R Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.
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R Contents 1 Introduction ..........................................................................................................................7 1.1 1.2 1.3 Document Goals and Scope...................................................................................7 1.1.1 Importance of Thermal Management......................................................7 1.1.2 Document Goals......................................................................................7 1.1.3 Document Scope...............
R 3.4.6 3.4.7 3.4.8 4 Intel Thermal Mechanical Reference Design Information .................................................41 4.1 4.2 4.3 5 Operating System and Application Software Considerations................37 Legacy Thermal Management Capabilities ...........................................37 3.4.7.1 Thermal Diode .....................................................................38 3.4.7.2 THERMTRIP# ......................................................................39 3.4.7.
R Figures Figure 1. Processor Case Temperature Measurement Location ......................................13 Figure 2. Processor Thermal characterization parameter Relationships ..........................18 Figure 3. Guideline Locations for Measuring Local Ambient Temperature for an Active Heatsink (not to scale)................................................................................................20 Figure 4.
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Introduction R 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component, and in particular its electrical circuits, is expected to meet its specified performance.
Introduction R Chapter 4 provides information on the Intel reference cooling solution for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process that covers the entire life of the processor. This section focuses on the reference solution that has been developed to support the end of life of the processor. The physical dimensions and thermal specifications of the processor that may be used in this document are for illustration only.
Introduction R 1.3 Definition of Terms Term TA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. TE The ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. TC The case temperature of the processor, measured at the geometric center of the topside of the IHS.
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Mechanical Requirements R 2 Mechanical Requirements 2.1.1 Processor Package The Pentium 4 processor with 512-KB L2 cache on 0.13 micron process is packaged in a FlipChip Pin Grid Array 2 (FC-PGA2) package technology and often referred as the 478-pin package. Refer to the Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Datasheet for detailed mechanical specifications. The package includes an integrated heat spreader (IHS).
Mechanical Requirements R 2.1.2 Heatsink Attach There are no features on the mPGA478 socket to directly attach a heatsink. Therefore, a mechanism must be designed to support the heatsink. In addition to holding the heatsink into place on top of the IHS, this mechanism plays a significant role in the robustness of the system in which it is implemented. In particular: • Ensuring thermal performance of the thermal interface material used between the IHS and the heatsink.
Thermal Specifications R 3 Thermal Specifications 3.1 Processor Case Temperature and Power Dissipation Refer to the Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Datasheet for processor thermal specifications. Thermal specifications for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process are given in terms of maximum case temperature specification and thermal design power (TDP).
Thermal Specifications R 3.2 Designing a Cooling Solution for the Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process 3.2.1 Heatsink Design Considerations To remove the heat from the processor, three basic parameters have to be considered: • The extension of the surface on which the heat exchange takes place. Without any additional enhancements, this is the surface of the processor package IHS.
Thermal Specifications R 3.2.1.1 Thermal Interface Material Thermal interface material application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier and allow direct heatsink attach, without the need for a separate thermal interface material dispense or attach process in the final assembly factory.
Thermal Specifications R 3.2.2 Looking at the Whole Thermal Solution 3.2.2.1 Chassis Thermal Design Capabilities Only chassis capable of TA equal or lower than 45°C can be used for the Pentium 4 Processor with 512-KB L2 Cache on 0.13 micron process to support frequencies between 1.20 GHz thru 2.80 GHz. Chassis that do not meet this recommendation may require more sophisticated, and thus more expensive, cooling solution on the processor to compensate the lack of performance of the chassis.
Thermal Specifications R 3.2.2.3 Characterizing Cooling Performance Requirements The notion of a “thermal characterization parameter” is convenient to characterize the performance needed for the cooling solution and to compare cooling solutions in identical situations. Be aware, however, of its limitation when it comes to a real design. Heat transfer is a three-dimensional phenomenon that can rarely be accurately and easily modeled by lump values.
Thermal Specifications R Figure 2 illustrates the combination of the different thermal characterization parameters. Figure 2. Processor Thermal characterization parameter Relationships TA ΨSA HEATSINK TS TIM PROCESSOR ΨCS TC IHS ΨCA SOCKET 3.2.2.
Thermal Specifications R 3.3 Thermal Metrology for the Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process 3.3.1 Processor Cooling Solution Performance Assessment This section discusses guidelines for testing thermal solutions, including measuring processor temperatures. In all cases, power dissipation and temperature measurements must be made to validate a cooling solution.
Thermal Specifications R memory cards, AGP card, chipset heatsink, and hard drive(s). If a barrier is used, the thermocouple can be taped directly to the barrier at the horizontal locations as previously described, half way between the fan hub and the fan housing. If a variable speed fan is used, it may be useful to add a thermocouple taped to the barrier above the location of the temperature sensor used by the fan to check its speed setting against air temperature.
