Specifications

9–10 EPSON
SED1278
SPECIFICATIONS
Absolute Maximum Ratings
Notes: 1. VDD > V1 > V2 > V3 > V4 > V5 > VSS
2. A flat package product can become less resistant to moisture if exposed to extreme temperatures. When
mounting this package on a printed circuit board, use a soldering technique which avoids excessive
thermal loading of the package resin.
3. All voltages assume V
SS = 0 V.
DC Characteristics
(VDD = 5.0 V ± 10%, VSS = 0 V, Ta = –20 to +75°C)
Parameter Symbol Condition
Rating
Unit Applicable Pins
min typ max
“H” level input voltage (1) (TTL) VIH1 2.0 — VDD V DB0 to DB7, RS,
“L” level input voltage (1) (TTL) VIL1 VSS — 0.8 V R/W, E
“H” level input voltage (2) (CMOS) VIH2 VDD–1.0 — VDD V
OSC1
“L” level input voltage (2) (CMOS) VIL2 VSS — 1.0 V
“H” level output voltage (1) (TTL) VOH1 –IOH = 0.205 mA 2.4 — — V
DB0 to DB7
“L” level output voltage (1) (TTL) VOL1 IOL = 1.6 mA — — 0.4 V
“H” level output voltage (2)
V
OH2 –IOH = 0.04 mA 0.9VDD ——V
(CMOS)
XSCL, LP, DO
“L” level output voltage (2)
V
OL2 IOL = 0.04 mA — — 0.1VDD V
(CMOS)
Driver-on resistor (COM) RCOM | VCOM–Vn | = 0.5 V — 2 10 kΩ COM1 to COM16
Driver-on resistor (SEG) RSEG | VSEG–Vn | = 0.5 V — 2.5 10 kΩ SEG1 to SEG40
I/O leakage current IIL VIN = 0 to VDD —— 1µA
Pull-up MOS current –IP V
DD = 5 V 50 125 250 µA
DB0 to CB7, RS,
R/W
Rf oscillation, from
Supply current I
OP external clock — 0.5 0.8 mA VDD
VDD = 5 V, fOSC = fCP = 270 kHz
Parameter Symbol Rating Unit
Supply voltage (1) VDD –3 to +7.0 V
Supply voltage (2)* V1 to V5 –0.3 to VDD+0.3 V
Input voltage VIN –0.3 to VDD+0.3 V
Operating temperature Topr –20 to +75 °C
Storage temperature Tstg –65 to +150 °C
Soldering temperature × time** Tsol 260, 10 °C, s
Power dissipation PD 300 mW