Specifications

EPSON 5–3
SED1225 Series
SED1225
Series
PIN ASSIGNMENT
SED1225D✽✽
↑
CGROM pattern version number
Chip size: 7.85 × 1.97 mm
Pad pitch: 90 µm (min)
Chip thickness (Reference): 625 µm
Au bump specifications
Bump size:
Pad Nos. 59 to 72, and 155 to 171: 78 µm × 59 µm
Pad Nos. 1 to 58, and 73 to 154: 59 µm × 78 µm
Bump height (Reference): 22.5 µm
Y
X
(0,0)
72
59
155
171
581
73154
Top View
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: Dummy PAD
: PAD