Specifications
Table Of Contents
- Contents
- Tables
- Figures
- 1 Introduction
- 2 Interface Characteristics
- 2.1 Application Interface
- 2.2 RF Antenna Interface
- 2.3 GNSS Interface
- 2.4 Sample Application
- 3 Operating Characteristics
- 3.1 Operating Modes
- 3.2 Power Up/Power Down Scenarios
- 3.3 Power Saving
- 3.4 Power Supply
- 3.5 Operating Temperatures
- 3.6 Electrostatic Discharge
- 3.7 Blocking against RF on Interface Lines
- 3.8 Reliability Characteristics
- 4 Mechanical Dimensions, Mounting and Packaging
- 5 Regulatory and Type Approval Information
- 6 Document Information
- 7 Appendix
Cinterion
®
EXS62-W/EXS82-W Hardware Interface Description
3.4 Power Supply
102
t EXS62-W_EXS82-W_HID_v01.200ee 2022-09-02
Public/ Released
Page 96 of 144
3.4.2 Minimizing Power Losses
For EXS62-W ResM only: When designing the power supply for your application (and with
GSM enabled) please pay specific attention to power losses. Ensure that the input voltage
V
BATT+
never drops below 3.3V on the EXSx2-W board, not even in a GSM transmit burst where
current consumption can rise (for peak values see the power supply ratings listed in Section
3.4.1).
Figure 47: Power supply limits during transmit burst
3.4.3 Measuring the Supply Voltage (V
BATT+
)
To measure the supply voltage V
BATT+
it is possible to define two reference points GND and
BATT+. GND should be the module’s shielding, while BATT+ should be a test pad on the ex-
ternal application the module is mounted on. The external BATT+ reference point has to be
connected to and positioned close to the SMT application interface’s BATT+ pads 53
(BATT+
RF
) or 5 (BATT+
BB
) as shown in Figure 48.
Figure 48: Position of reference points BATT+ and GND
Min. 3.3V
BATT+
Transmit
burst
Transmit
burst
Drop
Ripple
Reference point GND:
Module shielding
Reference point BATT+:
External test pad connected to
and positioned closely to BATT+
pad 5 or 53.
External application