Specifications

Introduction EP-BX6
Page 1-2
Overview
Pentium
®
II or Pentium
®
III Processor
The Pentium
®
II or Pentium
®
III Processor (The Pentium
®
III Processor as 400/
100MHz, 450/100MHz speed above with 512K-L2 cache Versions.) is the
follow-on to the Pentium
®
Processor. The Pentium
®
II or Pentium
®
III
Processor, like the Pentium
®
Pro processor, implements a Dynamic Execution
micro-architecture -- a unique combination of multiple branch prediction, data
flow analysis, and speculative execution. This enables the Pentium
®
II/III Proces-
sor to deliver higher performance than the Pentium
®
processor, while maintaining
binary compatibility with all previous Intel architecture processors.
A significant feature of the Pentium
®
II or Pentium
®
III Processor, from a system
perspective, is the built-in direct multiprocessing support. In order to achieve
multiprocessing, and maintain the memory and I/O bandwidth to support it, new
system designs are needed. For systems with dual processors, it is important to
consider the additional power burdens and signal integrity issues of supporting
multiple loads on a high speed bus. The Pentium
®
II or Pentium
®
III Processor
card supports both uni-processor and dual processor implementations.
The Pentium
®
II or Pentium
®
III Processor utilizes Single Edge Contact (S.E.C.)
(Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2
cache to remain tightly coupled to the processor, while maintaining flexibility
when implementing high performance processors into OEM systems. The second
level cache is performance optimized and tested at the cartridge level. The S.E.C.
cartridge utilizes surface mounted core components and a printed circuit board
with an edge finger connection. The S.E.C. cartridge package introduced on the
Pentium
®
II Processor will also be used in future Slot 1 processors.
The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB
with an edge finger connection. The thermal plate allows standardized heatsink
attachment or customized thermal solutions. The thermal plate enables a reusable
heatsink to minimize fit issues for serviceability, upgradeability and replacement.
The full enclosure also protects the surface mount components. The edge finger
connection maintains socketabilty for system configuration. The edge finger
connector is denoted as ‘Slot 1 connector’ in this and other documentation.