Specifications

EPSON 8–3
SED1240 Series
SED1240
Series
CHIP SPECIFICATIONS
SED124
**
**
Digits for CGROM pattern change
Number of display lines
0: 4-line display
1: 3-line display
2: 2-line display
Chip size: 8.70 × 2.80 mm
Pad pitch: 90 µm (Min.)
Chip thickness (reference value): 625 ± 50 µm (SED124
*
D
**
)
Au bump specifications
Bump size A TYPE 60.0 µm × 81.5 µm
B TYPE 81.5 µm × 60.0 µm
C TYPE 85.0 µm × 85.0 µm
D TYPE 60.0 µm × 85.0 µm
Bump height (reference value) 22.5 µm ± 5.5 µm
(For bump types, refer to the pad coordinate diagram.)
210
1
186
185 101
100
75
23456 74
: DUMMY PAD
SED1240 Series
D124XDXX
Die No.
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . .
. . . . .
(0, 0)
Y
X
: PAD
↑↑
Note: The board of this IC has VDD potential. It is recommended to stabilize power supply by connecting the
board to the VDD potential at the time of mounting.