Owners Manual
Table Of Contents
- Dell PowerEdge R430 Owner's Manual
- Dell PowerEdge R430 system overview
- Supported configurations for the PowerEdge R430 system
- Front panel
- Back panel features
- Diagnostic indicators
- Locating service tag of your system
- Documentation resources
- Technical specifications
- Initial system setup and configuration
- Pre-operating system management applications
- Options to manage the pre-operating system applications
- System Setup
- Viewing System Setup
- System Setup details
- System BIOS
- Viewing System BIOS
- System BIOS Settings details
- Boot Settings
- Network Settings
- System Security
- System Information
- Memory Settings
- Processor Settings
- SATA Settings
- Integrated Devices
- Serial Communication
- System Profile Settings
- Miscellaneous Settings
- iDRAC Settings utility
- Device Settings
- Dell Lifecycle Controller
- Boot Manager
- PXE boot
- Installing and removing system components
- Safety instructions
- Before working inside your system
- After working inside your system
- Recommended tools
- Front bezel (optional)
- System cover
- Inside the system
- Cooling shroud
- System memory
- Hard drives
- Removing a 2.5-inch hard drive blank
- Installing a 2.5-inch hard drive blank
- Removing a 3.5-inch hard drive blank
- Installing a 3.5-inch hard drive blank
- Removing a 3.5-inch cabled hard drive carrier
- Installing a 3.5-inch cabled hard drive carrier
- Removing a hot swappable hard drive carrier
- Installing a hot swappable hard drive carrier
- Removing a 3.5-inch hot swappable hard drive adapter from a 3.5-inch hot swappable hard drive carrier
- Installing a 3.5-inch hard drive adapter into a hot swap hard drive carrier
- Removing a 2.5-inch hard drive from a 3.5-inch hard drive adapter
- Installing a 2.5-inch hard drive into a 3.5-inch hard drive adapter
- Removing a hard drive or a solid state drive from a hard drive carrier
- Installing a hard drive or solid state drives into a hard drive carrier
- Optical drive (optional)
- Cooling fans
- Internal USB memory key (optional)
- Expansion cards and expansion card riser
- iDRAC port card (optional)
- SD vFlash card (optional)
- Internal dual SD module (optional)
- Integrated storage controller card
- Processors and heat sinks
- Power supply units
- System battery
- Hard-drive backplane
- Control panel
- Power interposer board
- System board
- Trusted Platform Module
- Using system diagnostics
- Jumpers and connectors
- Troubleshooting your system
- Troubleshooting system startup failure
- Troubleshooting external connections
- Troubleshooting the video subsystem
- Troubleshooting a USB device
- Troubleshooting a serial input and output device
- Troubleshooting a NIC
- Troubleshooting a wet system
- Troubleshooting a damaged system
- Troubleshooting the system battery
- Troubleshooting power supply units
- Troubleshooting cooling problems
- Troubleshooting cooling fans
- Troubleshooting system memory
- Troubleshooting an internal USB key
- Troubleshooting a micro SD card
- Troubleshooting an optical drive
- Troubleshooting a drive or SSD
- Troubleshooting a storage controller
- Troubleshooting expansion cards
- Troubleshooting processors
- System messages
- Getting help
Table 31. Operating temperature de-rating specifications
Operating temperature de-rating Specifications
35°C to 40°C (95°F to 104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft) above
950 m (3,117 ft).
40°C to 45°C (104°F to 113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft) above
950 m (3,117 ft).
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility
of the customer.
Table 32. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE: This condition applies to data center environments only. Air
filtration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an office or
factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust.
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity.
NOTE: This condition applies to data center and non-data center
environments.
Table 33. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as defined by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Expanded operating temperature
Table 34. Expanded operating temperature specifications
Expanded operating temperature Specifications
Continuous operation 5°C to 40°C at 5% to 85% RH with 29°C dew point.
NOTE: Outside the standard operating temperature (10°C to
35°C), the system can operate continuously in temperatures as low
as 5°C and as high as 40°C.
Technical specifications 37