User's Manual

On-Ramp Wireless, Inc. 47 014-0033-00 Rev. H
10 Manufacturing Considerations
This section deals with manufacturing details such as:
 Design of Host PCB for mounting the microNode
 The manufacturing process and soldering profile
 The validation and configuration of the microNode after the assembly process.
10.1 Mechanical Outline
The microNode is a bottom termination component (BTC) that is designed to be directly surface-
mounted onto a Host PCB. All signals (including power, grounds, RF, and digital interface) are
brought through the 40 bottom terminations of the module. The mechanical outline of the PCB
is detailed in Appendix E: microNode Mechanical Drawing.
10.2 Host PCB Constraints
For Host layout, please refer to Appendix B: PCB Land Pattern. It is important to use the
recommended land pattern as well as consider coplanarity of the Host in order to get optimal
yield in manufacturing. Coplanarity is defined as the bow and twist of the microNode and Host
PCBs. Careful measurements of the microNode have been made such that it meets flatness
specifications.
10.3 Handling Procedures for microNode
microNodes are packaged in trays that are then sealed in moisture-barrier bags. The microNode
printed circuit assemblies are moisture sensitive to MSL Class III per IPC/JEDEC J-STD-033.
The microNode is manufactured using lead free, no clean processes. It is recommended that the
module not be washed due to the difficulty of ensuring cleanliness after processing.
All processes used to manufacture the microNode are RoHS compliant. The following is
recommended:
 Solder Type: SAC305 ROLO/No Clean per IPC J-STD-004
 Solder Wire Type: SAC305 ROLO/No Clean per IPC-J-STD-006
 SMT Reflow Profile: Per IPC-7530
 Workmanship: Per IPC-A-610
 Cleaning and Cleanliness Testing: Per J-STD-001 (Requirements for Soldered Electrical
Electronic Assemblies)