Intel Processor Material Declaration Data Sheets (MDDS)

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17.5 Intel Material Declaration Data Sheets

The Material Declaration Data Sheets (MDDS) contained in this chapter are based upon

the format established by the Electronic Industries Alliance (EIA), The European Information and

Communication Technology Association (EICTA) and the Japan Green Procurement Survey

Standardization Initiative (JGPSSI). This format is published as the Joint Industry Guide for Material

Composition Declaration and can be found at: http://www.eia.org/resources/2003-09-19.10.pdf

Most of the data sheets contained in this chapter are based on third-party analytical testing of the product

specified in footnote #2 of each MDDS. If a product is not specified in footnote #2, the data listed in that

MDDS are based on engineering estimates. Data sheets are organized by representative package types

which cover the range of similar products. Since multiple products may be covered by a data sheet, data

are reported in parts per million (ppm). Mass of the product is provided. Mass of individual materials can

be calculated by the user as needed.

MDDSs for other package families will be added to this chapter as they become available. In

addition, existing MDDSs will be updated periodically as additional data becomes available. Users of

MDDS are responsible for consulting this chapter regularly to ensure they are using the most

recent MDDS version.

INTEL ACCEPTS NO DUTY TO NOTIFY USERS ABOUT CHANGES TO AN MDDS. INTEL IS NOT

LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, THAT

THE READER MIGHT INCUR AS A RESULT OF IGNORING THIS WARNING, OR THAT ANY THIRD

PARTY MIGHT SUFFER AS A RESULT OF THE READER'S IGNORING THIS WARNING.

Summary of content (147 pages)

