A A P P E N D I X Hardware Specifications Note The terms "Unidirectional Path Switched Ring" and "UPSR" may appear in Cisco literature. These terms do not refer to using Cisco ONS 15xxx products in a unidirectional path switched ring configuration. Rather, these terms, as well as "Path Protected Mesh Network" and "PPMN," refer generally to Cisco's path protection feature, which may be used in any topological network configuration.
Appendix A Hardware Specifications A.1.2 Configurations A.1.2 Configurations The ONS 15454 can be configured as follows: • Two-fiber path protection • Path protected mesh network (PPMN) • Two-fiber bidirectional line switch ring (BLSR) • Four-fiber BLSR • Add-drop multiplexer (ADM) • Terminal mode • Regenerator mode • Hubbed rings • Multihubbed rings • Point-to-point • Linear • Linear with optical add/drop multiplexing (OADM) A.1.
Appendix A Hardware Specifications A.1.7 Alarm Interface • Hardware flow control • TCC2/TCC2P: EIA/TIA-232 DB-9 type connector A.1.7 Alarm Interface The ONS 15454 alarm interface has the following specifications: • Visual: Critical, Major, Minor, Remote • Audible: Critical, Major, Minor, Remote • Alarm contacts: 0.045 mm, –48 V, 50 mA • Backplane access: Alarm pin fields A.1.
Appendix A Hardware Specifications A.1.12 Fan Tray • Power terminals: #8-32 screw. Ring or fork type lug suitable for 10 AWG stranded conductor with a 0.375-inch maximum width. • ANSI shelf: Two 30 A fuses (customer supplied fuse and alarm panel) • HD shelf: 30 A fuse per shelf (customer supplied fuse and alarm panel) A.1.12 Fan Tray Table A-1 lists power requirements for the fan-tray assembly. Table A-1 Fan Tray Assembly Power Requirements Fan Tray Assembly Watts Amps BTU/Hr FTA2 53 1.
Appendix A Hardware Specifications A.2 SFP, XFP, and GBIC Specifications • HDTV = high definition television • CWDM = coarse wavelength division multiplexing Table A-2 SFP, XFP, and GBIC Specifications SFP/XFP Product ID Interface Transmitter Output Receiver Input Power Power Min/Max (dBm) Min/Max (dBm) 15454-SFP-LC-SX/ 15454E-SFP-LC-SX GE –9.5 to –4 –17 to 0 15454-SFP-LC-LX/ 15454E-SFP-LC-LX GE –9.5 to –3 –19 to –3 15454-SFP3-1-IR= OC-3 –15 to –8 –23 to –8 15454E-SFP-L.1.
Appendix A Hardware Specifications A.
Appendix A Hardware Specifications A.3 General Card Specifications Table A-2 SFP, XFP, and GBIC Specifications (continued) SFP/XFP Product ID Interface Transmitter Output Receiver Input Power Power Min/Max (dBm) Min/Max (dBm) ONS-SE-155-1470 through ONS-SE-155-1610 OC-3/STM-1 0 to 5 -7 to 0 ONS-SE-622-1470 through ONS-SE-622-1610 OC-12/STM-4 0 to 5 -7 to 0 ONS-SI-GE-SX GE -3 to 9.5 0 to -17 ONS-SI-GE-LX GE -3 to 9.
Appendix A Hardware Specifications A.3.1 Power Table A-3 Individual Card Power Requirements Card Type Card Name Watts Amperes BTU/Hr. Control Cards TCC2 19.20 0.4 66.8 TCC2P 27.00 0.56 92.2 XCVT 34.40 0.72 117.46 XC10G 48 1 163.68 XC-VXC-10G 67 1.4 228.62 AIC-I 4.8 0.1 15.3 AEP 3 (from +5 VDC from AIC-I) 10.2 FTA3 Fan Tray –48 VDC 129.60 2.7 442.21 FTA4 Fan Tray –48 VDC 115 2.4 393 EC1-12 36.60 0.76 124.97 DS1-14 12.60 0.26 43.02 DS1N-14 12.60 0.26 43.
