Instruction manual

Instruction Manual
760006-A
September 2001
Rosemount Analytical Inc. A Division of Emerson Process Management Contents i
Model NGA 2000 Platform
TABLE OF CONTENTS
PREFACE...........................................................................................................................................P-1
Intended Use Statement.....................................................................................................................P-1
Definitions ...........................................................................................................................................P-1
Safety Summary .................................................................................................................................P-2
Documentation....................................................................................................................................P-3
Compliances .......................................................................................................................................P-3
Glossary..............................................................................................................................................P-4
1-0 DESCRIPTION AND SPECIFICATIONS.................................................................................1-1
1-1 The NGA Concept - Introduction ..............................................................................................1-1
1-2 The Digital Communications System – Introduction ...............................................................1-1
1-3 Platform Overview ....................................................................................................................1-2
1-4 The LON – The NGA Digital Communications Network ..........................................................1-3
1-5 PC Interface .............................................................................................................................1-4
1-6 Instruction Manuals ..................................................................................................................1-4
1-7 Platform Components...............................................................................................................1-5
a. Operator Interface......................................................................................................1-5
b. Platform Controller Board ...........................................................................................1-6
c. Power Input Module/Power Supply.............................................................................1-7
d. Distribution Assembly Components............................................................................1-8
1-8 Software/Displays.....................................................................................................................1-9
1-9 Multiple Module Components and System Integration ............................................................1-10
1-10 I/O Module..............................................................................................................................1-16
a. Overview ....................................................................................................................1-16
b. Analog Functions And I/O Connections.....................................................................1-19
c. Additional I/O Modules ...............................................................................................1-21
1-11 Specifications .........................................................................................................................1-22
a. Platform.......................................................................................................................1-22
b. I/O Module ..................................................................................................................1-22
c. 30 A Bulk Power Supply..............................................................................................1-23
2-0 INSTALLATION .......................................................................................................................2-1
2-1 Unpacking ................................................................................................................................2-1
2-2 Location ....................................................................................................................................2-1
2-3 Electrical Requirements ...........................................................................................................2-2
2-4 Gas Requirements ...................................................................................................................2-2
2-5 I/O Requirements .....................................................................................................................2-2
2-6 I/O Module................................................................................................................................2-2
a. I/O Module Installation Procedure .............................................................................2-2
b. Removal.....................................................................................................................2-3
c. Software Configuration...............................................................................................2-3
d. Binding Procedure v2.2..............................................................................................2-3
e. Binding Procedure - Software v2.3 and higher..........................................................2-5
f. Binding Procedure – V3.6 And Higher.......................................................................2-6
2-7 Sample Handling .....................................................................................................................2-7