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7.5 Intel Material Declaration Data Sheets The Material Declaration Data Sheets (MDDS) contained in this chapter are based upon the format established by the Electronic Industries Alliance (EIA), The European Information and Communication Technology Association (EICTA) and the Japan Green Procurement Survey Standardization Initiative (JGPSSI). This format is published as the Joint Industry Guide for Material Composition Declaration and can be found at: http://www.eia.org/resources/2003-09-19.10.
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May 2006 To whom it may concern: Intel manufactures a wide range of products, from microprocessors, through embedded controllers, up to complete OEM systems. A large number of subassemblies and components are purchased from other manufacturers. Intel goes to great lengths to make sure all our products meet applicable legal requirements, and we continually monitor changes in those requirements.
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Processor Speed Number Intel® Celeron® processor Intel® Celeron® D processor n/a 256 KB BX80532RC1800B MM# RoHS Compliant Boxed Processor MDDS 863423 N n/a 867092 N n/a 400 MHz 256 KB BX80532RC2000B 852175 N n/a n/a 2.4 GHz 400 MHz 256 KB BX80532RC2400B 852183 N n/a 859735 N n/a n/a 2.5 GHz 400 MHz 256 KB BX80532RC2500B 854307 N n/a n/a 2.6 GHz 400 MHz 256 KB BX80532RC2600B 854947 N n/a 852173 N n/a Link to the MDDS n/a 2.
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355 Intel ® Pentium ® 4 processor 631 641 651 661 Intel ® Pentium ® 4 processor (BTX Type 2) 631 641 651 661 Intel® Pentium® 4 processor Intel® Pentium® 4 processor n/a 3.33 GHz 3.0 GHz 3.20 GHz 3.40 GHz 3.60 GHz 3.0 GHz 3.20 GHz 3.40 GHz 3.60 GHz 2.
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33 MHz 1 MB BX80547PE2800EN 875437 Y 740,741,769 2.80 GHz 533 MHz 1 MB BX80547PE2800EN 875440 N n/a 2.80 GHz 533 MHz 1 MB BX80547PEP280EN 881583 Y 740,741,769 MddsDoc 740 882981 Y 740,741,769 MddsDoc 740 882073 Y 740,741,769 MddsDoc 740 881515 Y 740,741,769 MddsDoc 740 3.06 GHz Intel® Pentium® 4 processor Intel® Pentium® 4 processor (BTX Type 1) Intel® Pentium® 4 processor 533 MHz 1 MB BX80547PE3066E 630 3.0 GHz 800 MHz 2 MB BX80547PG3000F 869547 N n/a 630 3.
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878544 940 3.20 GHz 800 MHz 2 x 2 MB BX80553940T 876601 3.40 GHz 800 MHz 2 x 2 MB BX80553950 876598 (BTX Type 1) 950 728,753 n/a 729,754 MddsDoc 729 Y 728,753 MddsDoc 728 878918 728,753 MddsDoc 728 Y 729,754 MddsDoc 729 729,754 MddsDoc 729 733,755,772 MddsDoc 733 878913 950 3.40 GHz 800 MHz 2 x 2 MB BX80553950T 876599 805 2.66 GHz 533 MHz 2 x 1 MB BX80551PE2666FN 879857 Y 820 2.
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E6400 2.13 GHz 1066 MHz 2 x 2 MB BX805576400 884981 Y E6300 1.86 GHz 1066 MHz 2 x 2 MB BX805576300 884982 Y 1.86 GHz 1066 MHz 2 x 2 MB BX805576300T2 884983 Y 5160 3.0 GHz 1333 MHz 4 MB BX805565160A 884515 Y BX805565160P 884516 Y 5150 2.66 GHz 1333 MHz 4 MB BX805565150A 884530 Y BX805565150P 884532 Y 5140 2.33 GHz 1333 MHz 4 MB BX805565140A 884533 Y BX805565140P 884529 Y 5130 2.0 GHz 1333 MHz 4 MB BX805565130A 884534 Y BX805565130P 884531 Y 5120 1.
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3.20 GHz 800 MHz 2 MB BX80546KG3200FP 867556 N n/a 3.20 GHz 800 MHz 2 MB BX80546KG3200FU 867555 N n/a 3.20 GHz 800 MHz 2 MB BX80546KG3200FU 867560 N n/a 873434 Y 779 N n/a 3.0 GHz 800 MHz 2 MB BX80546KG3200FP 867565 873436 Y 775, 776 3.
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3.20 GHz 3.20 GHz 3.20 GHz 3.40 GHz 3.40 GHz 3.40 GHz 3.60 GHz 3.60 GHz 3.
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2.80 GHz 2.80 GHz 3.06 GHz 3.06 GHz 3.20 GHz 3.20 GHz 533 MHz 533 MHz 533 MHz 533 MHz 533 MHz 533 MHz 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB BX80532KE2800E BX80532KE2800EU BX80532KE3066E BX80532KE3066EU BX80532KE3200E BX80532KE3200EU 858919 N n/a 859264 N n/a 858918 N n/a 859266 N n/a 858915 N n/a 854964 N n/a 854411 N n/a 855690 N n/a 854412 N n/a 855692 N n/a 854413 N n/a 855691 N n/a 854414 N n/a 3.20 GHz 533 MHz 2 MB BX80532KE3200F 858927 N n/a 3.
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Material Declaration Data Sheet Boxed Prescott ICP Skt-N (SDJ) BX80546RExxxxC Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 469.70 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant uFCPGA2-J: Resin Parts (Frame, insulator, etc.) 4700 Brominated Flame Retardant Flame retardant uFCPGA2-J: Resin Parts (Frame, insulator, etc.) 1800 Brominated Flame Retardant Flame retardant Prescott: Epoxy encapsulation material 4730 Nickel Electronic and Mechanical components and materials Prescott: Substrate / SLI 8050 COMMENTS 1.
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Material Declaration Data Sheet Boxed Prescott ICP Skt-T (SDJ) BX80547RExxxxC Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 411.90 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-F: Resin parts (Frame, insulator, etc.) 3300 Brominated Flame Retardant Flame retardant FCLGA4-F: Resin parts (Frame, insulator, etc.) 12000 Brominated Flame Retardant Flame retardant Prescott Skt-T: Epoxy encapsulation material/Subst 1870 Nickel Electronic and Mechanical components and materials Prescott Skt-T: Substrate 12000 COMMENTS 1.