Appendix A Hardware Specifications A.3.1 Power Table A-3 Individual Card Power Requirements (continued) Card Type Card Name Watts Amperes BTU/Hr. Optical Cards OC3 IR 4 19.20 0.40 65.56 OC3 IR 4/STM1 SH 1310 19.20 0.40 65.56 OC3 IR 4/STM1SH 1310-8 26.00 0.48 78.5 OC12 IR 1310 10.90 0.23 37.22 OC12 LR 1310 9.28 0.2 31.68 OC12 LR 1550 9.28 0.2 31.68 OC12 LR/STM4 LH 1310 9.00 0.2 31.68 OC12 LR/STM4 LH 1550 9.28 0.2 31.68 OC12 IR/STM4 SH 1310-4 35.60 0.74 121.
Appendix A Hardware Specifications A.3.2 Temperature Table A-3 Individual Card Power Requirements (continued) Card Type Card Name Watts Amperes BTU/Hr. Storage Access Networking FC_MR-4 60 1.25 212.00 1. These cards are designated as OC192-XFP in CTC. 2. GBICs = Gigabit Interface Converters A.3.2 Temperature Table A-4 provides temperature ranges and product names for ONS 15454 cards. Note The I-Temp symbol is displayed on the faceplate of an I-Temp compliant card.
Appendix A Hardware Specifications A.3.
Appendix A Hardware Specifications A.
Appendix A Hardware Specifications A.4.2 TCC2P Card Specifications – Reference: External BITS, line, internal • Supply voltage monitoring – Both supply voltage inputs are monitored. – Normal operation: –40.5 to –56.7 V – Undervoltage: Major alarm – Overvoltage: Major alarm • Environmental – Operating temperature: –40 to +149 degrees Fahrenheit (–40 to +65 degrees Celsius) – Operating humidity: 5 to 95 percent, noncondensing – Power consumption: 26.00 W, 0.54 A at –48 V, 88.
Appendix A Hardware Specifications A.4.3 XCVT Card Specifications • Dimensions – Height: 12.650 in. (321.3 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.000 in. (228.6 mm) – Depth with backplane connector: 9.250 in. (235 mm) – Weight not including clam shell: 1.5 lb (0.7 kg) A.4.
Appendix A Hardware Specifications A.4.5 XC-XVC-10G Card Specifications A.4.5 XC-XVC-10G Card Specifications The XC-XVC-10G card has the following specifications: • Environmental – Operating temperature: I-Temp (15454-XC-VXC-10G-T): –40 to 149 degrees Fahrenheit (–40 to +65 degrees Celsius) – Operating humidity: 5 to 85 percent, noncondensing – Power consumption: 60 W, 1.25 A, 204.73 BTU/hr • Dimensions – Height: 12.650 in. (321.3 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.000 in. (228.
Appendix A Hardware Specifications A.4.7 AEP Specifications – Orderwire party line – Dual tone multifrequency (DTMF) signaling • User data channel (UDC) – Bit rate: 64 kbps, bidirectional – ITU-T G.
Appendix A Hardware Specifications A.5 Electrical Card Specifications – Termination: 50-pin AMP champ connector • Alarm outputs – Number of outputs: 16 – Switched by opto MOS – Triggered by definable alarm condition – Maximum allowed open circuit voltage: 60 VDC – Maximum allowed closed circuit current: 100 mA – Termination: 50-pin AMP champ connector • Environmental – Overvoltage protection: as in ITU-T G.
Appendix A Hardware Specifications A.5.2 DS1-14 and DS1N-14 Card Specifications – Bit rate: 51.84 Mbps +/– 20 ppm – Frame format: SONET – Line code: B3ZS – Termination: Unbalanced coaxial cable – Input impedance: 75 ohms +/–5 percent – Cable loss: Max 450 feet 734A, RG-59, 728A/Max 79 feet RG-179 – AIS: TR-TSY-000191 compliant – Power level: –1.8 +/– 5.7 dBm – Pulse shape: ANSI T1.102-1988 Figure 8 – Pulse amplitude: 0.36 to 0.
