Specifications

EPSON 2–15
SED1200 Series
SED1200
Series
Mechanical Specifications
SED1200F Package Dimensions
0.992
±0.016
(25.2
±0.4
)
0.551
±0.004
(14.0
±0.1
)
0.006
±0.002
(0.15
±0.05
)
0.079
±0.004
(2.0
±0.1
)
0.756
±0.016
(19.2
±0.4
)
0.787
±0.004
(20.0
±0.1
)
0.031
±0.006
(0.8
±0.15
)
0.014
±0.004
(0.35
±0.1
)
0.047
±0.012
(1.2
±0.3
)
0.102
(
2.6
)
0~12°
64 41
40
25
241
65
80
Index
SED1200D Package Dimensions
Chip size: 5.86 mm × 3.41 mm
Chip thickness: 0.40 mm ± 0.03 mm
Pad size: 0.90 mm × 0.90 mm
Pad pitch: 0.19 mm
20 15 10 5 1
45 50 55 60
25
30
35
40
80
75
70
65
Y
X