Product Specs

晶訊科技股份有限公司 8F, No. 150, Jian Yi Road, Zhonghe District,
CC&C Technologies, Inc. New Taipei City, Taiwan 235, R.O.C.
Tel: [phone] Fax: [phone]
12
Reference Temperature Reflow Chart
This module is surface mount device; please refer below conditions for drying before
solder reflow processes. (extracted from IPC/JEDEC J-STD-033B.1)
Bake @ 125
o
C Bake @ 90
o
C Bake @ 40
o
C
Exceeding
floor Life
By > 72h
Exceeding
floor Life
By ≤ 72h
Exceeding
floor Life
By > 72h
Exceeding
floor Life
By ≤ 72h
Exceeding
floor Life
By > 72h
Exceeding
floor Life
By ≤ 72h
9 hours
7 hours 33 hours 23 hours 13 days 9 days