Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
4.2 Mounting EXSx2-W onto the Application Platform
119
t EXS62-W_EXS82-W_HID_v01.200ee 2022-09-02
Public/ Released
Page 109 of 144
4.2.3.2 Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 15 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
EXSx2-W is specified for one soldering cycle only. Once EXSx2-W is removed from the appli-
cation, the module will very likely be destroyed and cannot be soldered onto another applica-
tion.
Table 29: Reflow temperature ratings
1
1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-
dard IPC/JEDEC J-STD-020E, and are as such meant as a general guideline. For more information on
reflow profiles and their optimization please refer to [5].
Profile Feature Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
Smin
)
Temperature Maximum (T
Smax
)
Time (t
Smin
to t
Smax
) (t
S
)
150°C
180°C
60-120 seconds
Average ramp up rate (T
Smax
to T
P
) 3K/second max.
2
2. Temperatures measured on shielding at each corner. For more information see [5].
During the critical ramp-down phase, (T
P
to 200°C), temperature differences between sensors (1,2,3,4)
should be as low as possible.
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
50-90 seconds
Peak package body temperature (T
P
)245°C +0/-5°C
Time (t
P
) within 5 °C of the peak package body
temperature (T
P
)
30 seconds max.
2
Limited ramp-down rate (T
P
-200°C)
Average ramp-down rate from 200°C
1.5K-2.5K/second max.
2,
3
3K/second max.
2
3. Lowest ramp-down rate achievable is also dependent on reflow oven tape and settings used. Use lowest
ramp down rate from Tp- 200°C. For more information see [5].
Time 25°C to maximum temperature 8 minutes max.
1
4
2
3
Module
Temperature sensors (1-4)