Specifications

Table Of Contents
Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
4.2 Mounting EXSx2-W onto the Application Platform
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The stencil design illustrated in Figure 55 and Figure 56 is recommended by Thales as a result
of extensive tests with Thales Daisy Chain modules.
The central ground pads are primarily intended for stabilizing purposes, and may show some
more voids than the application interface pads at the module's rim. This is acceptable, since
they are electrically irrelevant.
Figure 55: Recommended design for 120µm micron thick stencil (top view)
Figure 56: Recommended design for 150µm micron thick stencil (top view)