Product Manual
Table Of Contents
- 1 Disclaimers
- 2 Safety information
- 3 Notice to user
- 4 Customer help
- 5 Quick Start Guide
- 6 Description
- 7 Operation
- 7.1 Charging the battery
- 7.2 Turning on and turning off the camera
- 7.3 Saving an image
- 7.4 Recalling an image
- 7.5 Deleting an image
- 7.6 Deleting all images
- 7.7 Measuring a temperature using a spotmeter
- 7.8 Measuring the hottest temperature within an area
- 7.9 Measuring the coldest temperature within an area
- 7.10 Hiding measurement tools
- 7.11 Changing the color palette
- 7.12 Changing image mode
- 7.13 Changing the temperature scale mode
- 7.14 Setting the emissivity as a surface property
- 7.15 Setting the emissivity as a custom material
- 7.16 Changing the emissivity as a custom value
- 7.17 Changing the reflected apparent temperature
- 7.18 Changing the settings
- 7.19 Updating the camera
- 8 Technical data
- 9 Declaration of conformity
- 10 Cleaning the camera
- 11 Application examples
- 12 About FLIR Systems
- 13 Glossary
- 14 Thermographic measurement techniques
- 15 History of infrared technology
- 16 Theory of thermography
- 17 The measurement formula
- 18 Emissivity tables
Emissivity tables18
Table 18.1 T: Total spectrum; SW: 2–5 µm; LW: 8–14 µm, LLW: 6.5–20 µm; 1: Material; 2: Specification;
3:Temperature in °C; 4: Spectrum; 5: Emissivity: 6:Reference (continued)
1 2 3 4 5 6
Chromium
polished 50 T 0.10 1
Chromium polished 500–1000 T 0.28–0.38 1
Clay fired
70 T 0.91 1
Cloth
black 20 T 0.98 1
Concrete
20 T 0.92 2
Concrete dry 36 SW
0.95 7
Concrete rough 17 SW
0.97 5
Concrete
walkway
5
LLW 0.974 8
Copper commercial,
burnished
20 T 0.07 1
Copper electrolytic, care-
fully polished
80 T 0.018 1
Copper
electrolytic,
polished
–34 T 0.006 4
Copper
molten 1100–1300 T 0.13–0.15 1
Copper
oxidized 50 T 0.6–0.7 1
Copper
oxidized to
blackness
T 0.88 1
Copper
oxidized, black 27 T 0.78 4
Copper
oxidized, heavily 20 T 0.78 2
Copper
polished 50–100 T 0.02 1
Copper
polished 100 T 0.03 2
Copper
polished,
commercial
27 T 0.03 4
Copper polished,
mechanical
22 T 0.015 4
Copper pure, carefully
prepared surface
22 T 0.008 4
Copper
scraped 27 T 0.07 4
Copper dioxide
powder T 0.84 1
Copper oxide
red, powder T 0.70 1
Ebonite T 0.89 1
Emery
coarse 80 T 0.85 1
Enamel 20 T 0.9 1
Enamel lacquer 20 T 0.85–0.95 1
Fiber board hard, untreated 20
SW
0.85 6
Fiber board masonite 70
SW
0.75 9
Fiber board masonite 70 LW 0.88 9
Fiber board particle board 70
SW
0.77 9
Fiber board particle board 70 LW 0.89 9
Fiber board porous, untreated 20
SW
0.85 6
Gold
polished 130 T 0.018 1
Gold polished, carefully
200–600 T 0.02–0.03 1
Gold
polished, highly 100 T 0.02 2
Granite
polished 20 LLW 0.849 8
#T559828; r. AC/ 9610/10386; en-US
54