Data Sheet

ManualsBrandsESKA ManualsFusesPTC fuse Current I(H) 0.75 A 13.2 V (L x W x H) 4.73 x 0.61 x 3.41 mm

NOTE : Specification subject to change without notice.

2014/9/19

Surface Mountable PTC Resettable Fuse: FSMD Series

1. Summary

(a) RoHS Compliant & Halogen Free

(b) Applications: All high-density boards

standard SMD devices, Lower resistance than standard SMD devices

(d) Operation Current: 0.10A~3.00A

(e) Maximum Voltage: 6V~60V

(f) Temperature Range : -40

℃

to 85

℃

2. Agency Recognition

UL: File No. E211981

C-UL: File No. E211981

TÜV: File No. R50004084, R50090556

3. Electrical Characteristics (23

℃

)

Part

Number

Hold

Current

Trip

Current

Rated

Voltage

Max

Current

Typical

Power

Max Time to Trip Resistance

Current Time R

MIN

MAX

, A I

, A V

MAX

, V

MAX

, A Pd, W Amp Sec Ohms Ohms

FSMD010-R 0.10 0.30 60 100 0.8 8.0 0.020 1.600 15.000

FSMD014-R 0.14 0.30 60 100 0.8 8.0 0.008 1.200 6.500

FSMD020-R 0.20 0.40 30 100 0.8 8.0 0.020 0.800 5.000

FSMD020-60-R

0.20 0.40 60 100 0.8 8.0 0.020 0.800 5.000

FSMD030-R 0.30 0.60 30 100 0.8 8.0 0.100 0.200 1.750

FSMD035-R 0.35 0.70 16 100 0.8 8.0 0.100 0.320 1.500

FSMD035-30-R

0.35 0.70 30 100 0.8 8.0 0.100 0.320 1.500

FSMD050-R 0.50 1.00 16 100 0.8 8.0 0.150 0.150 1.000

FSMD050-30-R

0.50 1.00 30 100 0.8 8.0 0.150 0.150 1.000

FSMD075-R 0.75 1.50 16 100 0.8 8.0 0.200 0.110 0.450

FSMD075-24R 0.75 1.50 24 100 1.0 8.0 0.200 0.110 0.290

FSMD075-33R 0.75 1.50 33 100 1.0 8.0 0.200 0.110 0.400

FSMD110-R 1.10 2.20 8 100 0.8 8.0 0.300 0.040 0.210

FSMD110-16-R

1.10 2.20 16 100 0.8 8.0 0.500 0.060 0.180

FSMD110-24R 1.10 2.20 24 100 1.0 8.0 0.500 0.060 0.200

FSMD125-R 1.25 2.50 6 100 0.8 8.0 0.400 0.050 0.140

FSMD125-16R 1.25 2.50 16 100 0.8 8.0 0.400 0.050 0.140

FSMD150-R 1.50 3.00 8 100 0.8 8.0 0.500 0.040 0.110

FSMD150-12R 1.50 3.00 12 100 1.0 8.0 0.500 0.040 0.110

FSMD150-24R 1.50 3.00 24 100 1.0 8.0 1.500 0.040 0.120

FSMD160-R 1.60 3.20 8 100 0.8 8.0 0.500 0.030 0.100

FSMD160-12R 1.60 3.20 12 100 1.0 8.0 1.000 0.030 0.100

FSMD160-16R 1.60 3.20 16 100 1.0 8.0 1.000 0.030 0.100

FSMD200R 2.00 3.50 8 100 1.0 8.0 2.000 0.020 0.070

FSMD200-16R 2.00 3.50 16 100 1.0 8.0 5.000 0.020 0.085

FSMD260R 2.60 5.00 8 100 1.0 8.0 2.500 0.015 0.047

FSMD260-13R 2.60 5.00 13.2 100 1.3 8.0 5.000 0.015 0.050

FSMD260-16R 2.60 5.00 16 100 1.3 8.0 5.000 0.015 0.050

FSMD300R 3.00 5.00 6 100 1.0 8.0 4.000 0.012 0.040

=Hold current-maximum current at which the device will not trip at 23℃still air.

=Trip current-minimum current at which the device will always trip at 23℃ still air.

MAX

=Maximum voltage device can withstand without damage at it rated current.(I

MAX

)

Summary of content (5 pages)

PAGE 1
Surface Mountable PTC Resettable Fuse: FSMD Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.10A~3.00A (e) Maximum Voltage: 6V~60VDC (f) Temperature Range : -40℃ to 85℃ 2. Agency Recognition UL: C-UL: TÜV: File No. E211981 File No. E211981 File No. R50004084, R50090556 3.
PAGE 2
I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23°C measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin 4.
PAGE 3
5. Thermal Derating Curve FSMD Series Percent of Rated Hold and Trip Current 200% 150% 100% A= FSMD075-R, 075-24R, 075-33R, 110-R, 110-16-R, 110-24R, 125-R, 125-16R, 150-R, 150-12R, 150-24R, 160-R, 160-12R, 160-16R, 200R, 200-16R, 260R, 260-13R, 260-16R, 300R 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (℃) B= FSMD010-R, 014-R, 020-R, 020-60-R, 030-R, 035-R,035-30-R,050-R, 050-30-R 6.
PAGE 4
7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8.
PAGE 5
9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1812 device Pad dimensions (millimeters) A B Device Nominal Nominal All 1812 Series 3.45 1.78 C Nominal 3.50 Solder reflow ※ Due to “Lead Free” nature, Temperature and Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 ℃/second max.