Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
6.1 Revision History
140
t EXS62-W_EXS82-W_HID_v01.200ee 2022-09-02
Public/ Released
Page 134 of 144
Preceding document: "Cinterion
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EXS62-W/EXS82-W Hardware Interface Description" v00.005
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EXS62-W/EXS82-W Hardware Interface Description" v00.011
Preceding document: "Cinterion
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EXS62-W/EXS82-W Hardware Interface Description" v00.002
New document: "Cinterion
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EXS62-W/EXS82-W Hardware Interface Description" v00.005
Preceding document: "Cinterion
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EXS82-W Hardware Interface Description" Version 00.001
New document: "Cinterion
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EXS62-W/EXS82-W Hardware Interface Description" Version 00.002
Chapter What is new
2.1.1 Revised representation of pad layout.
Chapter What is new
1.2 Revised table listing key features.
2.1.2 Revised Table 2 listing signal properties.
2.1.2.1 Revised Table 3 listing absolute maximum ratings.
2.1.6 Added recommend GND pads (83/84) to Table 4. Replaced chipcard with UICC.
Revised Figure 11.
2.1.6.1 Added NUP4114 as recommended ESD diode.
2.1.11.1 Specified values for Figure 19.
2.1.11.3 Revised description. Revised Figure 21 to mention <15ms as period for a fast shutdown.
2.1.11.4 Revised description. Added SIM_SWITCH circuit as Figure 22.
2.1.11.5 Revised description.
2.2.2 Added footnote regarding KDB 447498.GNSS.
2.3.1 Added note regarding 2D over 3D measurements.
2.3.2 Added note regarding voltage supply for active GNSS antenna.
2.4 Revised description, and modified Figure 32 showing sample application.
3.2.1.1 Added V180 behavior during module switch on.
3.2.4.1 Added “^SHUTDOWN” URC during module switch off.
3.2.5.1 Completed section Thermal Shutdown.
3.4 Added note that BATT+RF is only required if using GSM.
Added note that suitable low ESR capacitors should be placed to BATT+ pads.
3.4.1 Revised section and added some initial current consumption ratings.
3.5 Revised operating temperatures in Table 24.
3.7 Revised remarks in Table 27.
7.1 Added ordering information for DSB75 Evaluation Kit.
Chapter What is new
Throughout
document
Removed support for VDDLP.
Added USB interface - to be used for tracing purposes only.
Chapter What is new