Datasheet

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FOD410, FOD4108, FOD4116, FOD4118 — 6-Pin DIP Zero-Cross Triac Drivers

FOD410, FOD4108, FOD4116, FOD4118 Rev. 1.5.0

July 2009

FOD410, FOD4108, FOD4116, FOD4118

6-Pin DIP Zero-Cross Triac Drivers

Features

■

300mA on-state current

■

Zero-voltage crossing

■

High blocking voltage

– 800V (FOD4108, FOD4118)

– 600V (FOD410, FOD4116)

■

High trigger sensitivity

– 1.3mA (FOD4116, FOD4118)

– 2mA (FOD410, FOD4108)

■

High static dv/dt (10,000V/µs)

■

UL, VDE, CSA approved

■

Lead free assembly

Applications

■

Solid-state relays

■

Industrial controls

■

Lighting controls

■

Static power switches

■

AC motor starters

Description

The FOD410, FOD4108, FOD4116 and FOD4118

devices consist of an infrared emitting diode coupled to a

hybrid triac formed with two inverse parallel SCRs which

form the triac function capable of driving discrete triacs.

The FOD4116 and FOD4118 utilize a high efficiency

infrared emitting diode which offers an improved trigger

sensitivity. These devices are housed in a standard 6-pin

dual in-line (DIP) package.

PackageSchematic

MAIN TERM.

NC*

N/C

*DO NOT CONNECT

(TRIAC SUBSTRATE)

ANODE

CATHODE

MAIN TERM.

ZERO

CROSSING

CIRCUIT

Summary of content (12 pages)