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Material Declaration Data Sheet Boxed CedarMill ATX (SDJ) BX80556x1 Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 512.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 2700 Brominated Flame Retardant Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 9400 Brominated Flame Retardant Flame retardant Cedar Mill 2130 Nickel Electronic and Mechanical components and materials Cedar Mill 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed CedarMill BTX (Type 2) BX80556x1T2 Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 857.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-K: Resin Parts (Frame, Insulator, etc.) 9500 Brominated Flame Retardant Flame retardant FCLGA4-K: Resin Parts (Frame, Insulator, etc.) 37000 Brominated Flame Retardant Flame retardant Cedar Mill: 2130 Nickel Electronic and Mechanical components and materials Cedar Mill: 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed Prescott Skt-T EE (SDJ) BX80547Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 511.90 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 2700 Brominated Flame Retardant Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 9400 Brominated Flame Retardant Flame retardant Prescott: Epoxy encapsulation material/Substrate 1870 Nickel Electronic and Mechanical components and materials Prescott: Substrate 12000 COMMENTS 1.
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Material Declaration Data Sheet Boxed Prescott Skt-T BTX Type-1 MS (SDJ) BX80547PGxxxxxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 991.90 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-G: Resin parts (Frame, insulator, etc.) 10000 Brominated Flame Retardant Flame retardant FCLGA4-G: Resin parts (Frame, insulator, etc.) 39000 Brominated Flame Retardant Flame retardant Prescott Skt-T: Epoxy encapsulation material/Subst 1870 Nickel Electronic and Mechanical components and materials Prescott Skt-T: Substrate 12000 COMMENTS 1.
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Material Declaration Data Sheet Boxed Presler ATX 05A (SDJ) BX805539xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 512.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 2700 Brominated Flame Retardant Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 9400 Brominated Flame Retardant Flame retardant Presler: 2130 Nickel Electronic and Mechanical components and materials Presler: 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed Presler ATX 05B (SDJ) BX805539xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 597.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-D: Resin parts (Frame, Insulator, etc.) 2200 Brominated Flame Retardant Flame retardant FCLGA4-D: Resin parts (Frame, Insulator, etc.) 8300 Brominated Flame Retardant Flame retardant Presler: 2130 Nickel Electronic and Mechanical components and materials Presler: 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed Presler BTX Type-1 (SDJ) BX805539xxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 992.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-G: Resin parts (Frame, insulator, etc.) 10000 Brominated Flame Retardant Flame retardant FCLGA4-G: Resin parts (Frame, insulator, etc.) 39000 Brominated Flame Retardant Flame retardant Presler: 2130 Nickel Electronic and Mechanical components and materials Presler: 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed Presler BTX Type-2 (SDJ) BX805539xxT2 Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 857.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-K: Resin Parts (Frame, Insulator, etc.) 9500 Brominated Flame Retardant Flame retardant FCLGA4-K: Resin Parts (Frame, Insulator, etc.) 37000 Brominated Flame Retardant Flame retardant Presler: 2130 Nickel Electronic and Mechanical components and materials Presler: 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed Smithfield ATX 05A (SDJ) BX80551Pxxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 512.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 2700 Brominated Flame Retardant Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 9400 Brominated Flame Retardant Flame retardant Smithfield: Epoxy encapsulation material/Substrate 15300 Nickel Electronic and Mechanical components and materials Smithfield: Substrate 20900 COMMENTS 1.
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Material Declaration Data Sheet Boxed Smithfield ATX 05A (SDJ) BX80551Pxxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 512.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 2700 Brominated Flame Retardant Flame retardant FCLGA4-A: Resin Parts (Frame, Insulator, etc.) 9400 Brominated Flame Retardant Flame retardant Smithfield: Epoxy encapsulation material/Substrate 15300 Nickel Electronic and Mechanical components and materials Smithfield: Substrate 20900 COMMENTS 1.
