about 1/4 of the actual recording time. The time is displayed in decimal digits from 0h to 65535h. total play Displays the play time. Displayed as “pππππππh”. The time displayed is the total actual play time. Pauses are not counted.
SECTION 1 SERVICING NOTES TABLE OF CONTENTS SELF-DIAGNOSIS FUNCTION .................................... 2 1. SERVICING NOTES ............................................... 4 2. GENERAL ................................................................... 11 3. DISASSEMBLY ......................................................... 13 4. TEST MODE .............................................................. 17 5. ELECTRICAL ADJUSTMENTS ......................... 22 6. DIAGRAMS 6-1.
CAUTION Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Discard used batteries according to the manufacturer’s instructions. ADVARSEL! Lithiumbatteri-Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1.
JIG FOR CHECKING BD BOARD WAVEFORM The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be performed are shown as follows.
IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC171 OF BD BOARD) ARE REPLACED The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need to look at the value on the optical pick-up label. When replacing the optical pick-up or non-volatile memory (IC171 of BD board), record the IOP value on the optical pick-up according to the following procedure. Record Procedure: 1.
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”. Criteria for Determination (Unsatisfactory if specified value is not satisfied) Measure if unsatisfactory: • 0.9 mW power Specified value : 0.84 to 0.92 mW • 7.0 mW power Specified value : 6.8 to 7.
RETRY CAUSE DISPLAY MODE • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit. • The following will be displayed : During recording and stop : Retry cause, number of retries, and number of retry errors. During playback : Information such as type of disc played, part played, copyright.
Reading the Retry Cause Display Higher Bits Lower Bits HexaHexadecimal 8 4 2 1 8 4 2 1 decimal Bit b7 b6 b5 b4 b3 b2 b1 b0 Binary Details When 1 When 0 0 0 0 0 0 0 0 1 01 Emphasis OFF Emphasis ON 0 0 0 0 0 0 1 0 02 Monaural Stereo 0 0 0 0 0 1 0 0 04 0 0 0 0 1 0 0 0 08 This is 2-bit display. Normally 01. 01:Normal audio.
SECTION 2 GENERAL This section is extracted from instruction manual.
SECTION 3 DISASSEMBLY Note: Follow the disassembly procedure in the numerical order given.
MAIN BOARD 1 connector (CN700) 3 two screws (BVTP2.6 × 8) 2 wire (flat type) (21 core) (MAIN-BD) (CN402) 2 wire (flat type) (21 core) (MAIN-DISP) (CN800) 1 connector (CN200) 3 three screws (BVTP2.6 × 8) 2 wire (flat type) (23 core) (CN400) 1 connector (CN801) 3 seven screws (BVTP3 × 8) 4 MAIN board MECHANISM DECK (MDM-5D) 4 four step screws (BVTTWH M3) 2 connector (CN401) 5 Remove the mechanism deck (MDM-5D) to direction of the arrow.
SLIDER (CAM) 7 slider (Cam) • Note for Installation of Slider A (Cam) Set the shaft of Cam gear to be at the position in the figure. 4 bracket (Guide L) 1 two screws (P2.6x6) 2 harness Set the shaft of Lever (O/C) to be at the position in the figure. 3 leaf spring 5 two screws (P2.6x6) 6 bracket (Guide R) BASE UNIT (MBU-5D), BD BOARD 2 base unit (MBU-5D) 5 flexible board (CN104) 6 flexible board (CN101) 1 three screws (P2.6 × 6) 7 BD board 4 screw (M1.7 × 4) 3 Remove the solder (Seven portion).
SW BOARD, LOADING MOTOR (M103) 1 screw (PTPWH M2.6 × 6) 2 gear B 3 two screws (PWH1.7 × 4) 4 loading motor (M103) 6 SW board 5 three screws (BTP2.
SECTION 4 TEST MODE 1. PRECAUTIONS FOR USE OF TEST MODE • As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it. Even if the [EJECT § ] button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop rotating. Therefore, it will be ejected while rotating.
5. SELECTING THE TEST MODE There are 31 types of test modes as shown below. The groups can be switched by turning the [ ≠ AMS ±] knob. After selecting the group to be used, press the [YES] button. After setting a certain group, turn the [ ≠ AMS ±] knob switches between these modes. Refer to “Group” in the table for details can be selected. All items used for servicing can be treated using group S. So be carefully not to enter other groups by mistake. Display No.
