Datasheet

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 33

Mechanical Specifications

3 Mechanical Specifications

The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid

Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket. The

package consists of a processor core mounted on a pinless substrate with 771 lands. An

integrated heat spreader (IHS) is attached to the package substrate and core and

serves as the interface for processor component thermal solutions such as a heatsink.

Figure 3-1 shows a sketch of the processor package components and how they are

assembled together. .

The package components shown in Figure 3-1 include the following:

1. Integrated Heat Spreader (IHS)

2. Thermal Interface Material (TIM)

3. Processor Core (die)

4. Package Substrate

5. Landside capacitors

6. Package Lands

Note: This drawing is not to scale and is for reference only.

3.1 Package Mechanical Drawings

The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The

drawings include dimensions necessary to design a thermal solution for the processor

including:

1. Package reference and tolerance dimensions (total height, length, width, an so

forth)

2. IHS parallelism and tilt

3. Land dimensions

4. Top-side and back-side component keepout dimensions

5. Reference datums

Note: All drawing dimensions are in mm [in.].

Figure 3-1. Processor Package Assembly Sketch

IHS

Substrate

LGA771 Socket

System Board

Capacitors

Core (die)

TIM

Package Lands