Specifications

February 18, 2020
Page 3/26
Document Ref: isp_ble_DS1807_R9.docx
Insight SiP – Green Side – 400 avenue Roumanille – BP 309 – 06906 Sophia-Antipolis Cedex – France – www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.
BLE MODULE
ISP1807
Contents
1. Block Diagram ........................................................................................................................................ 4
2. Specifications......................................................................................................................................... 5
2.1. Important Notice ............................................................................................................................ 5
2.2. Absolute Maximum Ratings ........................................................................................................... 5
2.3. Operating Conditions .................................................................................................................... 5
2.4. Power Consumption ...................................................................................................................... 6
2.5. Clock Sources ............................................................................................................................... 6
2.6. Radio Specifications ...................................................................................................................... 6
2.7. Range Measurement ..................................................................................................................... 7
2.8. Antenna Performance ................................................................................................................... 7
2.9. Electrical Schematic ...................................................................................................................... 9
3. Pin Description .................................................................................................................................... 10
4. Mechanical Outlines ............................................................................................................................ 13
4.1. Mechanical Dimensions .............................................................................................................. 13
4.2. SMT Assembly Guidelines .......................................................................................................... 15
4.3. Antenna Keep-Out Zone ............................................................................................................. 15
5. Product Development Tools .............................................................................................................. 16
5.1. Hardware .................................................................................................................................... 16
5.2. Firmware ..................................................................................................................................... 16
5.3. Development Tools ..................................................................................................................... 17
6. Packaging & Ordering information ................................................................................................... 18
6.1. Marking ....................................................................................................................................... 18
6.2. Prototype Packaging ................................................................................................................... 18
6.3. Jedec Trays ................................................................................................................................ 18
6.4. Tape and Reel ............................................................................................................................ 19
6.5. Ordering Information ................................................................................................................... 20
7. Storage & Soldering information ....................................................................................................... 21
7.1. Storage and Handling ................................................................................................................. 21
7.2. Moisture Sensitivity ..................................................................................................................... 21
7.3. Soldering information .................................................................................................................. 22
8. Quality & User information ................................................................................................................. 23
8.1. Certifications ............................................................................................................................... 23
8.2. USA – User information .............................................................................................................. 23
8.3. Canada – User information ......................................................................................................... 24
8.4. RF Exposure Information ............................................................................................................ 25
8.5. Informations concernant l'exposition aux fréquences radio (RF) ................................................. 25
8.6. Discontinuity................................................................................................................................ 25
8.7. Disclaimer ................................................................................................................................... 26