5-1. Operating the Continuous Playback Mode 1. Entering the continuous playback mode (1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.) (2) Turn the [ ≠ AMS ±] knob and display “CPLAY MODE” (C30). (3) Press the [YES] button to change the display to “CPLAY MID”. (4) When access completes, the display changes to “C = AD = ”. Note: The numbers “ ” displayed show you error rates and ADER. 2.
6. FUNCTIONS OF OTHER BUTTONS Function Contents · Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns ON/OFF. p Stops continuous playback and continuous recording. ) The sled moves to the outer circumference only when this is pressed. 0 The sled moves to the inner circumference only when this is pressed. SCROLL Switches between the pit and groove modes when pressed. PLAY MODE Switches the spindle servo mode (CLV-S ˜ CLV-A).
MEANINGS OF OTHER DISPLAYS Contents Display When Off When Lit ( During continuous playback (CLV: ON) STOP (CLV: OFF) P Tracking servo OFF Tracking servo ON REC Recording mode ON Recording mode OFF SYNC CLV low speed mode CLV normal mode A.
SECTION 5 ELECTRICAL ADJUSTMENTS 1. PARTS REPLACEMENT AND ADJUSTMENT • Check and adjust the mechanism deck as follows. The procedure changes according to the part replaced • Abbreviation OP : Optical pick-up OWH : Overwrite head • Temperature compensation offset check • Laser power check • Traverse check • Focus bias check • C PLAY check • Self-recording/playback check OK NG Check the sled and spindle mechanisms. Other causes can be suspected.
2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSION To check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight. 3. PRECAUTIONS FOR USE OF OPTICAL PICK-UP (KMS-260A) As the laser diode in the optical pick-up is easily damaged by static electricity, solder the laser tap of the flexible board when using it. Before disconnecting the connector, desolder first. Before connecting the connector, be careful not to remove the solder.
6. CHECK PRIOR TO REPAIRS These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjustments” (See page 8). 6-1. Temperature Compensation Offset Check When performing adjustments, set the internal temperature and room temperature of 22 °C to 28 °C. Checking Procedure: 1. Turn the [ ≠ AMS ± ] knob to display “TEMP CHECK” (C01). 2. Press the [YES] button. 3.
9. Press the [YES] button to display “EFB = MO-P”. Then, the optical pick-up moves to the pit area automatically and servo is imposed. 10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not turn the [≠ AMS ± ] knob. Traverse Waveform A VC B Specified value : Below 10% offset value Offset value (%) = IA – BI X 100 2 (A + B) 11. Press the [YES] button to display “EF MO CHECK” The disc stops rotating automatically. 12.
7. INITIAL SETTING OF ADJUSTMENT VALUE 9. TEMPERATURE COMPENSATION OFFSET ADJUSTMENT Note: Mode which sets the adjustment results recorded in the non-volatile memory to the initial setting value. However the results of the temperature compensation offset adjustment will not change to the initial setting value. If initial setting is performed, perform all adjustments again excluding the temperature compensation offset adjustment. For details of the initial setting, refer to “4.
7. Then, turn the [≠ AMS ±] knob to display “LDPWR CHECK” (C02). 8. Press the [YES] button once to display “LD 0.9 mW $ ”. Check that the reading of the laser power meter become 0.85 to 0.91 mW. 9. Press the [YES] button once more to display “LD 7.0 mW $ ”. Check that the reading the laser power meter and digital voltmeter satisfy the specified value. Note down the digital voltmeter reading value. Specified Value: Laser power meter reading : 7.0 ± 0.
8. Turn the [ ≠ AMS ±] knob so that the waveform of the oscilloscope becomes the specified value. of “EFB(When the [≠ AMS ± ] knob is turned, the ” changes and the waveform changes.) In this adjustment, waveform varies at intervals of approx. 2%. Adjust the waveform so that the specified value is satisfied as much as possible. (Write power traverse adjustment) Traverse Waveform A VC B Specification A = B 9. Press the [YES] button, and save the adjustment results in the non-volatile memory.
