Datasheet
Mechanical Specifications
38 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
10. R is defined as the radial distance from the center of the LGA771 socket ball array to the center of heatsink
load reaction point closest to the socket.
11. Applies to populated sockets in fully populated and partially populated socket configurations.
12. Through life or product. Condition must be satisfied at the beginning of life and at the end of life.
13. Rigid back is not allowed. The board should flex in the enabled configuration.
3.4 Package Handling Guidelines
Table 3-2 includes a list of guidelines on a package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5 Package Insertion Specifications
The Dual-Core Intel Xeon Processor 5000 Series can be inserted and removed 15 times
from an LGA771 socket.
3.6 Processor Mass Specifications
The typical mass of the Dual-Core Intel Xeon Processor 5000 series is 21.5 grams [0.76
oz.]. This includes all components which make up the entire processor product.
3.7 Processor Materials
The Dual-Core Intel Xeon Processor 5000 series are assembled from several
components. The basic material properties are described in Table 3-3.
Table 3-2. Package Handling Guidelines
Parameter Maximum Recommended Units Notes
Shear 311
70
N
lbf
1,4,5
Tensile 111
25
N
lbf
2,4,5
Torque 3.95
35
N-m
LBF-in
3,4,5
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel over copper
Substrate Fiber-reinforced resin
Substrate Lands Gold over nickel