ISP1807 Built-in Antenna Low Energy Module BT 5 Long Range, Zigbee, Thread, ANT+ This ultra-small LGA module, 8 x 8 x 1 mm, is based on the nRF52840 Chip. Its powerful Cortex™ M4 CPU, flash and RAM memory combined with an optimized antenna offers the perfect solution for Bluetooth connectivity. The solution is best in class for RF performance and low power consumption. Long range and multiple digital and analogue interfaces give optimum flexibility for sensor integration. Key Features Applications 2.
BLE MODULE ISP1807 Revision History Revision Date Ref Change Description R0 23/11/2017 cr pg Preliminary release R1 12/12/2017 cr pg Engineering samples release R2 20/04/2018 cr pg Section 5.2 – FW tool correction and update Section 6.5 – Extension name change R3 22/08/2018 cr pg Section 3 – Typo error correction R4 12/12/2018 cr pg Section 2.
BLE MODULE ISP1807 Contents 1. Block Diagram........................................................................................................................................ 4 2. 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. 2.7. 2.8. 2.9. Specifications......................................................................................................................................... 5 Important Notice ..........................................................................................................
BLE MODULE ISP1807 1. Block Diagram This module is based on nRF52840 Nordic Semiconductor 2.4GHz wireless System on Chip (SoC) integrating a 2.4 GHz transceiver, a 32-bit ARM Cortex™-M4F CPU, a1 MB flash memory, a 256 kB RAM and analog and digital peripherals. It can support BLE, ANT/ANT+ and a range of proprietary 2.4 GHz protocols, such as Gazell from Nordic Semiconductor. Fully qualified BLE stacks for nRF52840 are implemented in the S140 SoftDevices which can be freely downloaded.
BLE MODULE ISP1807 2. Specifications 2.1. Important Notice The electrical specifications of the module are directly related to the Nordic Semiconductor specifications for the nRF52840 chipset. Bellow information is only a summary of the main parameters. For more detailed information, especially about current consumption, please refer to the up-to-date specification of the chipset available on Nordic Semi website. 2.2.
BLE MODULE ISP1807 2.4. Power Consumption Parameter Min Typ Max Unit Peak Current, Transmitter +8 dBm, VCC 3V + DCDC 16.4 mA Peak Current, Transmitter 0 dBm, VCC 3V + DCDC 6.4 mA Peak Current, Receiver 1 Mbps, VCC 3V + DCDC 6.26 mA System OFF, no RAM retention 0.4 µA System ON, no RAM retention, wake on RTC 1.
BLE MODULE ISP1807 2.7. Range Measurement Range measurement between ISP1807-LR test board (configured as Central) and ISP1807-LR test board (configured as Peripheral). Parameter Min Typ Max Unit Range Open field @1m height (0 dBm, 1 Mbps) 150 m Range Open field @1m height (0 dBm, 125 Kbps) 175 m Range Open field @1m height (8 dBm, 1 Mbps) 230 m Range Open field @1m height (8 dBm, 125 Kbps) 450 m 2.8.
BLE MODULE ISP1807 Ground Plane Effect Simulation USB dongle ground plane (size: 18 x 30 mm²) Cell phone config 2 with side ground plane (size: 40 x 100 mm²) Cell phone config 1 ground plane (size: 40 x 100 mm²) Cell phone config 1 with side ground plane (size: 40 x 100 mm²) Cell phone config 3 with side ground plane (size: 40 x 100 mm²) February 18, 2020 Document Ref: isp_ble_DS1807_R9.
BLE MODULE ISP1807 2.9. Electrical Schematic Electrical schematic showing ISP1807 module connections Confidential February 18, 2020 Document Ref: isp_ble_DS1807_R9.docx Page 9/26 Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.
BLE MODULE ISP1807 3. Pin Description The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows the QFN Jedec standard for 2 row LGA parts. The NC pads are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability (drop test).
BLE MODULE ISP1807 Pin Name Pin function Description 34 35 P0_06 P0_04 AIN2 P0_05 AIN3 P0_15 P0_03 AIN1 P0_27 P0_02 AIN0 P0_25 P0_31 AIN7 P0_11 TRACEDATA2 P0_30 AIN6 P0_19 P0_29 AIN5 P0_23 P0_28 AIN4 P1_02 P1_06 P1_15 P1_14 P1_13 P1_05 P1_08 P1_09 TRACEDATA3 P1_00 TRACEDATA0 P1_03 P1_12 P1_10 P1_11 P1_07 P1_04 P1_01 NC Digital I/O Digital I/O Analog Input Digital I/O Analog Input Digital I/O Digital I/O Analog Input Digital I/O Digital I/O Analog Input Digital I/O Digital I/O Analog Input Digital I/O
BLE MODULE ISP1807 ISP1807 pad placement and pin assignment for the LGA QFN package TOP VIEW February 18, 2020 Document Ref: isp_ble_DS1807_R9.docx Page 12/26 Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.