13. ERROR RATE CHECK 15. AUTO GAIN CONTROL OUTPUT LEVEL ADJUSTMENT 13-1. CD Error Rate Check Checking Procedure : 1. Load the check disc (MD) TDYS-1. 2. Turn the [ ≠ AMS ± ] knob and display “CPLAY MODE” (C30). 3. Press the [YES] button twice and display “CPLAY MID”. 4. The display changes to “C = AD = ”. 5. Check that the C1 error rate is below 20. 6. Press the [MENU/NO] button to stop playback, then press the [EJECT § ] button and take out the check disc.
Adjustment Location: – BD BOARD (Side A) – CN101 D101 GND I+3V IOP CN110 TEO RF VC NOTE IC171 – BD BOARD (Side B) – IC101 IC121 IC192 Note: It is useful to use the jig for checking the waveform.
MDS-JB930 SECTION 6 DIAGRAMS DIGITAL SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER, SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER IC121 (1/2) 60 FILTER SCTX 59 62 61 46 40 RF AGC & EQ B.P.F.
MDS-JB930 6-2. BLOCK DIAGRAM – MAIN Section – A/D CONVERTER IC100 ADDT 13 BCK LRCK HIGH-PASS FILTER, DIGITAL ATTENUATOR SDTO BICK 12 LRCK 11 AUDIO INTERFACE CONTROLLER CDTI 15 CCLK 16 CS 17 CONTROL REGISTER INTERFACE SUBTRACKTION A/D CONVERTER BLOCK AINR LINE AMP IC103 3 2 ROTARY ENCODER RV760 CLOCK GENERATOR, CLOCK DIVIDER XTI TIMING CONTROL INIT CLOCK BUFFER (Page 31) X801 32.
6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS (In addition to this, the necessary note is printed in each block) Note on Printed Wiring Board: • X : parts extracted from the component side. • Y : parts extracted from the conductor side. ® • : Through hole. • b : Pattern from the side which enables seeing. Caution: Pattern face side: (Side B) Parts face side: (Side A) Parts on the pattern face side seen from the pattern face are indicated.
• Circuit Boards Location AC board SW board BAT board HP board KEY board PSW board BD board MAIN board DISP board VOL board 34
MDS-JB930 6-4. PRINTED WIRING BOARD – BD Board – • See page 34 for Circuit Boards Location. S102 REFLECT DET, PROTECT DET LOW REFLECT RATE/ UNPROTECT (SLIDE) HIGH REFLECT RATE/ WRITE PROTECT RED (SPINDLE) BLK (Page 43) • Semiconductor Location Ref. No. Location D101 D181 D183 A-1 D-3 D-3 IC103 IC123 IC171 B-1 D-2 D-1 Q102 Q103 Q104 B-1 C-1 B-1 • Semiconductor Location Ref. No.
MDS-JB930 6-5. SCHEMATIC DIAGRAM – BD Board (1/2) – (Page 37) • See page 48 for Waveforms. • See page 49 for IC Block Diagrams.
MDS-JB930 6-6. SCHEMATIC DIAGRAM – BD Board (2/2) – • See page 48 for Waveforms. • See page 50 for IC Block Diagrams. (Page 36) (Page 36) (Page 36) (Page 36) (Page 39) (Page 40) Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : STOP ( ) : PLAY < > : REC : Impossible to measure ∗ The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified.
MDS-JB930 6-7. SCHEMATIC DIAGRAM – SW Board – (Page 40) 6-8. PRINTED WIRING BOARD – SW Board – • See page 34 for Circuit Boards Location.
MDS-JB930 Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : PLAY 6-9. SCHEMATIC DIAGRAM – MAIN (1/3)/BAT Boards – • See page 51 for IC Block Diagrams.
MDS-JB930 Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : PLAY 6-10. SCHEMATIC DIAGRAM – MAIN Board (2/3) – • See page 48 for Waveform.
MDS-JB930 Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : PLAY 6-11. SCHEMATIC DIAGRAM – MAIN Board (3/3) – • See page 48 for Waveforms. • See page 51 for IC Block Diagrams.
MDS-JB930 6-12. PRINTED WIRING BOARD – MAIN Board (Side A) – 42 42 • See page 34 for Circuit Boards Location.
