ISS Technology Update, Volume 6 Number 8 - Newsletter
ISS Technology Update Volume 6, Number 8
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Additional resources
For additional information on the topics discussed in this article, visit:
Resource URL
HP VDI
http://h18004.www1.hp.com/products/servers/vmware/vdi.html
Technical white paper http://h71019.www7.hp.com/ActiveAnswers/cache/429452-0-0-0-121.html
Device re-direction http://blogs.msdn.com/ts/archive/2006/12/13/terminal-server-plug-and-play-device-redirection-
framework-in-vista-and-longhorn-part-3.aspx
http://ts.veranoest.net/ts_printing.htm
http://www.microsoft.com/resources/documentation/windows/xp/all/proddocs/en-
us/mstsc_print_local.mspx?mfr=true
http://support.microsoft.com/?kbid=272519
http://support.microsoft.com/kb/302361
Cooling the HP BladeSystem c3000 Enclosure
Two major concerns for system administrators are maintaining servers at an optimum temperature and minimizing the cost of
cooling. The HP BladeSystem Onboard Administrator uses HP Thermal Logic technologies to manage performance, power
requirements, and cooling capacity.
One part of this system is Active Cool fans, whose innovative design and placement within the c3000 enclosure allows servers
to be 60 percent more dense than traditional rack-mounted servers without compromising cooling efficiency. Airflow through
the enclosure is configured to ensure that every device is in the flow of cool air and does not sit in the hot exhaust air of another
device. The unique design of fans allows for high-pressure flow even at the slowest speeds. The benefits are numerous:
• Active Cool fans can cool eight server blades using as little as 100 watts of power.
• Active Cool fans are hot pluggable so one can be removed and replaced without affecting the operation of other devices
within the enclosure.
• Active Cools fans can be individually adjusted by the Onboard Administrator to direct increased or decreased cooling as
required in the enclosure.
• Active Cool fans are quiet in addition to having high-pressure flow even at the slowest speeds.