Datasheet

MF-MSMF Series - PTC Resettable Fuses
A
B
C
Top and Bottom View Side View
D
Top View
Style 2
Style 1
Bottom View Side View Recommended Pad Layout
8
C
A
B
D
C
2.95 ± 0.10
(.114 ± .004)
3.1 ± 0.10
(.122 ± .004)
1.68 ± 0.05
(.066 ± .002)
Recommended Pad Layout
3.2 ± 0.1
(0.126 ± .004)
2.7 ± 0.1
(.106 ± .004)
1.5 ± 0.05
(.059 ± .002)
1.5 ± 0.05
(.059 ± .002)
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au nish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Product Dimensions (see previous page for dimensions)
Typical Time to Trip at 23 ˚C
0.001
0.01
0.1
1
10
100
0.1 1 10 100
MF-MSMF020
MF-MSMF030
MF-MSMF200
MF-MSMF014
MF-MSMF010
MF-MSMF050
MF-MSMF075
MF-MSMF075/24
MF-MSMF110
MF-MSMF110/16
MF-MSMF125
MF-MSMF150
MF-MSMF160
MF-MSMF260
Fault Current (Amps)
Time to Trip (Seconds)
The Time to Trip curves represent typical
performance of a device in a simulated
application environment. Actual performance
in specifi c customer applications may differ
from these values due to the infl uence of
other variables.
Specifi cations are subject to change without notice.
Users should verify actual device performance in their specifi c applications.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.