Appendix A Hardware Specifications A.5.3 DS1/E1-56 Card Specifications • Output – Bit rate: 1.544 Mbps +/– 32 ppm – Frame format: Off, SF (D4), ESF – Line code: AMI, B8ZS – Termination: Wire-wrap, AMP Champ – Input impedance: 100 ohms – Cable loss: Max 655 feet ABAM #22 AWG – AIS: TR-TSY-000191 compliant – Power level: 12.5 to 17.9 dBm centered at 772 KHz, –16.4 to –11.1 dBm centered at 1544 KHz – Pulse shape: Telcordia GR-499-CORE Figure 9-5 – Pulse amplitude: 2.4 to 3.
Appendix A Hardware Specifications A.5.4 DS3/EC1-48 Card Specifications – Line code: AMI, B8ZS (DS-1); HDB3 (E1) – Termination: Balanced, twisted pair, #22/24 AWG – Input impedance: 100 ohms +/– 5 percent (DS1); 120 ohms =/–5% (E1) – Cable loss: Max 655 feet ABAM #22/24 AWG (DS1); Compliant per ITU-T G.703 (E1) – AIS: TR-TSY-000191 compliant • Output – Bit rate: 1.544 Mbps ± 32 ppm (DS-1); 2.
Appendix A Hardware Specifications A.5.5 DS3-12 and DS3N-12 Card Specifications – Frame format: DS-3 ANSI T1.107-1988 – Line code: B3ZS – Termination: Unbalanced coaxial cable – Input impedance: 75 ohms +/–5 percent – Cable loss: Max 450 feet with 734A or 728A, Max 79 feet with RG-179 – AIS: TR-TSY-000191 compliant • Output – Bit rate: 44.736 Mbps +/– 20 ppm – Frame format: DS-3 ANSI T1.
Appendix A Hardware Specifications A.5.5 DS3-12 and DS3N-12 Card Specifications – Bit rate: 44.736 Mbps +/– 20 ppm – Frame format: DS-3 ANSI T1.107-1988 – Line code: B3ZS – Termination: Unbalanced coaxial cable – Input impedance: 75 ohms +/–5 percent – Cable loss: Max 450 feet 734A, RG-59, 728A/Max 79 feet RG-179 – AIS: TR-TSY-000191 compliant • Output – Bit rate: 44.736 Mbps +/– 20 ppm – Frame format: DS-3 ANSI T1.
Appendix A Hardware Specifications A.5.6 DS3i-N-12 Card Specifications A.5.6 DS3i-N-12 Card Specifications The DS3i-N-12 card has the following specifications: • Input – Bit rate: 44.736 Mbps +/–20 ppm – Frame format: ITU-T G.704, ITU-T G.752/DS-3 ANSI T1.107-1988 – Line code: B3ZS – Termination: Unbalanced coaxial cable – Input impedance: 75 ohms +/– 5 percent – Cable loss: Maximum 137 m (450 ft): 734A, RG59, 728A Maximum 24 m (79 ft): RG179 – AIS: ITU-T G.704 compliant • Output – Bit rate: 44.
Appendix A Hardware Specifications A.5.7 DS3-12E and DS3N-12E Card Specifications – Depth with backplane connector: 9.250 in. (235 mm) – Weight not including clam shell: 1.9 lb (0.8 kg) A.5.7 DS3-12E and DS3N-12E Card Specifications The DS3-12E and DS3N-12E cards have the following specifications: • Input – Bit rate: 44.736 Mbps +/– 20 ppm – Frame format: DS-3 ANSI T1.
