User's Manual
Table Of Contents
- Contents
- 1 Overview
- 2 DC and AC Characteristics
- 3 Electrical Interface
- 4 SPI Interface and Sequences
- 5 Power States
- 6 Messaging Protocol
- 7 microNode Provisioning
- 8 Antenna Diversity
- 9 Regulatory Considerations
- 10 Manufacturing Considerations
- 11 Errata
- Appendix A Abbreviations and Terms
- Appendix B PCB Land Pattern and Vias
- Appendix C REACH AND RoHS Compliance
- Appendix D On-Ramp Wireless RMA Process
- Appendix E microNode Mechanical Drawing
microNode Integration Specification Electrical Interface
On-Ramp Wireless, Inc. 15 014-0033-00 Rev. H
The RF port does have some protection in the form of an inductor to ground, thus allowing
some robustness to direct ESD strikes.
If the application is intended for harsh ESD or lightning strike scenarios it is recommended that
the Integrator take extra precautions to guard against accidental resets or ESD damage.
3.2.2 Harsh Environments
The microNode employs miniature surface-mounted components in its assembly. If the target
design is intended for high humidity or salt environments and intended to have a long service
life, it is recommended that the designer take necessary precautions to guard against prolonged
exposure to moisture and other contaminants. A sealed enclosure (IP67 or IP68) or potting may
be required in extreme environments.