Specifications

EPSON 4–3
SED1220
SED1220
CHIP SPECIFICATION
SED1220D
**
/1221D
**
/122AD
**
SED122
*
D
**
Digits prepared for CGROM pattern changes
Chip size: 7.70 × 2.77 mm
Pad pitch: 100 µm (Minimum)
Chip thickness (for reference): 625 ± 25 µm (SED122
*
D
*
A
)
(SED122
*
D
*
B
)
1) A1 pad specifications
Pad size on Y side: 75 µm × 135 µm
Pad size on X side: 135 µm × 75 µm
2) Au bump specifications
Bump size on Y side: 69 µm × 129 µm
Bump size on X side: 129 µm × 69 µm
Bump height (for reference) 22.5 µm ± 5.5 µm
<Fuse Pines>
1) Al pad. pad size 86 µm × 75 µm
2) Au bump
Bump size 80 µm × 69 µm
146
147
165
74
54
1
73
62
56
55
63
:DUMY PAD
:PAD
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