Thermal Specifications R Figure 4. Guideline Locations for Measuring Local Ambient Temperature for a Passive Heatsink (not to scale) 3.3.3 Processor Case Temperature Measurement Guidelines To ensure functionality and reliability, the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process is specified for proper operation when TC is maintained at or below the value listed in the Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Datasheet.
Thermal Specifications R 3.3.3.1 Thermocouple Attachment Thermocouples are often used to measure TC. Before any temperature measurements are made, the thermocouples must be calibrated. This section describes the procedure for attaching a thermocouple to the IHS for the case temperature (TC) measurement. 1. 2.
Thermal Specifications R Figure 6. Location of Kapton* Tape for Temporary Bond 7. 8. With the thermocouple temporarily held to the part, apply epoxy to the thermocouple bead for a permanent bond. If applying Omegabond 101 epoxy, a small piece of paper works well for mixing. Follow the manufacturer’s instructions for mixing. Use the Exacto* knife or similar to apply the epoxy to the thermocouple bead. Dab glue on the bead and the exposed wires.
Thermal Specifications R 3.3.3.2 Heatsink Preparation – Rectangular (Cartesian) Geometry To measure the case temperature, a heatsink must be mounted on the processor or TTV to dissipate the heat to the environment. The heatsink base must be grooved to allow a thermocouple to be routed from the center of the heatsink without altering the IHS for heatsink attachment. The groove in the heatsink has two features. The first is a 4.5 mm (0.
Thermal Specifications R Figure 9. Heatsink Bottom Groove Dimensions NOTES: 1. Applies to rectangular or cylindrical heatsink base 2. The groove depth (including the circle area) is 0.6 to 1.0 mm (0.025 to 0.040 inches) 3.3.3.3 Heatsink Preparation – Radial (Cylindrical) Geometry For some heatsinks that have a radial geometry (see Figure 10), it may be necessary to locate the center of the heatsink using features in the fin pattern.
Thermal Specifications R Figure 10. Radial Heatsink Geometry a d o b c 3.3.3.4 Thermal Measurement 1. 2. 3. 4. 5. 6. 7. Attach a thermocouple at the center of the package (IHS-side) using the proper thermocouple attach procedure (refer to Section 3.3.3.1). Connect the thermocouple to a thermocouple meter. Mill groove on heatsink base (refer to Section 3.3.3.2 or to Section 3.3.3.3). Apply thermal interface material to either IHS top surface or on the surface of heatsink base.
Thermal Specifications R 3.3.4 Thermal Test Vehicle Information 3.3.4.1 Introduction The Pentium 4 processor with 512-KB L2 cache on 0.13 micron process Thermal Test Vehicle (TTV) is a FC-PGA2 package assembled with a thermal test die. The TTV is designed for use in platforms targeted for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process. The Pentium 4 processor TTVs are in limited supply; contact your local Intel field office for eligibility and availability.
Thermal Specifications R 3.3.4.2 Thermal Test Die A resistance-type heater covers nearly the entire surface area of the test die and is used to simulate the heat generation of an actual processor die. The room temperature resistance of the ITVN1 heater is about 60 Ω, ±5% and the QEL0 heater is about 51 Ω, ±5%. This resistance value will increase as the die temperature increases. The heater is connected to external pins so that it can be powered by an external DC power supply.
Thermal Specifications R The TTV heater can be accessed by attaching wires to the processor power and ground planes by tapping through voltage regulator capacitor pads (See Figure 13). Figure 13. Mainboard Wire Attach Location for TTV Heater Access It is recommended the resistance between the power and ground planes be measured with the socket empty to make sure that the planes are separated (i.e., open circuit). See Figure 14. Figure 14.
Thermal Specifications R The recommended DC-power supply rating is listed in Table 1. The power supply should be able to deliver more current if necessary to cover for die resistance variations. Table 1. Recommended DC Power Supply Ratings Target Die Power Level Power Supply Rating 20 W 40 V and 1 A 25 W 45 V and 1 A 30 W 45 V and 1 A 35 W 50 V and 1 A 40 W 55 V and 1 A 50 W 60 V and 1.5 A 60 W 65 V and 1.5 A 70 W 70 V and 1.5 A 75 W 75 V and 1.
Thermal Specifications R 3.3.4.4 Thermal Measurements Refer to Section 3.3.2 for TA measurement methodology. Refer to Section 3.3.3.1 for thermocouple attachment to the IHS and to Section 3.3.3.2 and Section 3.3.3.3 for the heatsink preparation. For TTV thermal measurement itself, use the following instructions, instead of the general thermal measurement instructions given in Section 3.3.3.4: 1.
