QuickSpecs
HP Memory
HP MemoryHP Memory
HP Memory
Registered DIMMS (RDIMMs)
Registered DIMMS (RDIMMs)Registered DIMMS (RDIMMs)
Registered DIMMS (RDIMMs)
HP 2GB (1x2GB) Dual Rank x8 PC3-10600 (DDR3-1333) Registered CAS-9 Memory
Kit
500656-B21
HP 4GB (1x4GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory
Kit
500658-B21
HP 4GB (1x4GB) Quad Rank x8 PC3-8500 (DDR3-1066) Registered CAS-7 Low
Power Memory Kit
500660-B21
HP 4GB (1x4GB) Single Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9
Memory Kit
593339-B21
HP 4GB (1x4GB) Single Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 Low
Power Memory Kit
NOTE:
NOTE:NOTE:
NOTE:
Low Voltage DIMMs can only be used with Intel Xeon 5600 series processors.
604504-B21
HP 8GB (1x8GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory
Kit
500662-B21
HP 8GB (1x8GB) Dual Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 Low
Power Memory Kit
NOTE:
NOTE:NOTE:
NOTE:
Low Voltage DIMMs can only be used with Intel Xeon 5600 series processors.
604506-B21
HP 16GB (1x16GB) Quad Rank x4 PC3-8500 (DDR3-1066) Registered CAS-7
Memory Kit
500666-B21
Unbuffered with ECC DIMMs (UDIMMs)
Unbuffered with ECC DIMMs (UDIMMs)Unbuffered with ECC DIMMs (UDIMMs)
Unbuffered with ECC DIMMs (UDIMMs)
HP 1GB (1x1GB) Single Rank x8 PC3-10600 (DDR3-1333) Unbuffered CAS-9
Memory Kit
500668-B21
HP 2GB (1x2GB) Dual Rank x8 PC3-10600 (DDR3-1333) Unbuffered CAS-9
Memory Kit
500670-B21
HP 4GB (1x4GB) Dual Rank x8 PC3-10600 (DDR3-1333) Unbuffered CAS-9
Memory Kit
500672-B21
NOTE:
NOTE:NOTE:
NOTE:
All DDR3 memory option kits consist of one DIMM per kit. For detailed
memory configuration rules and guidelines, please use the Online DDR3 Memory
Configuration Tool:
www.hp.com/go/ddr3memory-configurator
.
NOTE:
NOTE:NOTE:
NOTE:
Kits described as LP include Low Power DIMMs. For more information on
ProLiant Energy Efficient Features, see:
www.hp.com/go/proliant-energy-efficient
.
NOTE:
NOTE:NOTE:
NOTE:
PC3L is a low voltage memory.
Step 3: Choose Additional Options for Factory Integration
Step 3: Choose Additional Options for Factory IntegrationStep 3: Choose Additional Options for Factory Integration
Step 3: Choose Additional Options for Factory Integration
NOTE:
NOTE:NOTE:
NOTE:
For additional options, please refer to the "Core Options" and "Additional Options" section below. For additional options,
including server blade enclosures interconnect and mezzanine options and power subsystem options; please see the Core Options
and Additional sections below; or the following:
HP BladeSystem c-Class Enclosures QuickSpecs:
HP BladeSystem c3000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12790_div/12790_div.html
HP BladeSystem c7000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12810_div/12810_div.html
and HP BladeSystem c-Class Interconnect and Mezzanine Components:
http://h18004.www1.hp.com/products/blades/components/c-class-interconnects.html
http://h18004.www1.hp.com/products/blades/components/c-class-adapters.html
QuickSpecs
HP ProLiant BL460c Generation 6 (G6) Server Blade
HP ProLiant BL460c Generation 6 (G6) Server BladeHP ProLiant BL460c Generation 6 (G6) Server Blade
HP ProLiant BL460c Generation 6 (G6) Server Blade
Configuration Information - Factory Integrated Models
DA - 13238 Worldwide — Version 24 — May 11, 2011
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