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Material Declaration Data Sheet Boxed Smithfield BTX Type-1 (SDJ) BX80551PxxxxxxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 991.90 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-G: Resin parts (Frame, insulator, etc.) 10000 Brominated Flame Retardant Flame retardant FCLGA4-G: Resin parts (Frame, insulator, etc.) 39000 Brominated Flame Retardant Flame retardant Smithfield: Epoxy encapsulation material/Substrate 15300 Nickel Electronic and Mechanical components and materials Smithfield: Substrate 20900 COMMENTS 1.
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Material Declaration Data Sheet Boxed Smithfield BTX Type-2 (SDJ) BX80551PxxxxxT2 Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 856.90 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-K: Resin Parts (Frame, Insulator, etc.) 9500 Brominated Flame Retardant Flame retardant FCLGA4-K: Resin Parts (Frame, Insulator, etc.) 37000 Brominated Flame Retardant Flame retardant Smithfield: Epoxy encapsulation material/Substrate 15300 Nickel Electronic and Mechanical components and materials Smithfield: Substrate 20900 COMMENTS 1.
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Material Declaration Data Sheet Boxed Irwindale Active (NDJ) BX80546KGxxxxFA Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 1017.50 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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LEVEL B MATERIALS AND SUBSTANCES Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) Antimony/Antimony Compounds If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
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Nickel Electronic and Mechanical components and materials uFCPGA4-A: Zener diode 200000 Nickel Electronic and Mechanical components and materials uFCPGA4-A: Resistor 35900 Nickel Electronic and Mechanical components and materials uFCPGA4-A: Shaft 1900 Nickel Electronic and Mechanical components and materials uFCPGA4-A: Ball bearing (outer ring) 90000 Nickel Electronic and Mechanical components and materials uFCPGA4-A: Ball bearing (inner ring) 90000 Nickel Electronic and Mechanical comp
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Material Declaration Data Sheet Boxed Prescott Skt-T (SDJ) BX80547Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 411.90 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-F: Resin parts (Frame, insulator, etc.) 3300 Brominated Flame Retardant Flame retardant FCLGA4-F: Resin parts (Frame, insulator, etc.) 12000 Brominated Flame Retardant Flame retardant Prescott Skt-T: Epoxy encapsulation material/Subst 1870 Nickel Electronic and Mechanical components and materials Prescott Skt-T: Substrate 12000 COMMENTS 1.
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Material Declaration Data Sheet Boxed Prescott Skt-T (NDJ) BX80547Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 356.90 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below. Nickel Description of Use Location in Product Material Concentration (ppm) Electronic and Mechanical components and materials Prescott: Substrate 12000 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80547Pxxxxxx.
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Material Declaration Data Sheet Boxed Prescott ICP Skt-N (NDJ) BX80546RExxxxC Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 459.70 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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LEVEL B MATERIALS AND SUBSTANCES Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) Antimony/Antimony Compounds If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
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2. This data sheet is based on the product specified and other packages are assumed to be similar. 3. Data in parts per million (ppm) can be used to estimate content for other packages assumed to be similar. 4. Material mass can be estimated by multiplying concentration (ppm) by product weight. 5. The remainder of this package consists of non-reportable metals (e.g., tin, iron, etc), epoxy resin and other non-metal materials.
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Material Declaration Data Sheet Boxed Prescott ICP Skt-T (NDJ) BX80547RExxxxC Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 356.90 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
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1. The information on materials and substances listed above is based on the following package: Item Market Name BX80547RExxxxC. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed Dothan processors BX80536xxxxxxxx, BXM80536xxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 4.80 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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1. The information on materials and substances listed above is based on the following package: Item Market Name BX80536xxxxxxxx, BXM80536xxxxxxx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed Yonah processor BX80538xxx, BX80538Txxxx, BX80539Tx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 6.40 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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1. The information on materials and substances listed above is based on the following package: Item Market Name BX80538xxx, BX80538Txxxx, BX80539Tx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed Sossaman BX80539KFxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 6.30 Manufacturer: Intel Corporation Revision Date: 6/20/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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1. The information on materials and substances listed above is based on the following package: Item Market Name BX80539KFxxxxxx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed CedarMill ATX (NDJ) BX80556x1 Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 472.40 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
