Specifications

February 18, 2020
Page 22/26
Document Ref: isp_ble_DS1807_R9.docx
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
7.3. Soldering information
Recommendation for RoHS reflow process is according to Jedec J–STD-020 and 033 standard profiles.
Preheat/Soak
Temperature Min (T
smin
)
Temperature Max (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
150 °C
200 °C
60-120 sec
Peak package body temperature (T
p
)
260°C
(+0/-5°C)
Classification Temperature (T
c
)
Time (t
p
) maintained above T
C
-5 °C
260 °C
30 sec
Ramp-up rate (T
L
to T
p
)
3 °C/sec max
Ramp-down rate (T
p
to T
L
)
6 °C/sec max
Liquidous temperature (T
L
)
Time (t
L
) maintained above T
L
217 °C
60-150 sec
Time 25 °C to peak temperature
8 mn max