Thermal Specifications R 9. Refer to Section 3.3.2 to setup the thermocouples used for TA measurement, and connect them to a thermocouple meter. 10. Set the voltage of the DC power supply to the value calculated from the targeted power level and the heater resistance, if the DC-power supplier uses a voltage-control mode e.g., Voltage = Heater Resistance × Power . Alternatively, an appropriate current can be set to the DC-power supplier if the DC-power supplier uses a current-control mode. 11.
Thermal Specifications R 3.4 Thermal Management Logic and Thermal Monitor Feature 3.4.1 Processor Power Dissipation An increase in processor operating frequency not only increases system performance, but also increases the processor power dissipation. The relationship between frequency and power is generalized in the following equation: P=CV2F (where P = power, C = capacitance, V = voltage, F = frequency).
Thermal Specifications R above so that external thermocouples are no longer needed. By using an accurate on-die temperature sensing circuit and a fast acting temperature control circuit, the processor can rapidly initiate thermal management control. As a result, added thermal margins can be significantly reduced and the resulting system performance impact can be minimized if not eliminated. 3.4.2 Thermal Monitor Implementation On the Pentium 4 processor with 512-KB L2 cache on 0.
Thermal Specifications R An ACPI register, performance counter registers, status bits in model specific register (MSR), and the PROCHOT# output pin are available to monitor and control the Thermal Monitor. Figure 17. Concept for Clocks under Thermal Monitor Control PROCHOT# Normal clock Internal clock Duty cycle control Resultant internal clock 3.4.3 Bi-Directional PROCHOT# The Pentium 4 processor with 512-KB L2 cache on 0.
Thermal Specifications R multiple PROCHOT# transitions around the trip point. External hardware can monitor PROCHOT# and generate an interrupt whenever there is a transition from active-to-inactive or inactive-to-active. PROCHOT# can also be configured to generate an internal interrupt which would initiate an OEM supplied interrupt service routine. Regardless of the configuration selected, PROCHOT# will always indicate the thermal status of the processor.
Thermal Specifications R A system designed to meet the TDP and TC targets published in the Intel® Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process Datasheet greatly reduces the probability of real applications causing the thermal control circuit to activate under normal operating conditions. Systems that do not meet these specifications could be subject to frequent activation of the thermal control circuit depending upon ambient air temperature and application power profile.
Thermal Specifications R 3.4.7.1 Thermal Diode The Pentium 4 processor with 512-KB L2 cache on 0.13 micron process incorporates an on-die thermal diode, which can be used with an external device (thermal diode sensor) to monitor longterm temperature trends. By averaging this data over long time periods (hours/days vs. min/sec), it may be possible to derive a trend of the processor temperature.
Thermal Specifications R 3.4.7.2 THERMTRIP# In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon temperature has reached approximately ~135 °C. At this point the system bus signal THERMTRIP# goes active and power needs to be removed from the processor. THERMTRIP# stays active until RESET# has been initiated. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles.
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Intel Thermal Mechanical Reference Design Information R 4 Intel Thermal Mechanical Reference Design Information Intel develops thermal and mechanical reference components to demonstrate cooling capabilities for current and future microprocessors. This section outlines the requirements used in developing and evaluating these reference designs. Taking into account the wide heatsink performance range needed to support the entire life of the Pentium 4 Processor with 512-KB L2 cache on 0.
Intel Thermal Mechanical Reference Design Information R 4.1 Intel Validation Criteria for the Reference Design 4.1.1 Acoustics To optimize acoustic emission by the fan heatsink assembly, it is recommended to develop a solution with a variable speed fan. It allows attaining thermal performance requirements at higher fan inlet temperatures (TA) and lower noise at lower fan inlet temperatures.
Intel Thermal Mechanical Reference Design Information R 4.1.4 Fan Performance for Active Heatsink Thermal Solution The fan power requirement for proper operation is a maximum current of 740 mA at 12 V. In addition to comply with overall thermal requirements (Section 4.1.1), and the general environmental reliability requirements (Section 4.1.5) the fan should meet the following performance requirements: • The expected fan minimum functional lifetime is 40,000 hours at 45 °C.
Intel Thermal Mechanical Reference Design Information R Figure 19. Random Vibration PSD 0.1 3.13GRMS (10 minutes per axis) PSD (g^2/Hz) (20, 0.02) (500, 0.02) (5, 0.01) 0.01 5 Hz 500 Hz 0.001 1 10 100 1000 Frequency (Hz) 4.1.5.3 Shock Test Procedure Recommended performance requirement for a motherboard: • Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e., total 18 drops). • Profile: 50 G trapezoidal waveform, 11 ms duration, 170 in./s minimum velocity change.
Intel Thermal Mechanical Reference Design Information R 4.1.5.4 Recommended Test Sequence Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that have never been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/CPU/Memory test (refer to Section 4.1.6.2). The stress test should be then followed by a visual inspection and then BIOS/CPU/Memory test. 4.1.5.
