Specifications

February 18, 2020
Page 15/26
Document Ref: isp_ble_DS1807_R9.docx
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
4.2. SMT Assembly Guidelines
For PCB Land Patterns and Solder Mask layout, Insight SiP recommends using the same dimensions as
module pads, ie 0.4 x 0.4 mm for standard pads and 0.8 x 0.8 mm for corner pads.
Please contact Insight SiP for more detailed information.
4.3. Antenna Keep-Out Zone
For optimal antenna performance, it is recommended to respect a metal exclusion zone to the edge of
the board:no metal, no traces and no components on any application PCB layer except mechanical LGA
pads.