MDS-JB930 6-13. PRINTED WIRING BOARDS – MAIN Board (Side B), BAT Board – • See page 34 for Circuit Boards Location. (Page 44) (Page 38) (Page 35) (Page 35) • Semiconductor Location (Side B) (Page 46) (Page 46) (Page 46) Ref. No.
MDS-JB930 6-14. PRINTED WIRING BOARD – AC Board – • See page 34 for Circuit Boards Location. • Semiconductor Location (Side B) Ref. No.
MDS-JB930 6-15. SCHEMATIC DIAGRAM – AC Board – (Page 39) Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : PLAY The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified. 45 45 Les composants identifiés par une marque ! sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.
MDS-JB930 6-16. PRINTED WIRING BOARDS – PANEL Section – • See page 34 for Circuit Boards Location. (Page 43) • Semiconductor Location – DISP Board – Ref. No. Location IC761 IC771 B-12 A-9 Q781 Q782 C-5 C-5 • Semiconductor Location – PSW Board – Ref. No.
MDS-JB930 Note on Schematic Diagram: • Voltages and waveforms are dc with respect to ground under no-signal conditions. no mark : STOP 6-17. SCHEMATIC DIAGRAM – PANEL Section – • See page 48 for Waveforms.
• Waveforms – BD board – – MAIN board – – DISP board – 5 IC121 @¶ (LRCK) 1 IC101 1, 2 (I, J) (Play mode) 44.1 kHz 0.06Vp-p 11.29 MHz 45.158 MHz 176.4 kHz 8 IC800 !¡ (XT-OUT) 4.6 Vp-p 3.2 Vp-p 3.1 Vp-p 3.4 Vp-p 2.841 MHz 4 IC200 $£ (256FSO) 3.5 Vp-p 11.36 MHz 32.768 kHz 48 48 1.6 Vp-p 2.1 MHz 7 IC100 !™ (BICK) 44.6 MHz 8 IC121 (º (FS4) 2.618 MHz 3.6 Vp-p 4.9 Vp-p 3.8 Vp-p 3.6 Vp-p 2 IC771 ^∞ (OSCI) 43.86 kHz 3 IC200 @• (XOUT) 7 IC121 @ª (FS256) 4 IC121 !§ (OSI) 3.
• IC Block Diagrams – BD Board – – + RF AGC RF PEAK 44 43 42 41 40 39 38 37 USROP RF AGC + – EQ USRC DET + – RFA1 AGCI 45 COMPO 46 COMPP OPN 47 ADDC RFO 48 OPO MORFI CXA2523AR MORFO IC101 EQ BPF3T RFA2 I J 1 –1 – –2 – 2 RFA3 HLPT –1 CVB IVR WBL TEMP PEAK –2 BOTTOM GRVA PBSW WBL 35 ABCD 34 FE – – – – AA 36 BOTM PBH –1 GRV + – 4 3T PTGR – 1 – –2 – + A 3 P-P –2 OFST VC AUX SW PEAK3T 3T 33 AUX BPFC ABCDA 32 ADFG B + – 5 IVR C 31 ADAGC BB
MNT1 2 DCHG APC ADFG F0CNT XLRF CKRF DTRF APCREF LDDR TRDR TFDR PWM GENERATOR EACH BLOCK MONITOR CONTROL MNT2 3 DVDD 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 SPINDLE SERVO MNT0 1 FFDR FRDR FS4 SRDR SFDR SPRD 94 93 AUTO SEQUENCER 100 99 98 97 96 95 SPFD FGIN TEST1 TEST2 TEST3 DVSS CXD2656R EFMO IC121 75 TE 74 SE 73 AVSS MNT3 4 72 ADRB ADIP DECODER 71 ADRT 70 AVDD SWDT 5 69 ADIO SCLK 6 EACH BLOCK CPU I/F XLAT 7 SRDT 8 68 VC SERVO DSP SENS 9 A/D CONVERT
– MAIN Board – IC100 VCOM AINR AK4524-TP IC203, 204 1 AOUTR+ AOUTR– AOUTL+ AOUTL– AINL 3 28 27 26 25 VREF AGND 4 5 6 7 24 DGND 23 VD 22 VT XTAO 8 XTAI 9 XTALE 10 LRCK BICK SDTO SDTI I01+ I02– NC I01– I02+ NC VCC2 C2 C1 2 A/D CONVERTER BLOCK VA TEST CXA8042AS REFERENCE VOLTAGE CIRCUIT 21 CLKO 20 M/S 19 PD H.P.F.