Intel Thermal Mechanical Reference Design Information R 4.1.6.2 Recommended BIOS/CPU/Memory Test Procedures This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational motherboard that has NOT been exposed to any battery of tests prior to the test being considered.
Intel Thermal Mechanical Reference Design Information R 4.1.7 Material and Recycling Requirements Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (e.g.
Intel Thermal Mechanical Reference Design Information R 4.2 Geometrical Envelope for Intel Reference Thermal Mechanical Design Figure 21, Figure 22, and Figure 23 show the overall keep-out and keep-in dimensions for the reference thermal/mechanical enabling design. These dimensions are identical to the ones used for the Intel Reference Solution for the Pentium 4 processor in the 478-pin package.
R 49 Intel Thermal Mechanical Reference Design Information Figure 21.
Intel Thermal Mechanical Reference Design Information ® R Intel Pentium 4 Processor Thermal Design Guide ® Figure 22.
R Figure 23. Volumetric Keep-in for Enabling Components ® 51 Intel Thermal Mechanical Reference Design Information NOTES: 1. Length in mm (inches) 2. Cooling Reference Solution for the Pentium 4 processor with 512-KB L2 cache on 0.
Intel Thermal Mechanical Reference Design Information R 4.3 3.06 GHz or Higher Intel Reference Thermal Solution As mention in the previous section, Intel develops thermal and mechanical reference components to demonstrate cooling capabilities for current and future microprocessors. This section details information on the reference components designed to meet target frequencies at 3.06 GHz or higher.
Intel Thermal Mechanical Reference Design Information R Figure 24. Exploded Reference Design Concept Sketch Note: Intel reserves the right to make changes and modifications to the design as necessary. Note: The thermal mechanical reference design for the Pentium 4 processor in the 478-pin package will be validated according to the Intel validation criteria given in Section 4.
Intel Thermal Mechanical Reference Design Information R 4.3.2 Enabled Reference Components 4.3.2.1 Retention Mechanism The retention mechanism for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process thermal mechanical reference solution is identical to the Pentium 4 processor in the 478-pin package reference retention mechanism. 4.3.2.2 Heatsink Attach Clip Information The 3.06 GHz or higher heatsink attach clip has been redesigned for the Pentium 4 processor with 512-KB L2 cache on 0.
Intel Thermal Mechanical Reference Design Information R 4.3.4 Thermal Interface Material Refer to Section 3.2.1.1 for general information on thermal interface material usage and application consideration on the FC-PGA2 package. Thermal interface material for the 3.06 GHz or higher Intel reference design is ShinEtsu* G751 thermal grease. 4.3.5 Enabled Reference Design Test Results Table 5 represents a results summary based on internal testing of the reference thermal solution.
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Conclusion R 5 Conclusion As the complexities of today’s microprocessors increase, the power dissipation requirements become more exacting. Care must be taken to ensure that the additional power is properly dissipated. Heat can be dissipated using passive heatsinks, fans and/or active cooling devices. Incorporating ducted airflow solutions into the system thermal design can yield additional margin. The Pentium 4 processor with 512-KB L2 cache on 0.
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Appendix A: Thermal Interface Management R Appendix A: Thermal Interface Management To optimize a heatsink design, it is important to understand the impact of factors related to the interface between the processor and the heatsink base. Specifically, the bond line thickness, interface material area and interface material thermal conductivity should be managed to realize the most effective thermal solution.
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Appendix B: Mechanical Drawings R Appendix B: Mechanical Drawings The following table lists the mechanical drawings included in this Section. These drawings refer to the thermal mechanical enabling components for the 3.06 GHz or higher Intel reference thermal design for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process. Note: Intel reserves the right to make changes and modifications to the design as necessary.
Appendix B: Mechanical Drawings Figure 25.
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Appendix B: Mechanical Drawings Figure 27.
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Appendix B: Mechanical Drawings Figure 29.
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Appendix B: Mechanical Drawings Figure 31: Heatsink Drawing – 2 of 2 68 ® ® Intel Pentium 4 Processor Thermal Design Guide R
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Appendix B: Mechanical Drawings Figure 33.
Appendix C: Intel Enabled Reference Thermal Solution R Appendix C: Intel Enabled Reference Thermal Solution This appendix includes supplier information for Intel enabled vendors for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process. As mentioned earlier, the reference component designs are available for adoption by suppliers and heatsink integrators pending completion of appropriate licensing contracts. For more information on licensing, contact the Intel representative below. Table 6.
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Appendix D: Evaluated Third-Party Thermal Solutions R Appendix D: Evaluated Third-Party Thermal Solutions This section represents solutions that have been independently tested by an Intel-enabled third party test house. These solutions have been tested and found to be compliant with the minimum thermal and mechanical performance criteria for the Pentium 4 processor with 512-KB L2 cache on 0.13 micron process and the Pentium 4 processor supporting Hyper-Threading Technology1.
