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MCT9001 — Dual Phototransistor Optocouplers

MCT9001 Rev. 1.0.7

February 2010

MCT9001

Dual Phototransistor Optocouplers

Features

■

Two isolated channels per package

■

Two packages fit into a 16 lead DIP socket

■

Underwriters Laboratory (U.L.) recognized File

E90700

■

VDE approved for IEC60747-5-2

Applications

■

AC line/digital logic – isolate high voltage transients

■

Digital logic/digital logic – eliminate spurious grounds

■

Digital logic/AC triac control – isolate high voltage

transients

■

Twisted pair line receiver – eliminate ground loop

feedthrough

■

Telephone/telegraph line receiver – isolate high

voltage transients

■

High frequency power supply feedback control –

maintain floating grounds and transients

■

Relay contact monitor – isolate floating grounds and

transients

■

Power supply monitor – isolate transients

Description

The MCT9001 Optocoupler has two channels for density

applications. For four channel applications, two-packages

fit into a standard 16-pin DIP socket. Each channel is an

NPN silicon planar phototransistor optically coupled to a

gallium arsenide infrared emitting diode.

Schematic Package Outlines

COLLECTOR

EMITTER

ANODE

CATHODE

4 5

EMITTER

COLLECTOR

CATHODE

ANODE

Equivalent Circuit

Summary of content (9 pages)

PAGE 1
MCT9001 Dual Phototransistor Optocouplers Features Description ■ Two isolated channels per package The MCT9001 Optocoupler has two channels for density applications. For four channel applications, two-packages fit into a standard 16-pin DIP socket. Each channel is an NPN silicon planar phototransistor optically coupled to a gallium arsenide infrared emitting diode. ■ Two packages fit into a 16 lead DIP socket ■ Underwriters Laboratory (U.L.
PAGE 2
Symbol Rating Value Unit TOTAL DEVICE TSTG Storage Temperature -55 to +150 °C TOPR Operating Temperature -55 to +100 °C TSOL Lead Solder Temperature (Refer to Reflow Temperature Profile) 260 for 10 sec °C 400 mW 4.83 mW/°C Forward Current – Continuous 60 mA Forward Current – Peak (PW = 1µs, 300pps) 3 A V PD Total Device Power Dissipation @ TA = 25°C Derate above 25°C EMITTER (Each channel) IF IF(pk) VR Reverse Voltage 5.
PAGE 3
Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ.* Max. Unit 1.0 1.3 V 10 µA EMITTER VF Input Forward Voltage IF = 10mA IR Reverse Current VR = 5V CJ Junction Capacitance VF = 0 V, f = 1MHz 50 pF DETECTOR BVCEO Collector-Emitter Breakdown Voltage IC = 0.
PAGE 4
MCT9001 — Dual Phototransistor Optocouplers Typical Performance Curves Fig. 2 Normalized CTR vs. Ambient Temperature Fig. 1 Normalized CTR vs. Forward Current 1.6 1.4 VCE = 5.0V TA = 25°C 1.4 1.0 NORMALIZED CTR NORMALIZED CTR 1.2 Normalized to IF = 10mA 0.8 0.6 0.4 IF = 5mA 1.2 1.0 IF = 10mA 0.8 0.6 0.2 0.0 0 5 10 15 IF - FORWARD CURRENT (mA) Normalized to IF = 10mA TA = 25°C 0.
PAGE 5
Through Hole Surface Mount 9.18~10.18 (0.405) 9.18~10.18 (0.405) Pin 1 Pin 1 6.00~7.00 6.00~7.00 3.00~4.00 1.15~1.35 3.00~4.00 4.50 (Typ.) 1.15~1.35 0.35 Typ. 1.00 (Typ.) 2.30~3.30 3.85 Typ. 0.26 Typ. 2.29~2.79 0.40~0.60 7.62 (Typ.) 0.40~0.60 15° (Max.) 2.29~2.79 0.75~1.25 (Both sides 8.15 (Typ.) 9.86~10.46 0.26 (Typ.) 0.4" Lead Spacing Recommend Pad Layout for Surface Mount Leadform 9.18~10.18 (0.405) Pin 1 (1.50) (2.54) 6.00~7.00 (1.30) (10.50) (7.90) 3.00~4.00 1.15~1.35 4.
PAGE 6
Option Example Part Number No Option MTC9001 S MTC9001S Description Standard Through Hole Surface Mount Lead Bend SD MTC9001SD Surface Mount; Tape and Reel 300 MTC9001300 VDE Approved 3S MTC90013S Surface Mount Lead Bend; VDE Approved 3SD MTC90013SD 300W MTC9001300W Surface Mount; Tape and Reel; VDE Approved 0.
PAGE 7
12.0 ± 0.1 4.90 ± 0.20 0.30 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 13.2 ± 0.2 10.30 ± 0.20 0.1 MAX 10.30 ± 0.20 16.0 ± 0.3 Ø1.6 ± 0.1 User Direction of Feed Note: All dimensions are in inches (millimeters) ©2003 Fairchild Semiconductor Corporation MCT9001 Rev. 1.0.7 www.fairchildsemi.
PAGE 8
MCT9001 — Dual Phototransistor Optocouplers Reflow Profile Temperature (°C) TP 260 240 TL 220 200 180 160 140 120 100 80 60 40 20 0 Max. Ramp-up Rate = 3°C/S Max. Ramp-down Rate = 6°C/S tP Tsmax tL Preheat Area Tsmin ts 120 240 360 Time 25°C to Peak Time (seconds) Profile Feature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60–120 seconds Ramp-up Rate (tL to tP) 3°C/second max.
PAGE 9
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