Appendix A Hardware Specifications A.5.8 DS3XM-12 Card Specifications • Power consumption: 26.80 W, 0.56 A, 91.51 BTU/hr • Dimensions – Height: 12.650 in. (321.3 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.000 in. (228.6 mm) – Depth with backplane connector: 9.250 in. (235.0 mm) – DS3-12E card weight: 1.8 lb (0.8 kg) – DS3N-12E card weight: 1.9 lb (0.8 kg) A.5.8 DS3XM-12 Card Specifications The DS3XM-12 card has the following specifications: • Input – Bit rate: 44.
Appendix A Hardware Specifications A.5.9 DS3XM-6 Card Specifications Note The I-Temp symbol is displayed on the faceplate of an I-Temp compliant card. A card without this symbol is C-Temp compliant. • Operating humidity: 5 to 95 percent, noncondensing • Power consumption: 34 W, 0.71A at –48 V, 116.1 BTU/hr • Dimensions – Height: 12.65 in. (321.3 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.00 in. (228.6 mm) – Card weight: 1.8 lb (0.8 kg) A.5.
Appendix A Hardware Specifications A.5.10 FILLER Card Specifications – C-Temp (15454-DS3XM-6): 0 to 131 degrees Fahrenheit (0 to +55 degrees Celsius) – I-Temp (15454-DS3XM-6-T): –40 to 149 degrees Fahrenheit (–40 to +65 degrees Celsius) Note The I-Temp symbol is displayed on the faceplate of an I-Temp compliant card. A card without this symbol is C-Temp compliant. • Operating humidity: 5 to 95 percent, noncondensing • Power consumption: 20 W, 0.42 A, 68 BTU/hr • Dimensions – Height: 12.650 in.
Appendix A Hardware Specifications A.6.1 OC3 IR 4/STM1 SH 1310 Card Specifications A.6.1 OC3 IR 4/STM1 SH 1310 Card Specifications The OC3 IR 4/STM1 SH 1310 card has the following specifications: • Line – Bit rate: 155.52 Mbps – Code: Scrambled non-return to zero (NRZ) – Fiber: 1310-nm single-mode – Loopback modes: Terminal and facility – Connector: SC – Compliance: Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.2 OC3 IR/STM1SH 1310-8 Card Specifications A.6.2 OC3 IR/STM1SH 1310-8 Card Specifications The OC3 IR/STM1SH 1310-8 card has the following specifications: • Line – Bit rate: 155.52 Mbps – Code: Scrambled NRZ – Fiber: 1310-nm single-mode – Loopback modes: Terminal and facility – Connector: LC – Compliance: Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.3 OC12 IR/STM4 SH 1310 Card Specifications A.6.3 OC12 IR/STM4 SH 1310 Card Specifications The OC12 IR/STM4 SH 1310 card has the following specifications: • Line – Bit rate: 622.08 Mbps – Code: Scrambled NRZ – Fiber: 1310-nm single-mode – Loopback modes: Terminal and facility – Connectors: SC – Compliance: Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.4 OC12 LR/STM4 LH 1310 Card Specifications A.6.4 OC12 LR/STM4 LH 1310 Card Specifications The OC12 LR/STM4 LH 1310 card has the following specifications: • Line – Bit rate: 622.08 Mbps – Code: Scrambled NRZ – Fiber: 1310-nm single-mode – Loopback modes: Terminal and facility – Connectors: SC – Compliance: Telcordia SONET, Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.5 OC12 LR/STM4 LH 1550 Card Specifications A.6.5 OC12 LR/STM4 LH 1550 Card Specifications The OC12 LR/STM4 LH 1550 card has the following specifications: • Line – Bit rate: 622.08 Mbps – Code: Scrambled NRZ – Fiber: 1550-nm single-mode – Loopback modes: Terminal and facility – Connectors: SC – Compliance: Telcordia SONET, Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.6 OC12 IR/STM4 SH 1310-4 Specifications A.6.6 OC12 IR/STM4 SH 1310-4 Specifications The OC12 IR/STM4 SH 1310-4 card has the following specifications: • Line – Bit rate: 622.08 Mbps – Code: Scrambled NRZ – Fiber: 1310-nm single-mode – Loopback modes: Terminal and facility – Connector: SC – Compliance: Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.7 OC48 IR 1310 Card Specifications Note Minimum transmit power, minimum receive power, and link loss budget might exceed standard specifications. A.6.7 OC48 IR 1310 Card Specifications The OC48 IR 1310 card has the following specifications: • Line – Bit rate: 2.