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Nickel Electronic and Mechanical components and materials FCLGA4-A: Zener diode 200000 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 35900 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 29100 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80556x1.
PAGE 61
Material Declaration Data Sheet Boxed Prescott Skt-T EE (NDJ) BX80547Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 471.90 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 62
Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 63
Nickel Electronic and Mechanical components and materials FCLGA4-A: Zener diode 200000 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 35900 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 29100 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80547Pxxxxxx.
PAGE 64
Material Declaration Data Sheet Boxed Prescott Skt-T BTX Type-1 MS (NDJ) BX80547PGxxxxxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 196.10 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 65
LEVEL B MATERIALS AND SUBSTANCES Antimony/Antimony Compounds Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 66
Nickel Electronic and Mechanical components and materials FCLGA4-G: Zener diode 200000 Nickel Electronic and Mechanical components and materials FCLGA4-G: Resistor 35900 Nickel Electronic and Mechanical components and materials FCLGA4-G: Resistor 29100 Nickel Electronic and Mechanical components and materials FCLGA4-G: Shaft 1900 Nickel Electronic and Mechanical components and materials FCLGA4-G: Ball bearing (outer ring) 90000 Nickel Electronic and Mechanical components and materials
PAGE 67
Material Declaration Data Sheet Boxed Prescott Skt-T BTX Type-1 Performance (NDJ) BX80547PGxxxxxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 911.90 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.
PAGE 68
LEVEL B MATERIALS AND SUBSTANCES Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) Antimony/Antimony Compounds If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 69
Nickel Electronic and Mechanical components and materials FCLGA4-H: Capacitor 62000 Nickel Electronic and Mechanical components and materials FCLGA4-H: Capacitor 27000 Nickel Electronic and Mechanical components and materials FCLGA4-H: Zener diode 200000 Nickel Electronic and Mechanical components and materials FCLGA4-H: Resistor 36100 Nickel Electronic and Mechanical components and materials FCLGA4-H: Resistor 29100 Nickel Electronic and Mechanical components and materials FCLGA4-H: B
PAGE 70
Material Declaration Data Sheet Boxed Presler ATX 05A (NDJ) BX805539xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 472.40 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 71
Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 72
Nickel Electronic and Mechanical components and materials FCLGA4-A: Zener diode 200000 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 35900 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 29100 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX805539xx.
PAGE 73
Material Declaration Data Sheet Boxed Presler ATX 05B (NDJ) BX805539xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 597.40 Manufacturer: Intel Corporation Revision Date: 6/21/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 74
Description of Use Location in Product Material Concentration (ppm) Antimony FCLGA4-D: Housing 58000 Antimony FCLGA4-D: Insulator (lower) 100000 Antimony FCLGA4-D: Connector 6900 Antimony FCLGA4-D: Impeller 58000 Antimony FCLGA4-D: Diode 8500 Antimony FCLGA4-D: Diode 5700 Antimony FCLGA4-D: Drive IC 5100 Antimony FCLGA4-D: Drive IC 13100 Antimony FCLGA4-D: Hall element 12000 Antimony FCLGA4-D: Transistor 6600 Bismuth FCLGA4-D: Thermistor 6980 Brominated Flame Retardant F
PAGE 75
1. The information on materials and substances listed above is based on the following package: Item Market Name BX805539xx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 76
Material Declaration Data Sheet Boxed Presler BTX Type-1 (NDJ) BX805539xxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 196.60 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 77
Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 78
1. The information on materials and substances listed above is based on the following package: Item Market Name BX805539xxT. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 79
