® Intel® Pentium® 4 Processor in the 423-pin Package Thermal Solution Functional Specification November 2000 Order Number: 249204-001
Intel® Pentium® 4 Processor Thermal Solution Functional Specification Date 11/00 2 Revision 1.
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Intel® Pentium® 4 Processor Thermal Solution Functional Specification ® 1. INTRODUCTION AND SPECIFICATION SCOPE ________________________________ 5 2. COMPONENTS ______________________________________________________________ 5 3. THERMAL REQUIREMENTS _________________________________________________ 6 3.1. Pentium 4 Processor Thermal Specifications _____________________________________________ 7 4. DESIGN REQUIREMENTS ____________________________________________________ 8 4.1.
® 1. Intel® Pentium® 4 Processor Thermal Solution Functional Specification INTRODUCTION AND SPECIFICATION SCOPE This document details the thermal, mechanical, and quality guidelines and requirements to design thermal solutions for the Intel® Pentium® 4 processor in the 423 pin package. With this information, a “Third Party” could design a thermal solution for the Pentium 4 processor. 2.
® Intel® Pentium® 4 Processor Thermal Solution Functional Specification z y x Figure 1 shows an exploded view of the thermal solution components. 3. THERMAL REQUIREMENTS Active thermal solution components should be designed to be in compliance with Pentium® 4 processor thermal specifications and the design constraints identified in this document. Figure 2 provides the temperature constraint at the case of the processor package (Integrated Heat Spreader, IHS).
® Intel® Pentium® 4 Processor Thermal Solution Functional Specification Where, θsa is the thermal resistance measured between the heat sink and ambient Tsink is the temperature at the bottom of the heat sink base directly over the center of the IHS Tamb is the temperature at ambient location Q is the power from the processor θcs is the thermal resistance measured across the thermal interface material Tcase is the temperature at the top of the processor package (IHS) measured at its center θca is the therm
Intel® Pentium® 4 Processor Thermal Solution Functional Specification 4. DESIGN REQUIREMENTS 4.1. Critical To Function Dimensions Table 1 provides the Critical To Function (CTF) dimensions. Figure 3 and Figure 4 provide the drawings detailing the Critical To Function (CTF) dimensions. Table 1: Critical To Function (CTF) Dimensions Dimension Letter Minimum Maximum Location of Clip Attach Groove A 0.180in 0.200in Far Edge from Heat Sink Edge Width of Clip Attach Groove B 0.080in 0.
® 8 Intel® Pentium® 4 Processor Thermal Solution Functional Specification 7 6 5 4 3 DWG. NO. SH. 751852 REV. 1 1 05 REVISION HISTORY Figure 3: Base Critical to Function Dimensions (Keep Out) Drawing ZONE REV 01 DESCRIPTION DATE INITIAL CREATION 6/4/99 6/16/99 2C7 02 CHANGED MAX HEIGHT CALLOUT, VAR 03 REFINED VOLUMETRICS, ADDED CTF APPROVED ADDED NOTE 13 .200 MIN .
® Intel® Pentium® 4 Processor Thermal Solution Functional Specification 8 7 6 5 4 3 DWG. NO. SH. 751852 2 REV. 1 05 Figure 4: Volumetric Constraints/Fan Attach Keep-In NOTES (CONT): ( .200 PENTIUM® 4 PROCESSOR HEATSINK D ) ( .200 ) 13. THE COMPLETE PENTIUM® 4 PROCESSOR THERMAL SOLUTION MUST FIT WITHIN THE VOLUMETRIC CONSTRAINTS DEFINED ON THIS SHEET. VOLUMETRIC KEEPIN D 14. UNLESS OTHERWISE SPECIFIED ALL NON-REFERENCE DIMENSIONS ON THIS SHEET ARE MAXIMUMS.
® 4.2. Intel® Pentium® 4 Processor Thermal Solution Functional Specification Maximum Heat Sink Mass Heat sink mass (including fan, fan attach, and thermal interface) may not exceed 450g. 4.3. Center of Gravity The center of gravity of the Pentium 4 processor thermal solution should be over the center of gravity of the package. The height of the center of gravity must be 0.5in, maximum, from the bottom of the heat sink base. 4.4.
Intel® Pentium® 4 Processor Thermal Solution Functional Specification ® base folded fin or high aspect ratio extruded aluminum with high performance attached fans) has been demonstrated to meet Intel thermal performance requirements. The use of thermal grease is recommended. Intel’s thermal solution reference designs use ShinEtsu* G749 thermal grease.
® Intel® Pentium® 4 Processor Thermal Solution Functional Specification Intel’s thermal solution reference design uses direct chassis attach of the processor retention mechanism. Intel recommends the use of 6-32 [x1/2-3/8”] pan head or round head screw [4 each] for direct RM-chassis attach. The screw head must be less than 0.284” diameter and less than 0.190” height. 4.10.
Intel® Pentium® 4 Processor Thermal Solution Functional Specification ® Unpackaged Vibration 0.1 0.01 g2/Hz g2/Hz ±3 dB control limits 0.001 0.0001 1 10 100 1000 Frequency (Hz) Figure 6. Unpackaged system vibration test input 6. OTHER REQUIREMENTS 6.1. Recycling Recommendation It is recommended that any plastic component exceeding 25 grams be recyclable as per the European Blue Angel recycling standards. 6.2.
® Intel® Pentium® 4 Processor Thermal Solution Functional Specification Intel Reference Designs for Enabled Components The Intel reference design is composed of a copper base, aluminum folded fin active heat sink with Shin-Etsu* G749 as the thermal interface material. To ensure proper seating and spring force of the Intel reference design heat sink clip, the vertical stack-up of the socket and package is 0.407in +/0.016in, and the thermal interface material thickness was assumed to be a maximum of 0.
Intel® Pentium® 4 Processor Thermal Solution Functional Specification Appendix 16 ®
® Intel® Pentium® 4 Processor Thermal Solution Functional Specification Appendix 17
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