Datasheet

Thermal Specifications
74 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Chapter 2, “Electrical Specifications.”
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on final silicon validation/characterization.
4. Power specifications are defined at all VIDs found in Table 2-10. The Dual-Core Intel Xeon Processor 5000
series may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guideline provide a design target for meeting all planned processor
frequency requirements.
Table 6-6. Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table
Power (W) T
CASE_MAX
(° C) Power (W) T
CASE_MAX
(° C)
P_profile_min
_B
=29.6 50.0 75 61.8
35 51.4 80 63.1
40 52.7 85 64.4
45 54.0 90 65.7
50 55.3 95 67.0
55 56.6
60 57.9
65 59.2
70 60.5
Table 6-7. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications
Core Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum T
CASE
(°C)
Notes
Launch to FMB 95 5 Refer to Figure 6-3;
Table 6-8
1, 2, 3, 4,
5