CXD8735N-TP BCKI 2 DATA1 3 56 INVI OVERFLOW DETECTER FIR1 LRCKI 55 TEST OR FIR2 FIR3 IIR 4 54 128FsO D/F TIMNG CIRCUIT 1 ATT INVO S/P IC200 53 DINIT FIR4 6 SHIFT 7 LATCH “0” DETECT MUTE CIRCUIT ATT 52 OVFLAG OVERFLOW DETECTER ATT 5 MODE INIT FIR1 FIR2 FIR3 IIR 8 51 MUTEL 50 MUTER 49 NU FIR4 SYSM 9 48 64FSI NU 10 3rd order NOISE SHAPER DVSS1 12 REGISTER NU 11 NU 14 47 MCKIN ATT X0.75 46 DVSS1 DITHER 45 DVDD1 3rd order NOISE SHAPER DVDD1 13 L.I.P L.I.
IC700 PH5 LA5632 1 IC701 GND M5293L 2 + 5k – STBY 2 VCC 3 ANA5 4 5 ON/OFF B.BAK AC 7 CD1 8 P. DOWN 9 4 – + REFERENCE VOLTAGE 3 OUT – OVERHEAT PROTECTION IN + 6 REFERENCE VOLTAGE 27k + + – SYS3.3 5 – OVERCURRENT LIMITTER 1 3.3V DELAY CIRCUIT – + GND 10 CD2 11 S.
6-18. IC PIN FUNCTION DESCRIPTION • BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Description 1 I I I-V converted RF signal I input from the optical pick-up block detector 2 J I I-V converted RF signal J input from the optical pick-up block detector 3 VC O Middle point voltage (+1.
• BD BOARD IC121 CXD2656R (DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO PROCESSOR, EFM/ACIRC ENCODER/DECODER, SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER) Pin No.
Pin No.
Pin No. Pin Name I/O Description 89 FRDR O Focus servo drive PWM signal (–) output to the BH6511FS (IC152) 90 FS4 O Clock signal (176.
• MAIN BOARD IC800 M30624MG-208FP (SYSTEM CONTROLLER) Pin No.
Pin No.
Pin No.
SECTION 7 EXPLODED VIEWS NOTE: • -XX and -X mean standardized parts, so they may have some difference from the original one. • Color Indication of Appearance Parts Example: KNOB, BALANCE (WHITE) . . . (RED) ↑ ↑ Parts Color Cabinet's Color • Abbreviation CND : Canadian model (1) • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items.
(2) FRONT PANEL SECTION not supplied 57 57 59 74 58 not supplied supplied with J790 73 58 68 58 supplied with RV790 69 67 61 65 58 62 60 58 67 53 not supplied 63 54 66 52 57 64 55 supplied with RV760 70 72 71 51 56 75 57 Ref. No. Part No.
(3) MECHANISM SECTION (MDM-5D) 224 213 211 212 217 218 213 207 221 210 203 214 215 219 208 209 220 #7 #7 222 216 223 not supplied 207 203 225 M103 202 #7 226 206 201 204 205 #6 MBU-5D #7 Ref. No. Part No.
(4) BASE UNIT SECTION (MBU-5D) 252 #3 265 264 HR901 266 271 #4 263 267 #3 270 268 #3 269 not supplied 262 272 #3 255 261 #3 not supplied 256 #5 259 M101 260 #4 S102 258 not supplied 254 #3 257 #3 252 253 M102 251 252 The components identified by mark ! or dotted line with mark ! are critical for safety. Replace only with part number specified. Ref. No. Part No. Description Remark Ref. No. Les composants identifiés par une marque ! sont critiques pour la sécurité.
SECTION 8 ELECTRICAL PARTS LIST NOTE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX and -X mean standardized parts, so they may have some difference from the original one. • RESISTORS All resistors are in ohms. METAL: Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F: nonflammable • Abbreviation CND : Canadian model Ref. No. Part No.
