User's Manual
Table Of Contents
- 1 Device pinout
- 2 Device terminal functions
- 3 Electrical Characteristics
- 4 Radio Characteristics
- Firmware versions
- 5 Device terminal description
- 6 Application information
- 7 Package information
- 8 Certifications
- 9 RoHS And REACH Statement
- 10 Tape and Reel information
- 11 Ordering information
- 12 Document history
- Acronyms and definitions
Rev: e
© 2030 Free2move AB
Page 36(45)
Extended range Bluetooth
Module - F2M03GXA
Datasheet
6.2 Layout guidelines
The module uses bottom pads for soldering optimized for an automatic solder line. It is also possible to
solder the module manually by using hot air soldering. For manual soldering solder pads may in some
situation be made slightly larger to allow easier heating process.
To achieve good RF performance it is recommended to place ground plane(s) beneath the module but not
under the antenna. The ground planes should be connected with vias surrounding the module. Except from
the ground plane it is preferable that there are as few components and other material as possible nearby
the antenna. Free air is the best surrounding for the antenna.
All GND pads must be connected directly to a flooded ground-plane. If more then one ground layer is used
then make a good connection between them using many via holes. +VCC and +V_PA should be connected
to the LDO using a wide trace.
F2M03GXA
Ground layers
Vias
Antenna