Datasheet

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 3
Contents
1 Introduction.................................................................................................................9
1.1 Terminology .....................................................................................................11
1.2 State of Data....................................................................................................12
1.3 References .......................................................................................................12
2 Electrical Specifications ...............................................................................................15
2.1 Front Side Bus and GTLREF ................................................................................15
2.2 Power and Ground Lands....................................................................................15
2.3 Decoupling Guidelines........................................................................................16
2.3.1 VCC Decoupling......................................................................................16
2.3.2 VTT Decoupling......................................................................................16
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................16
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking.......................................16
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])..................................17
2.4.2 Phase Lock Loop (PLL) and Filter ..............................................................18
2.5 Voltage Identification (VID) ................................................................................19
2.6 Reserved or Unused Signals................................................................................21
2.7 Front Side Bus Signal Groups..............................................................................21
2.8 GTL+ Asynchronous and AGTL+ Asynchronous Signals...........................................23
2.9 Test Access Port (TAP) Connection.......................................................................23
2.10 Mixing Processors..............................................................................................24
2.11 Absolute Maximum and Minimum Ratings.............................................................24
2.12 Processor DC Specifications ................................................................................25
2.12.1 VCC Overshoot Specification....................................................................31
2.12.2 Die Voltage Validation.............................................................................32
3 Mechanical Specifications.............................................................................................33
3.1 Package Mechanical Drawings.............................................................................33
3.2 Processor Component Keepout Zones...................................................................37
3.3 Package Loading Specifications ...........................................................................37
3.4 Package Handling Guidelines...............................................................................38
3.5 Package Insertion Specifications..........................................................................38
3.6 Processor Mass Specifications .............................................................................38
3.7 Processor Materials............................................................................................38
3.8 Processor Markings............................................................................................39
3.9 Processor Land Coordinates................................................................................40
4 Land Listing...............................................................................................................43
4.1 Dual-Core Intel Xeon Processor 5000 Series Land Assignments ............................... 43
4.1.1 Land Listing by Land Name......................................................................43
4.1.2 Land Listing by Land Number...................................................................52
5 Signal Definitions ......................................................................................................61
5.1 Signal Definitions ..............................................................................................61
6 Thermal Specifications ................................................................................................69
6.1 Package Thermal Specifications...........................................................................69
6.1.1 Thermal Specifications............................................................................69
6.1.2 Thermal Metrology .................................................................................75
6.2 Processor Thermal Features................................................................................77
6.2.1 Thermal Monitor.....................................................................................77
6.2.2 On-Demand Mode ..................................................................................77
6.2.3 PROCHOT# Signal..................................................................................78
6.2.4 FORCEPR# Signal...................................................................................78
6.2.5 THERMTRIP# Signal ...............................................................................78