BD Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < IC/TRANSISTOR > C118 C119 C121 C122 C123 1-163-038-00 1-125-822-11 1-125-822-11 1-163-021-11 1-163-038-00 CERAMIC CHIP TANTALUM TANTALUM CERAMIC CHIP CERAMIC CHIP 0.1uF 10uF 10uF 0.01uF 0.1uF C124 C127 C128 C129 C130 1-163-038-00 1-163-038-00 1-163-021-11 1-107-823-11 1-163-251-11 CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP CERAMIC CHIP 0.1uF 0.1uF 0.01uF 0.
BD Ref. No. Part No. Description Remark R131 1-216-073-00 METAL CHIP 10K 5% 1/10W R132 R133 R134 R135 R136 1-216-097-00 1-216-117-00 1-216-049-11 1-216-061-00 1-216-049-11 RES, CHIP METAL CHIP RES, CHIP METAL CHIP RES, CHIP 100K 680K 1K 3.
DISP Ref. No. HP KEY MAIN Part No. Description Remark R770 R771 R772 R773 R774 1-249-417-11 1-249-417-11 1-247-843-11 1-247-807-31 1-247-807-31 CARBON CARBON CARBON CARBON CARBON 1K 1K 3.
MAIN Ref. No. Part No. Description C118 C119 C120 C121 1-124-995-11 1-126-049-11 1-164-159-11 1-164-159-11 ELECT ELECT CERAMIC CERAMIC 220uF 22uF 0.1uF 0.1uF 20% 20% Remark C122 C123 C124 C127 C128 1-124-995-11 1-164-159-11 1-126-022-11 1-130-471-00 1-126-023-11 ELECT CERAMIC ELECT MYLAR ELECT 220uF 0.1uF 47uF 0.001uF 100uF 20% C129 C130 C131 C132 C135 1-126-023-11 1-110-335-11 1-110-335-11 1-126-022-11 1-164-159-11 ELECT MYLAR MYLAR ELECT CERAMIC 100uF 100PF 100PF 47uF 0.
MAIN Ref. No. Part No. Description C701 C702 C703 C704 1-126-925-11 1-161-494-00 1-164-159-11 1-126-927-11 ELECT CERAMIC CERAMIC ELECT 470uF 0.022uF 0.1uF 2200uF Remark C705 C706 C707 C708 C709 1-164-159-11 1-117-850-11 1-126-964-11 1-164-159-11 1-126-939-11 CERAMIC ELECT ELECT CERAMIC ELECT 0.1uF 15000uF 10uF 0.1uF 10000uF C710 C711 C712 C713 C714 1-126-969-11 1-164-159-11 1-128-554-11 1-164-159-11 1-164-159-11 ELECT CERAMIC ELECT CERAMIC CERAMIC 220uF 0.1uF 330uF 0.1uF 0.
MAIN Ref. No. Part No.
MAIN Ref. No. Part No.
MAIN Ref. No. Part No. Description Remark R847 R848 1-249-429-11 CARBON 1-249-429-11 CARBON 10K 10K 5% 5% 1/4W 1/4W R849 R850 R851 R852 R853 1-249-425-11 1-249-429-11 1-249-425-11 1-249-393-11 1-249-426-11 CARBON CARBON CARBON CARBON CARBON 4.7K 10K 4.7K 10 5.6K 5% 5% 5% 5% 5% 1/4W 1/4W 1/4W 1/4W 1/4W R854 R855 R856 R857 R858 1-249-429-11 1-249-425-11 1-249-429-11 1-249-441-11 1-249-429-11 CARBON CARBON CARBON CARBON CARBON 10K 4.
MDS-JB930 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark ************** HARDWARE LIST ************** #1 #2 #3 #4 #5 7-685-646-79 7-685-885-09 7-621-772-20 7-621-772-40 7-627-852-08 SCREW +BVTP 3X8 TYPE2 TT(B) SCREW +BVTT 4X16 (S) SCREW +B 2X5 SCREW +B 2X8 SCREW, PRECISION +P 1.7X2.5 #6 7-685-533-19 SCREW +BTP 2.6X6 TYPE2 N-S #7 7-685-133-19 SCREW (DIA. 2.
