Specifications

Table Of Contents
Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
2.1 Application Interface
61
t EXS62-W_EXS82-W_HID_v01.200ee 2022-09-07
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Page 36 of 144
In case the module is mounted onto the LGA DevKit, a direct connection to the eUICC can be
achieved by bridging the following pads on the backside of the LGA DevKit: PAD 249 to 17,
PAD 248 to 19, PAD 247 to 21, PAD 246 to 20, as also shown in Figure 15.
Figure 15: Interface bridging