User's Manual

Package and Layout Guidelines GS2101M Low Power WiFi Module Data Sheet
GS2101Mxx Recommended PCB Footprint and Dimensions
54 Confidential GS2101M-DS-001270, Release 1.0
5.1.1 Surface Mount Assembly
The reflow profile is shown in Figure 6, page 54. The recommended reflow parameters are
summarized in Table 17, page 54.
Figure 6 Reflow Temperature Profile
Notes:
1. Perform adequate test in advance as the reflow temperature profile will vary according to the
conditions of the parts and boards, and the specifications of the reflow furnace.
2. Max number of reflow supported are two.
3. Temperature uniformity inside the IR reflow oven must be tightly controlled and multiple
thermocouples should be used. An example of possible thermocouple locations is given in
Figure 7, page 56. The locations should also include multiple points INSIDE the module
RF shield (e.g., TC1, TC5, and TC7 in Figure 7, page 56). The temperature profile of ALL
thermocouples must meet the requirements of Table 17, page 54.
Table 17 Recommended Reflow Parameters
Preheat
Temperature Ramp up rate for (A)
2
1.5~3.5
o
C/s
Pre-heat time (B)
3
80 to 130 seconds
Pre-heat starting temperature (C1) 125 to 135
o
C
Pre-heat ending temperature (C2) 180 to 200
o
C
Heating
5
Peak Temperature range (D) 240 to 250
o
C
Melting time
4
that is the time over 220
o
C (E) 50 to 75 seconds
Cool Down Ramp (F) >2
o
C/s