User's Manual
Table Of Contents
- Table of Contents
- About This Manual
- Chapter 1 GS2101M Overview
- Chapter 2 GS2101M Architecture
- Chapter 3 Pin-out and Signal Description
- Chapter 4 Electrical Characteristics
- Chapter 5 Package and Layout Guidelines
GS2101M Low Power WiFi Module Data Sheet Package and Layout Guidelines
GS2101Mxx Recommended PCB Footprint and
GS2101M-DS-001270, Release 1.0 Confidential 55
4. Pay close attention to “Melting Time over 220
o
C”. Sufficient time is necessary to
completely melt all solder.
5. Be careful about rapid temperature rise in preheat zone as it may cause excessive slumping
of the solder paste.
6. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if
performed excessively, fine balls and large balls will generate in clusters at a time.
7. If the temperature is too low, non-melting tends to be caused in the area with large heat
capacity after reflow.
8. Be careful about sudden rise in temperature as it may worsen the slump of solder paste.
9. Be careful about slow cooling as it may cause the positional shift of parts and decline in
joining at times.
10. A no clean flux should be used during SMT process.
The modules are shipped in sealed trays with the following conditions (see Figure 8,
page 57).