Intel Processor Material Declaration Data Sheets (MDDS)

Material Declaration Data Sheet
Boxed Irwindale Active (FJJ)
BX80546KGxxxxFA
Pb Free Product: Yes-Second Level Interconnect
Product Weight (grams): 962.50
Manufacturer: Intel Corporation
Restrictions on Hazardous Substances (RoHS) Compliance
RoHS Definition
* Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium,
Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE)
* Quantity limit of 0.01% by mass (100 PPM) of homogeneous material for: Cadmium
* The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following
exemption: Lead in high melting temperature type solders (i.e. lead based solder alloys containing 85% by weight or more lead).
* The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following
exemption: Lead in electronic ceramic parts (e.g. piezoelectronic devices).
* The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following
exemption: Lead in optical and filter glass.
* The part does not contain RoHS restricted substances per the definition above except lead, which is used under the following
exemption: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip
Chip packages.
Where the part is declared to meet RoHS requirements, it has been verified to be in conformance with 2002/95/EC as we currently
understand the requirements. Intel has systems in place to verify conformance with all applicable environmental requirements and to the
best of our knowledge the information is true and correct.
RoHS Declaration
LEVEL A MATERIALS AND SUBSTANCES
Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed in the table below are not
contained in this product in quantities above the threshold level for these materials as stated in the EIA/EICTA/JGPSSI Material
Composition Declaration Guide, nor intentionally added to this product.
Hexavalent Chromium Polybrominated Diphenylethers (PBDEs)
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Hexavalent Chromium Compounds Polychlorinated Biphenyls (PCBs) Tributyl Tin Oxide (TBTO)
Cadmium / Cadmium Compounds Polybrominated Biphenyls (PBBs) Shortchain Chlorinated Paraffins
Asbestos Mercury / Mercury Compounds Polychlorinated Naphthalenes
Azo colorants Ozone Depleting Substances Radioactive Substances
LEVEL B MATERIALS AND SUBSTANCES
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the
threshold level of 1000 ppm, those materials/substances are listed below.
Nickel
Electronic and Mechanical
components and materials
Irwindale: Substrate / SLI 5620
Brominated Flame
Retardant
Flame retardant Irwindale: Epoxy
encapsulation material
5810
Description of Use Location in Product Material Concentration
(ppm)
Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC)
Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds
Antimony/Antimony Compounds Bismuth/Bismuth Compounds Phthalates
Intel understands RoHS requires: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance
thresholds as defined by the EU or (2) an approved exemption applies. (Note: RoHS implementation details are not fully defined and
may change.)
6/23/2006Revision Date:
If this product contains lead (Pb) above the threshold limit of 1000 ppm, the concentration, location and use for this product are
listed below.
Lead/Lead Compounds Electronic Components and
Materials
uFCPGA4-A: Fan 989971
Description of Use Location in Product Material Concentration
(ppm)