Specifications

4–4 EPSON
SED1220
SED1222D
**
SED1222D
**
Digits prepared for CGROM pattern changes
Chip size: 7.70 × 2.77 mm
Pad pitch: 124 µm (Minimum)
Chip thickness (for reference): 625 ± 50 µm (SED1222D
*
A
)
1) A1 pad specifications
Pad size on Y side: 90 µm × 96 µm
Pad size on X side: 96 µm × 90 µm (PAD. No. 1 ~ 11, 28 ~ 32, 52 ~ 108)
175 µm ×135 µm (PAD. No. 12 ~ 27)
<Fuse Pines>
1) Al pad. pad size 86 µm × 75 µm
125
109
108 52
51
41
40
34
33
111
12 27
28 32
: PAD
Top View
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