BLE MODULE ISP1807 4. Mechanical Outlines 4.1. Mechanical Dimensions Package dimensions February 18, 2020 Document Ref: isp_ble_DS1807_R9.docx Page 13/26 Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.
BLE MODULE ISP1807 Dimensional drawing for 62-Pad LGA Package February 18, 2020 Document Ref: isp_ble_DS1807_R9.docx Page 14/26 Insight SiP– Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France –www.insightsip.com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission. Specification subject to change without notice.
BLE MODULE ISP1807 4.2. SMT Assembly Guidelines For PCB Land Patterns and Solder Mask layout, Insight SiP recommends using the same dimensions as module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads. Please contact Insight SiP for more detailed information. 4.3.
BLE MODULE ISP1807 5. Product Development Tools 5.1. Hardware In order to assist clients in developing their Bluetooth Smart solutions based on the ISP1807, Insight SIP offers a Development Kit containing: One Interface Board J-Link Lite CortexM-9 JTAG/SWD Emulator One Test Board A Development Dongle 5 ISP1807 module samples Cables, power supply and coin battery holder Using this development kit, product developers can use a working solution as starting point to develop their own products.
BLE MODULE ISP1807 5.3. Development Tools The following development tools and software are recommended for using and testing ISP1807 module: Nordic Semiconductor nRFgo Studio: Downloadable after registering at www.nordicsemi.com. Nordic Semiconductor Master Control Panel: Downloadable after registering at www.nordicsemi.com. Keil MDK-ARM Lite: Downloadable from https://www.keil.com/demo/eval/arm.htm. Segger J-Link Lite: Downloadable from http://www.segger.com/jlink-software.html.
BLE MODULE ISP1807 6. Packaging & Ordering information 6.1. Marking M /N : I S P 1 8 0 7 T T Y Y W W R ISP1807 YY Part Number 2 letters Module Type (see section 6.5) 2 digits year number WW 2 digits week number R 1 letter Hardware revision TT 6.2. Prototype Packaging For engineering samples and prototype quantities up to 99 units, deliveries are provided in thermoformed trays or cut tapes. They are delivered in sealed pack with desiccant pack and humidity sensors. Please see section 7.
BLE MODULE ISP1807 Top view position of modules within the tray. 6.4. Tape and Reel ISP1807 are also available in Tape & Reel. They are delivered in sealed pack with desiccant pack and humidity sensors. Reels are proposed in standard quantities of 500 units (180mm / 7” reel) or 2000 units (330mm / 13” reel) only. Please order with “RS” code packaging suffix for 500-unit reels and “R2” for 2000-unit reels. February 18, 2020 Document Ref: isp_ble_DS1807_R9.
BLE MODULE ISP1807 Top view position of modules within the reel. 6.5. Ordering Information I S P 1 8 0 7 - T ▼ ▼ ▼ I S P 1 8 0 7 T - Z Z ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ Part Number - L R Long range version - E B Evaluation Board(1) - T B Test board (1) - S T Standard Tray or Cut Tape - Jedec Tray Packaging J T - R S Reel of 500 units - R 2 Reel of 2000 units (1) Please see section 5.1 and refer to the following documentation for more information on development kit and test board: http://www.insightsip.
BLE MODULE ISP1807 7. Storage & Soldering information 7.1. Storage and Handling Keep this product away from other high frequency devices which may interfere with operation such as other transmitters and devices generating high frequencies.
BLE MODULE ISP1807 7.3. Soldering information Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.
BLE MODULE ISP1807 8. Quality & User information 8.1. Certifications Bluetooth SIG Declaration ID n° D046560 CE Certified, DoC Insight SiP Ref TR190901 TELEC Certified, n° pending KCC Certification n° R-C-iNs-ISP1807 FCC Certification pending IC Certification pending RoHS and Reach compliant Conflict Mineral Declaration available 8.2. EC – CE Certification This device can be operated in at least one Member State without infringing applicable requirements on the use of radio spectrum. 8.3.
BLE MODULE ISP1807 OEM Responsibilities to comply with FCC - The module is limited to OEM installation only. - The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module. - The antenna(s) must be installed such that a minimum separation distance of at least 20 cm is maintained between the radiator (antenna) and all persons at all times.
BLE MODULE ISP1807 “Contains IC: 11306A-ISP1807” The label of the host device should also include the below IC Statement. When it is not possible, this information should be included in the User Manual of the host device: “This device complies with Industry Canada license-exempt RSS standard(s).
BLE MODULE ISP1807 8.8. Disclaimer Insight SiP’s products are designed and manufactured for general consumer applications, so testing and use of the product shall be conducted at customer’s own risk and responsibility. Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment.
