Intel Processor Material Declaration Data Sheets (MDDS)

LEVEL B MATERIALS AND SUBSTANCES
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the
threshold level of 1000 ppm, those materials/substances are listed below.
COMMENTS
1. The information on materials and substances listed above is based on the following package: Item Market Name BX80546RExxxxC.
Material content listed at the product level are based on analytical testing intended to validate Intel’s RoHS Compliance Systems.
Material content listed for individual components are engineering model approximations based on supplier data and/or analytical
testing. Results may vary due to differences in production and /or sensitivities of the methods and tools used for analytical testing and
modeling. Intel's certification of RoHS compliance at the homogenous material level is based on Supplier Declarations of
Conformance.
Nickel
Electronic and Mechanical
components and materials
uFCPGA2-J: Ball bearing
(inner ring):
20000
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Ball bearing
(ball):
40000
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Ball bearing
(board):
91500
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: Drive IC 13100
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: PCB 23000
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Ball bearing
(outer ring)
20000
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Coil spring 84100
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Zener diode 200000
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Resistor 35900
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Resistor 23100
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Shaft 1900
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Capacitor 29000
Nickel Electronic and Mechanical
components and materials
uFCPGA2-J: Capacitor 65000
Antimony Flame retardant uFCPGA2-J: Diode 5700
Antimony Flame retardant uFCPGA2-J: Hall element 12000
Antimony Flame retardant uFCPGA2-J: Drive IC 13100
Antimony Flame retardant uFCPGA2-J: Insulator
(Lower)
100000
Antimony Flame retardant uFCPGA2-J:Impeller 58000
Antimony Flame retardant uFCPGA2-J:Housing 58000
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: Housing 100000
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: Diode 14400
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: Hall element 8000
Bismuth Main Material uFCPGA2-J: Thermistor 6980
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: Insulator
(Lower)
100000
Brominated Flame
Retardant
Flame retardant uFCPGA2-J: Impeller 100000
Description of Use Location in Product Material Concentration
(ppm)
Beryllium/Beryllium Compounds Nickel/Nickel Compounds Vinyl Chloride Polymer (PVC)
Arsenic/Arsenic Compounds Brominated Flame Retardants Selenium/Selenium Compounds
Antimony/Antimony Compounds Bismuth/Bismuth Compounds Phthalates