Specifications

Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
4.2 Mounting EXSx2-W onto the Application Platform
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4.2 Mounting EXSx2-W onto the Application Platform
This section describes how to mount EXSx2-W onto the PCBs, including land pattern and sten-
cil design, board-level characterization, soldering conditions, durability and mechanical han-
dling. For more information on issues related to SMT module integration see also [5].
Note: To avoid short circuits between signal tracks on an external application's PCB and vari-
ous markings at the bottom side of the module (see Figure 53), it is recommended not to route
the signal tracks on the top layer of an external PCB directly under the module, or at least to
ensure that signal track routes are sufficiently covered with solder resist.
Note: Do not place external components or devices that might cause any pressure on the mod-
ule’s shielding. See [4] and [5] for further details of thermal and integration guidance.
4.2.1 SMT PCB Assembly
4.2.1.1 Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Thales characterizations for
lead-free solder paste on a four-layer test PCB and a 120 respectively 150 micron thick stencil.
The land pattern given in Figure 54 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 2.1.1).
Figure 54: Land pattern (top view)