Material Declaration Data Sheet Boxed Smithfield ATX 05A (NDJ) BX80551Pxxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 471.90 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 80
LEVEL B MATERIALS AND SUBSTANCES Antimony/Antimony Compounds Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 81
Nickel Electronic and Mechanical components and materials FCLGA4-A: Capacitor 29000 Nickel Electronic and Mechanical components and materials FCLGA4-A: Capacitor 65000 Nickel Electronic and Mechanical components and materials FCLGA4-A: Zener diode 200000 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 35900 Nickel Electronic and Mechanical components and materials FCLGA4-A: Resistor 29100 COMMENTS 1.
PAGE 82
Material Declaration Data Sheet Boxed Smithfield ATX 05B (NDJ) BX80551Pxxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 546.90 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 83
LEVEL B MATERIALS AND SUBSTANCES Antimony/Antimony Compounds Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 84
Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-D: Housing 58000 Antimony Flame retardant FCLGA4-D: Insulator (lower) 100000 Antimony Flame retardant FCLGA4-D: Connector 6900 Antimony Flame retardant FCLGA4-D: Impeller 58000 Antimony Flame retardant FCLGA4-D: Diode 8500 Antimony Flame retardant FCLGA4-D: Diode 5700 Antimony Flame retardant FCLGA4-D: Drive IC 5100 Antimony Flame retardant FCLGA4-D: Drive IC 13100 Antimony
PAGE 85
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551Pxxxxxxx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 86
Material Declaration Data Sheet Boxed Smithfield BTX Type-1 (NDJ) BX80551PxxxxxxT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 196.10 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 87
Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 88
COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551PxxxxxxT. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 89
Material Declaration Data Sheet Boxed Paxville-DP Active (NDJ) BX80551KG2800HA Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 1030.50 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 90
Description of Use Location in Product Material Concentration (ppm) Lead/Lead Compounds Electronic Components and Materials Paxville-DP: FLI 1320 Lead/Lead Compounds Electronic Components and Materials uFCPGA4-A: Bearing housing 25000 Lead/Lead Compounds Electronic Components and Materials uFCPGA4-A: Diode 925000 Lead/Lead Compounds Electronic Components and Materials uFCPGA4-A: Zener diode 251400 Lead/Lead Compounds Electronic Components and Materials uFCPGA4-A: Drive IC 881000 Lead/
PAGE 91
Brominated Flame Retardant Flame retardant uFCPGA4-A: Drive IC 5100 Brominated Flame Retardant Flame retardant uFCPGA4-A: Drive IC 13100 Brominated Flame Retardant Flame retardant uFCPGA4-A: PCB 150000 Brominated Flame Retardant Flame retardant uFCPGA4-A: Transistor 17500 Brominated Flame Retardant Flame retardant uFCPGA4-A: Transistor 8800 Brominated Flame Retardant Flame retardant uFCPGA4-A: Transistor 20800 Brominated Flame Retardant Flame retardant Paxville-DP: Epoxy encapsulat
PAGE 92
Material Declaration Data Sheet Boxed Prescott ICP Skt-N (FJJ) BX80546RExxxxC Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 469.70 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 93
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below. Description of Use Location in Product Material Concentration (ppm) COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546RExxxxC.
PAGE 94
Material Declaration Data Sheet Boxed Prescott ICP Skt-T (FJJ) BX80547RExxxxC Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 376.70 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 95
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80547RExxxxC. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 96
Material Declaration Data Sheet Boxed CedarMill ATX (FJJ) BX80556x1 Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 484.40 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 97
Nickel Description of Use Location in Product Material Concentration (ppm) Electronic and Mechanical components and materials Cedar Mill: 7710 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80556x1. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems.
PAGE 98
Material Declaration Data Sheet Boxed Prescott Skt-T (FJJ) BX80547Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 376.70 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 99
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80547Pxxxxxx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 100
Material Declaration Data Sheet Boxed Prescott Skt-T EE (FJJ) BX80547Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 483.90 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 101
Nickel Description of Use Location in Product Material Concentration (ppm) Electronic and Mechanical components and materials Prescott: Substrate 12000 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80547Pxxxxxx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems.
PAGE 102
Material Declaration Data Sheet Boxed Presler ATX 05A (FJJ) BX805539xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 484.40 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 103