PAGE 1
FOD410, FOD4108, FOD4116, FOD4118 6-Pin DIP Zero-Cross Triac Drivers Features Description ■ 300mA on-state current The FOD410, FOD4108, FOD4116 and FOD4118 devices consist of an infrared emitting diode coupled to a hybrid triac formed with two inverse parallel SCRs which form the triac function capable of driving discrete triacs. The FOD4116 and FOD4118 utilize a high efficiency infrared emitting diode which offers an improved trigger sensitivity.
PAGE 2
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.
PAGE 3
Individual Component Characteristics Symbol Parameters Test Conditions Device Min. Typ.* Max Units EMITTER VF Input Forward Voltage IF = 20mA All 1.25 1.5 V IR Reverse Leakage Current VR = 6V All 0.0001 10 µA VD = 800V FOD4108, FOD4118 3 100 µA VD = 600V FOD410, FOD4116 VD = 800V FOD4108, FOD4118 3 100 µA VD = 600V FOD410, FOD4116 DETECTOR ID(RMS) IR(RMS) dv/dt Peak Blocking Current, Either Direction IF = 0, TA = 100°C(2) Reverse Current TA = 100°C IF = 0(4) (Fig.
PAGE 4
Zero Crossing Characteristics Symbol DC Characteristics Test Conditions VINH Inhibit Voltage (MT1-MT2 voltage above which device will not trigger) IDRM2 Leakage in Inhibited State Min. Typ.* Max. Units IF = Rated IFT 8 25 V IF = Rated IFT, 20 200 µA Rated VDRM, off state Isolation Characteristics Symbol VISO Characteristics Input-Output Isolation Voltage Test Conditions f = 60Hz, t = 1 min. (5) Min. Typ.* Max. Units 5000 Vac(rms) *Typical values at TA = 25°C Notes: 2.
PAGE 5
Figure 3. Normalized LED Trigger Current (IFT) vs. Ambient Temperature (TA) Figure 2. Forward Voltage (VF) vs. Forward Current (IF) 1.6 1.4 -55°C 1.2 25°C 85°C 1.0 0.8 0.6 0.1 1.6 IFT – NORMALIZED LED TRIGGER CURRENT VF – FORWARD VOLTAGE (V) 1.8 1 10 IF – FORWARD CURRENT (mA) VAK = 5.0V Normalized to TA = 25°C 1.4 1.2 1.0 0.8 0.6 -60 100 -40 -20 0 20 40 60 TA – AMBIENT TEMPERATURE (°C) Figure 4. Peak LED Current vs. Duty Factor, Tau Figure 5.
PAGE 6
IDRM – NORMALIZED OFF-STATE CURRENT IH – NORMALIZED HOLDING CURRENT 2.2 Figure 9. Normalized Off-State Current (IDRM) vs. Ambient Temperature (TA) Figure 8. Normalized Holding Current (IH) vs. Ambient Temperature (TA) Normalized to TA = 25°C 2.0 1.8 1.6 1.4 1.2 1.0 0.8 -60 -40 -20 0 20 40 60 80 100 10 VD = 800V, IBD (µA) Normalized to TA = 25°C 1 0.1 -60 -40 -20 TA – AMBIENT TEMPERATURE (°C) Figure 10. Normalized Inhibit Voltage (VINH) vs. Ambient Temperature (TA) 1.1 1.0 0.
PAGE 7
1 6 FOD410 FOD4108 2 MOC3011 FOD4116 FOD4118 7400 180 R1 ZL R2 C1 4 115 Vac NOTE: Circuit supplies 25mA drive to gate of triac at Vin = 25V and TA < 70°C TRIAC IGT R2 C 15 mA 2400 0.1 30 mA 1200 0.2 50 mA 800 0.3 27 VDRM/VRRM SELECT DIFFERENTIAL PREAMP 2W 1000 10 WATT WIREWOUND 6 X100 PROBE 1 DUT 2 X100 PROBE 20k 2W 0.33 1000V 0.047 1000V 4 470pF dV dt VERNIER MOUNT DUT ON TEMPERATURE CONTROLLED Cu PLATE 100 2W 0.001 0.005 1 MEG 82 2W 0.01 2W POWER 0.
PAGE 8
R1 1 VCC Rin 2 D1 6 FOD410 FOD420 FOD4108 FOD4208 FOD4116 FOD4216 FOD4118 FOD4218 3 SCR 5 SCR 4 360Ω R2 D2 LOAD Figure 12. Inverse-Parallel SCR Driver Circuit Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330Ω. Note: This optoisolator should not be used to drive a load directly. It is intended to be a discrete triac driver device only.
PAGE 9
Through Hole Surface Mount 6.80~7.80 6.80~7.80 (0.485) Pin 1 (0.485) 1.15~1.35 3.85 (Typ.) 3.00~4.00 15° (Max.) 7.62 (Typ.) 0.35 (Typ.) 1.00 (Typ.) 2.30~3.30 4.50 (Typ.) 1.15~1.35 0.26 (Typ.) 6.00~7.00 3.00~4.00 6.00~7.00 Pin 1 0.40~0.60 0.26 (Typ.) 2.29~2.79 0.4" Lead Spacing 0.40~0.60 2.29~2.70 0.75~1.25 (Both Sides) 8.15 (Typ.) 9.86~10.46 Recommended Pad Layout for Surface Mount Leadforms 6.80~7.80 (0.485) (1.50) (1.04) 6.00~7.00 Pin 1 (1.30) (7.90) (10.50) 1.10 (Typ.) 3.
PAGE 10
FOD410, FOD4108, FOD4116, FOD4118 — 6-Pin DIP Zero-Cross Triac Drivers Ordering Information Option Order Entry Identifier (example) None FOD410 S FOD410S SD FOD410SD T FOD410T 0.4" Lead Spacing V FOD410V IEC60747-5-2 certification TV FOD410TV IEC60747-5-2 certification, 0.
PAGE 11
12.0 ± 0.1 2.0 ± 0.1 4.0 ± 0.1 0.30 ± 0.05 4.2 ± 0.2 Ø1.55 ±0.05 1.75 ± 0.10 7.5 ± 0.1 16.3 15.7 7.7 ±0.1 10.4 ±0.1 0.1 MAX User Direction of Feed Note: All dimensions are in inches (millimeters). Reflow Profile 245 C, 10–30 s Temperature (°C) 300 260 C peak 250 200 150 Time above 183C, <160 sec 100 50 Ramp up = 2–10C/sec 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.
PAGE 12
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