Datasheet

Electrical Specifications
26 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors and are based on final silicon
validation/characterization.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See Section 2.5 for more information.
3. The voltage specification requirements are measured across the VCC_DIE_SENSE and VSS_DIE_SENSE
lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands with a 100 MHz bandwidth
oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled
in the scope probe.
4. The processor must not be subjected to any static V
CC
level that exceeds the V
CC_MAX
associated with any
particular current. Failure to adhere to this specification can shorten processor lifetime.
5. I
CC_MAX
is specified at V
CC_MAX
. The processor is capable of drawing I
CC_MAX
for up to 10 ms. Refer to
Figure 2-2 and Figure 2-3 for further details on the average processor current draw over various time
durations.
6. FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only.
7. The current specified is also for HALT and Enhanced HALT State.
8. These specifications apply to the PLL power lands VCCA, VCCIOPLL, and VSSA. See Section 2.4.2 for
details. These parameters are based on design characterization and are not tested.
9. This specification represents the total current for GTLREF_DATA and GTLREF_ADD per core.
10. V
TT
must be provided via a separate voltage source and must not be connected to V
CC
. This specification is
measured at the land.
I
CC_RESET
I
CC_RESET
for Dual-Core Intel Xeon
Processor 5000 series with multiple
VID (1066 MHz)
150 A 18
I
CC_RESET
I
CC_RESET
for Dual-Core Intel Xeon
Processor 5063 (MV) with multiple
VID
115 A 18
I
TT
Steady-state FSB Termination
Current
6.1 A 16
I
TT_POWER-UP
Power-up FSB Termination Current 8.0 A 19
I
CC_TDC
Thermal Design Current (TDC) for
Dual-Core Intel Xeon Processor
5000 series (667 MHz)
100 A 6,15
I
CC_TDC
Thermal Design Current (TDC) for
Dual-Core Intel Xeon Processor
5000 series (1066 MHz)
130 A 6,15
I
CC_TDC
Thermal Design Current (TDC) for
Dual-Core Intel Xeon Processor
5063 (MV)
100 A 6,15
I
CC_VTTOUT
DC current that may be drawn
from V
TTOUT
per land
580 mA 17
I
CC_VCCA
I
CC
for PLL power lands 120 mA 8
I
CC_VCCIOPLL
I
CC
for PLL power lands 100 mA 8
I
CC_GTLREF
I
CC
for GTLREF 200 µA 9
I
TCC
I
CC
during active thermal control
circuit (TCC) for Dual-Core Intel
Xeon Processor 5000 series
150 A
I
TCC
I
CC
during active thermal control
circuit (TCC) for Dual-Core Intel
Xeon Processor 5063 (MV)
115 A
I
SGNT
I
CC
Stop-Grant for Dual-Core Intel
Xeon Processor 5000 series (667
MHz)
50 A 7
I
SGNT
I
CC
Stop-Grant for Dual-Core Intel
Xeon Processor 5000 series (1066
MHz)
60 A 7
I
SGNT
I
CC
Stop-Grant for Dual-Core Intel
Xeon Processor 5063 (MV)
40 A 7
Table 2-10. Voltage and Current Specifications (Sheet 2 of 2)
Symbol Parameter Min Typ Max Unit
Notes
1,13