Nickel Description of Use Location in Product Material Concentration (ppm) Electronic and Mechanical components and materials Presler: 7710 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX805539xx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems.
PAGE 104
Material Declaration Data Sheet Boxed Smithfield ATX 05A (FJJ) BX80551Pxxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 483.90 Manufacturer: Intel Corporation Revision Date: 6/22/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 105
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below. Nickel Description of Use Location in Product Material Concentration (ppm) Electronic and Mechanical components and materials Smithfield: Substrate 20900 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551Pxxxxxxx.
PAGE 106
Material Declaration Data Sheet Boxed Irwindale Active (FJJ) BX80546KGxxxxFA Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 962.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 107
COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546KGxxxxFA. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 108
Material Declaration Data Sheet Boxed Irwindale 2U Passive (FJJ) BX80546KGxxxxFP, BX80546JG3000FP Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 1062.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.
PAGE 109
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546KGxxxxFP, BX80546JG3000FP. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 110
Material Declaration Data Sheet Boxed Irwindale 2U Passive (FRJ) BX80546KGxxxxFP, BX80546JG3000FP Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 982.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.
PAGE 111
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546KGxxxxFP, BX80546JG3000FP. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 112
Material Declaration Data Sheet Boxed Irwindale 1U Passive BX80546KGxxxxFU, BX80546JG3000FU Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 597.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 113
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546KGxxxxFU, BX80546JG3000FU. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 114
Material Declaration Data Sheet Boxed Paxville-DP Active (FJJ) BX80551KG2800HA Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 975.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 115
Description of Use Location in Product Material Concentration (ppm) Brominated Flame Retardant Flame retardant Paxville-DP: Epoxy encapsulation material 10400 Nickel Electronic and Mechanical components and materials Paxville-DP: Substrate / SLI 5250 COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551KG2800HA.
PAGE 116
Material Declaration Data Sheet Boxed Paxville-DP 2U Passive (FJJ) BX80551KG2800HP Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 1075.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 117
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551KG2800HP. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 118
Material Declaration Data Sheet Boxed Paxville-DP 1U Passive BX80551KG2800HU Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 610.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 119
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551KG2800HU. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 120
Material Declaration Data Sheet Boxed Paxville-DP 2U Passive (FRJ) BX80551KG2800HP Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 995.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 121
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80551KG2800HP. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 122
Material Declaration Data Sheet Boxed Paxville-MP BX80560Kxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 570.60 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 123
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80560Kxxxxxx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 124
Material Declaration Data Sheet Boxed Dempsey Active (NDJ) BX805550x0A Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 742.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 125
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
PAGE 126
Nickel Electronic and Mechanical components and materials LGA771-A: Ball bearing (board) 89900 Nickel Electronic and Mechanical components and materials LGA771-A: Coil Spring 84100 Nickel Electronic and Mechanical components and materials LGA771-A: Heat sink (spacer) 91800 Nickel Electronic and Mechanical components and materials LGA771-A: Heat sink (screw) 96000 Nickel Electronic and Mechanical components and materials LGA771-A: Heat sink (coil spring) 84400 Nickel Electronic and Mecha
PAGE 127
Material Declaration Data Sheet Boxed Dempsey Passive (FJJ) BX805550x0P Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 1062.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 128
1. The information on materials and substances listed above is based on the following package: Item Market Name BX805550x0P. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
PAGE 129
