User's Manual

GS2101M-DS-001270, Release 1.0 Confidential 19
Chapter 1 GS2101M Overview
This chapter describes the GainSpan® GS2101M low power module hardware specification
overview.
Product Overview, page 19
GS2101M Module Product Features, page 19
1.1 Product Overview
The GS2101M based modules provide cost effective, low power, and flexible platform to
add WiFi® connectivity for embedded devices for a variety of applications, such as
wireless sensors and thermostats. It uses the GS2000 SoC, which combines ARM® Cortex
M3-based processors with a 802.11b/g/n Radio, MAC, security, & PHY functions, RTC
and SRAM, up to 4 MB FLASH, and on-board and off module certified antenna options.
The module provides a WiFi and regulatory certified IEEE 802.11b/g/n radio with
concurrent network processing services for variety of applications, while leverage existing
802.11 wireless network infrastructures.
1.2 GS2101M Module Product Features
Family of modules with different antenna and output power options:
GS2101MIx 18mm (0.71in) x 25 mm (0.98in) x 2.5mm (0.098in) 40-pin PCB
Surface Mount Package. Two SKU’s are:
GS2101MIP (on-board PCB antenna)
GS2101MIE (external antenna)
The two SKUs are pin to pin compatible
Simple API for embedded markets covering a large range of applications
Fully compliant with IEEE 802.11b/g/n and regulatory domains:
802.11n: 1x1 single stream, 20 MHz channels, 400/800ns GI,
MCS0 – 7
Data rates of 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65.0, 72.2 Mbps
802.11g: OFDM modulation for data rates of 6, 9, 12, 18, 24, 36, 48 and 54
Mb/s.
802.11b: CCK modulation rates of 5.5 and 11 Mbps; DSSS modulation for
data rate of 1 and 2 Mbps.