User Manual
Table Of Contents
- Dell EMC PowerEdge R350 Technical Guide
- Contents
- System overview
- System features and generational comparison
- Chassis views and features
- Processor
- Memory subsystem
- Storage
- Networking
- Expansion cards and expansion card risers
- Power, thermal, and acoustics
- Rack, rails, and cable management
- Supported operating systems
- Dell EMC OpenManage systems management
- Dell Technologies Services
- Dell EMC ProDeploy Enterprise Suite
- Dell EMC Data Migration Service
- Dell EMC ProSupport Enterprise Suite
- Dell EMC ProSupport Plus for Enterprise
- Dell EMC ProSupport for Enterprise
- Dell EMC ProSupport One for Data Center
- ProSupport for HPC
- Support Technologies
- Services for Data Security
- Dell Technologies Education Services
- Dell Technologies Consulting Services
- Dell EMC Managed Services
- Appendix A. Additional specifications
- Appendix B. Standards compliance
- Appendix C Additional resources
Table 16. Power tools and technologies (continued)
Feature Description
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
Find additional information at: https://www.delltechnologies.com/en-us/servers/power-and-
cooling.htm.
Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while
maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F
to 95°F) and to extended ambient temperature ranges.
Figure 14. Thermal design characteristics
The thermal design of the PowerEdge R350 reflects the following:
● Optimized thermal design: The system layout is architected for optimum thermal design.
● System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power.
● Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, as well as inventory for system configurations. Temperature
monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP.
● Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine
fan speed based on inlet air ambient temperature. Closed loop thermal control method uses feedback temperatures to
dynamically determine proper fan speeds.
● User-configurable settings: With the understanding and realization that every customer has unique set of circumstances or
expectations from the system, in this generation of servers, we have introduced limited user- configurable settings residing
in the iDRAC BIOS setup screen. For more information, see the Dell EMC PowerEdge R350 Installation and Service Manual
at www.dell.com/poweredgemanuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on
Dell.com.
● Cooling redundancy: The R350 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
● Environmental Specifications: The optimized thermal management makes the R350 reliable under a wide range of operating
environments.
Power, thermal, and acoustics
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