Appendix A Hardware Specifications A.6.8 OC48 LR 1550 Card Specifications A.6.8 OC48 LR 1550 Card Specifications The OC48 LR 1550 card has the following specifications: • Line – Bit rate: 2.
Appendix A Hardware Specifications A.6.10 OC48 LR/STM16 LH AS 1550 Card Specifications – Code: Scrambled NRZ – Fiber: 1310-nm single-mode – Loopback modes: Terminal and facility – Connectors: SC – Compliance: Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.11 OC48 ELR/STM 16 EH 100 GHz Card Specifications – Connectors: SC – Compliance: Telcordia GR-253-CORE, ITU-T G.707, ITU-T G.
Appendix A Hardware Specifications A.6.12 OC48 ELR 200 GHz Card Specifications • Transmitter – Maximum transmitter output power: 0 dBm – Minimum transmitter output power: –2 dBm – Center wavelength accuracy: +/– 0.
Appendix A Hardware Specifications A.6.13 OC192 SR/STM64 IO 1310 Card Specifications – Transmitter: Electro-absorption laser – Dispersion tolerance: 3600 ps/nm • Receiver – Maximum receiver level: –8 dBm – Minimum receiver level: –28 dBm – Receiver: InGaAs APD photodetector – Link loss budget: 26 dB minimum, with 1 dB dispersion penalty – Receiver input wavelength range: 1520 to 1580 nm – Jitter tolerance: Telcordia GR-253/ITU-T G.
Appendix A Hardware Specifications A.6.14 OC192 IR/STM64 SH 1550 Card Specifications – Maximum receiver level: –1 dBm at BER 1 * 10 exp – 12 – Minimum receiver level: –11 dBm at BER 1 * 10 exp – 12 – Receiver: PIN diode – Link loss budget: 5 dB minimum, plus 1 dB dispersion penalty at BER = 1 * 10 exp – 12 including dispersion – Receiver input wavelength range: 1290 to 1330 nm – Dispersion tolerance: 6.
Appendix A Hardware Specifications A.6.
Appendix A Hardware Specifications A.6.16 OC192 LR/STM64 LH ITU 15xx.
Appendix A Hardware Specifications A.6.16 OC192 LR/STM64 LH ITU 15xx.xx Card Specifications In deployments with a dispersion compensation unit (DCU): +/– 1000 ps/nm, with optical signal-to-noise ration (OSNR) of 19 dB (0.5 nm resolution bandwidth [RBW]) In deployments without a DCU: +/– 1200 ps/nm, with OSNR of 23 dB (0.5 nm RBW) – Loopback modes: Terminal and facility Note You must use a 20-dB fiber attenuator (15 to 25 dB) when working with the OC192 LR/STM64 LH 15xx.xx card in a loopback.
Appendix A Hardware Specifications A.6.17 15454_MRC-12 Card Specifications – 1535.82 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1535.82 – 1536.61 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1536.61 – 1538.19 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1538.19 – 1538.98 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1538.98 – 1539.77 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1539.77 – 1540.56 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1540.56 ITU grid red band: – 1550.12 +/– 0.040 nm, OC192 LR/STM64 LH ITU 1550.12 – 1550.92 +/– 0.
Appendix A Hardware Specifications A.6.18 MRC-2.5G-4 Card Specifications – Maximum receiver level: Depends on SFP (see A.2 SFP, XFP, and GBIC Specifications, page A-4) – Minimum receiver level: Depends on SFP (see A.
