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FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler

FOD852 Rev. 1.2.2

June 2013

FOD852

4-Pin High Operating Temperature Photodarlington

Optocoupler

Features

■

Applicable to Pb-free IR Reflow Soldering

■

Compact 4-pin Package

■

High Current Transfer Ratio: 1000% Minimum

■

C-UL, UL, and VDE Approved

■

High Input-Output Isolation Voltage of 5000 V

RMS

■

High Operating Temperature of 100°C

Applications

■

Power Supply Regulators

■

Digital Logic Inputs

■

Microprocessor Inputs

Description

The FOD852 consists of gallium arsenide infrared

emitting diode driving a silicon photodarlington output

(with integral base-emitter resistor) in a 4-pin dual in-line

package.

Functional Block Diagram

1ANODE

3CATHODE

COLLECTOR

EMITTER

Figure 1. Schematic

Figure 2. Package Outlines

Summary of content (13 pages)

PAGE 1
FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Features Description ■ Applicable to Pb-free IR Reflow Soldering The FOD852 consists of gallium arsenide infrared emitting diode driving a silicon photodarlington output (with integral base-emitter resistor) in a 4-pin dual in-line package.
PAGE 2
Symbol Parameter Value Units Total Device TSTG Storage Temperature -55 to +125 °C TOPR Operating Temperature -30 to +100 °C TSOL Lead Solder Temperature 260 for 10 seconds °C PTOT Total Device Power Dissipation 200 mW IF Continuous Forward Current 50 mA VR Reverse Voltage 6 V PD LED Power Dissipation 70 mW VCEO Collector-Emitter Voltage 300 V VECO Emitter-Collector Voltage 0.
PAGE 3
Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit 1.2 1.4 V 10 µA 250 pF 200 nA Input VF Forward Voltage IF = 10 mA IR Reverse Current VR = 4 V Ct Terminal Capacitance V = 0, f = 1 kHz 30 Output Collector Dark Current VCE = 200 V, IF = 0 BVCEO ICEO Collector-Emitter Breakdown Voltage IC = 0.1 mA, IF = 0 300 V BVECO Emitter-Collector Breakdown Voltage IE = 10 µA, IF = 0 0.
PAGE 4
COLLECTOR POWER DISSIPATION PC (mW) TA = 25°C unless otherwise specified. FORWARD CURRENT IF (mA) 60 50 40 30 20 10 0 -30 0 25 50 75 100 125 AMBIENT TEMPERATURE TA (°C) 200 150 100 50 0 -30 5 Figure 4. Collector Power Dissipation vs. Ambient Temperature 100 Ic =5 mA 10 mA 30 mA 50 mA 70 mA 100 mA 4. 5 4 3. 5 3 FORWARD CURRENT IF (mA) COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) Figure 3. Forward Current vs. Ambient Temperature 0 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 2. 5 2 1.
PAGE 5
COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) TA = 25°C unless otherwise specified. RELATIVE CURRENT TRANSFER RATIO (%) 1.0 IF = 1 mA VCE = 2 V 0.8 0.6 0.4 0.2 0 20 IF = 20 mA IC = 100 mA 1.10 1.00 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 40 60 80 100 AMBIENT TEMPERATURE TA (°C) Figure 10. Collector-Emitter Saturation Voltage vs. Ambient Temperature Figure 9. Relative Current Transfer Ratio vs.
PAGE 6
FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Test Circuits Vcc Input RD Input Output RL 10% Output 90% ts td tr tf Figure 14. Test Circuit for Response Time Vcc RD RL Output Figure 15. Test Circuit for Frequency Response ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.
PAGE 7
Temperature (°C) Tp Tsmax Ramp-down Tsmin 25°C tS (Preheat) Soldering zone Time (sec) Figure 16.
PAGE 8
Part Number Package Packing Method FOD852 DIP 4-Pin Tube (50 units per tube) FOD852S SMT 4-Pin (Lead Bend) Tube (50 units per tube) FOD852SD SMT 4-Pin (Lead Bend) Tape and Reel (1,000 units per reel) FOD852300 DIP 4-Pin, DIN EN/IEC60747-5-2 option Tube (50 units per tube) FOD8523S SMT 4-Pin (Lead Bend), DIN EN/IEC60747-5-2 option Tube (50 units per tube) FOD8523SD SMT 4-Pin (Lead Bend), DIN EN/IEC60747-5-2 option Tape and Reel (1,000 units per reel) FOD852300W DIP 4-Pin, 0.
PAGE 9
FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions Figure 17. 4-Pin DIP Through Hole Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision.
PAGE 10
FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions (Continued) Figure 18. 4-Pin DIP 0.4” Lead Spacing Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision.
PAGE 11
FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions (Continued) Figure 19. 4-Pin DIP Surface Mount Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision.
PAGE 12
P2 Ø1.55±0.05 P0 1.75±0.1 F W B0 A0 P1 0.3±0.05 K0 Figure 20. Carrier Tape Specification Symbol W Description Dimensions in mm (inches) Tape wide 16 ± 0.3 (0.63) P0 Pitch of sprocket holes F P2 Distance of compartment 7.5 ± 0.1 (0.295) 2 ± 0.1 (0.079) 4 ± 0.1 (0.15) P1 Distance of compartment to compartment 12 ± 0.1 (0.472) A0 Compartment 10.45 ± 0.1 (0.411) B0 5.30 ± 0.1 (0.209) K0 4.25 ± 0.1 (0.167) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.
PAGE 13
FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.2 www.fairchildsemi.