Material Declaration Data Sheet Boxed Dempsey Passive (FRJ) BX805550x0P Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 982.50 Manufacturer: Intel Corporation Revision Date: 6/23/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
PAGE 130
1. The information on materials and substances listed above is based on the following package: Item Market Name BX805550x0P. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed CedarMill ICP (SDJ) BX805523xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 411.90 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant FCLGA4-F: Resin parts (Frame, insulator, etc.) 3300 Brominated Flame Retardant Flame retardant FCLGA4-F: Resin parts (Frame, insulator, etc.) 12000 Brominated Flame Retardant Flame retardant Cedar Mill 2130 Nickel Electronic and Mechanical components and materials Cedar Mill 7710 COMMENTS 1.
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Material Declaration Data Sheet Boxed CedarMill ICP (NDJ) BX805523xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 356.90 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
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1. The information on materials and substances listed above is based on the following package: Item Market Name BX805523xx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed CedarMill ICP (FJJ) BX805523xx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 376.70 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX805523xx. Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems. Material content listed for individual components are engineering model approximations based on supplier data and/or analytical testing.
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Material Declaration Data Sheet Boxed Prescott Skt-N (SDJ) BX80546Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 469.70 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Antimony Flame retardant uFCPGA2-J: Resin Parts (Frame, insulator, etc.) 4700 Brominated Flame Retardant Flame retardant uFCPGA2-J: Resin Parts (Frame, insulator, etc.) 1800 Brominated Flame Retardant Flame retardant Prescott: Epoxy encapsulation material 4730 Nickel Electronic and Mechanical components and materials Prescott: Substrate / SLI 8050 COMMENTS 1.
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Material Declaration Data Sheet Boxed Prescott Skt-N (NDJ) BX80546Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 459.70 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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LEVEL B MATERIALS AND SUBSTANCES Bismuth/Bismuth Compounds Phthalates Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC) Antimony/Antimony Compounds If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below.
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2. This data sheet is based on the product specified and other packages are assumed to be similar. 3. Data in parts per million (ppm) can be used to estimate content for other packages assumed to be similar. 4. Material mass can be estimated by multiplying concentration (ppm) by product weight. 5. The remainder of this package consists of non-reportable metals (e.g., tin, iron, etc), epoxy resin and other non-metal materials.
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Material Declaration Data Sheet Boxed Prescott Skt-N (FJJ) BX80546Pxxxxxx Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 469.70 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm, those materials/substances are listed below. Description of Use Location in Product Material Concentration (ppm) COMMENTS 1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546Pxxxxxx.
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Material Declaration Data Sheet Boxed Smithfield BTX Type-1 Performance (NDJ) BX80551PGxxxxFT Pb Free Product: Yes-Second Level Interconnect Product Weight (grams): 911.90 Manufacturer: Intel Corporation Revision Date: 6/29/2006 Restrictions on Hazardous Substances (RoHS) Compliance RoHS Definition * Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) * Quantity limit of 0.
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Description of Use Location in Product Material Concentration (ppm) Lead/Lead Compounds Electronic Components and Materials Smithfield: FLI 2010 Lead/Lead Compounds Electronic Components and Materials FCLGA4-H: Bearing Housing 25000 Lead/Lead Compounds Electronic Components and Materials FCLGA4-H: Diode 935000 Lead/Lead Compounds Electronic Components and Materials FCLGA4-H: Drive IC 881000 Lead/Lead Compounds Electronic Components and Materials FCLGA4-H: Transistor 925000 Lead/Lead C
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Brominated Flame Retardant Flame retardant FCLGA4-H: Drive IC 8200 Brominated Flame Retardant Flame retardant FCLGA4-H: Drive IC 13100 Brominated Flame Retardant Flame retardant FCLGA4-H: Drive IC 12500 Brominated Flame Retardant Flame retardant FCLGA4-H: Transistor 17500 Brominated Flame Retardant Flame retardant FCLGA4-H: Transistor 8800 Brominated Flame Retardant Flame retardant FCLGA4-H: Transistor 20800 Brominated Flame Retardant Flame retardant Smithfield: Epoxy encapsulation