Appendix A Hardware Specifications A.6.19 OC192SR1/STM64IO Short Reach Card Specifications – Minimum transmitter output power: Depends on SFP (see A.2 SFP, XFP, and GBIC Specifications, page A-4) – Center wavelength: See wavelength plan – Center wavelength accuracy: 1 nm to 4 nm, depending on SFP – Transmitter: FP and DFB laser • Receiver – Maximum receiver level: Depends on SFP (see A.2 SFP, XFP, and GBIC Specifications, page A-4) – Minimum receiver level: Depends on SFP (see A.
Appendix A Hardware Specifications A.6.
Appendix A Hardware Specifications A.7 Ethernet Card Specifications – Minimum receiver level: Depends on SFP (see A.2 SFP, XFP, and GBIC Specifications, page A-4) – Receiver input wavelength range: 1260 to 1565 nm • Environmental – Operating temperature: 32 to +131 degrees Fahrenheit (0 to +55 degrees Celsius) – Operating humidity: 5 to 95 percent, noncondensing – Power consumption: 40.00 W, 0.83 A at –48 V, 136.49 BTU/hr • Dimensions – Height: 12.650 in. (321.3 mm) – Width: 0.716 in. (18.
Appendix A Hardware Specifications A.7.3 E1000-2 Card Specifications – Operating temperature: C-Temp (15454-E100T-G): 32 to 131 degrees Fahrenheit (0 to +55 degrees Celsius) – Operating humidity: 5 to 95 percent, noncondensing – Power consumption: 65 W, 1.35 A, 221.93 BTU/hr • Dimensions – Height: 12.650 in. (321.3 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.000 in. (228.6 mm) – Card weight: 2.3 lb (1.0 kg) A.7.
Appendix A Hardware Specifications A.7.5 CE-1000-4 Card Specifications A.7.5 CE-1000-4 Card Specifications The CE-1000-4 card has the following specifications: • Environmental – Operating temperature: +23 to +131 degrees Fahrenheit (-5 to +55 degrees Celsius) – Operating humidity: 5 to 95 percent, noncondensing – Power consumption: 60 W, 1.25 A at -48 V, 204.8 BTU/hr • Dimensions – Height: 12.650 in. (321.310 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.000 in. (228.6 mm) – Card weight: 2.1 lb (0.
Appendix A Hardware Specifications A.7.8 G1K-4 Card Specifications – Depth: 9.000 in. (228.6 mm) – Depth with backplane connector: 9.250 in. (235 mm) – Weight not including clam shell: 2.3 lb (1.0 kg) A.7.8 G1K-4 Card Specifications The G1K-4 card has the following specifications: • Environmental – Operating temperature: +23 to +131 degrees Fahrenheit (–5 to +55 degrees Celsius) – Operating humidity: 5 to 95 percent, noncondensing – Power consumption: 63.00 W, 1.31 A at –48 V, 215.
Appendix A Hardware Specifications A.7.11 ML100X-8 Card Specifications – Power consumption: 49.00 W, 1.02 A at –48 V, 167.3 BTU/hr • Dimensions – Height: 12.650 in. (321.3 mm) – Width: 0.716 in. (18.2 mm) – Depth: 9.000 in. (228.6 mm) – Depth with backplane connector: 9.250 in. (235 mm) – Weight not including clam shell: 0.9 kg (2.1 lb) A.7.
Appendix A Hardware Specifications A.8 Storage Access Networking Card Specifications A.8 Storage Access Networking Card Specifications This section describes the FC_MR-4 (Fibre Channel) card specifications. For compliance information, refer to the Cisco Optical Transport Products Safety and Compliance Information document. • Fibre Channel Support: FC-0 and FC-1 layers of ANSI X3.230 FC-PH • GBIC Line Interface – Bit Rate: 1.0625 Gbit/s single-rate or 1.0625/2.
Appendix A Hardware Specifications A.8 Storage Access Networking Card Specifications Cisco ONS 15454 Reference Manual, R8.