Thermally Advantaged Chassis (TAC) Design Guide February 2008 Revision 2.
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Contents 1 Introduction ...................................................................................................... 5 1.1 1.2 1.3 1.4 2 Shock Test ............................................................................................11 Vibration Test........................................................................................11 Pass Criteria..........................................................................................11 Regulatory Considerations ..................
Revision History Revision Number Description Revision Date 1.0 Initial release. Chassis Air Guide (CAG) Design Guide May 2002 1.1 System vent pattern optimization. Chassis Air Guide (CAG) Design Guide September 2003 2.0 Re-design to accommodate 2009 platforms. Document title renamed to Thermally Advantaged Chassis (TAC) 2.0 to reflect the elimination of the CAG side duct.
Introduction 1 Introduction 1.1 Scope This design guide explores the design and performance of a generic airflow management scheme to adequately cool the internal components of a personal computer. Design recommendations are presented for implementation within midtower and mini-tower desktop style enclosures. The target audiences for this document are: computer enclosure engineers, designers, and system integrators. 1.
1.3 Recommended Chassis Type This design guide refers to a chassis with the features listed below. However, the ingredients and design techniques described here could be adapted to other chassis: - Fits a standard ATX or µATX motherboard - Supports two external 5.25-inch peripheral bays, one or two external 3.5-inch peripheral bays, and one or two internal 3.
Section 2 2 Section 2 2.1 Thermally Advantaged Chassis Description The following design is intended to provide a desirable internal thermal environment for standard ATX and µATX tower style chassis. One key goal is to achieve a temperature rise from external ambient to the processor fan heatsink (Trise) of 5 °C or less (or 40°C inlet to the fan heatsink at the typical maximum external ambient temperature of 35°C).
2.2 Thermally Advantaged Chassis Typical Airflow Pattern Figure 2 depicts the intended airflow pattern with the side vent. This system has a 92mm rear system fan and 80mm power supply fan. Both fans exhaust (blow out) from the chassis, thereby providing intake airflow for internal system component cooling. This fan configuration causes depressurization of the chassis interior with respect to the outside air. As a result, all other chassis openings become intake vents.
Section 2 2.3 System Fans Rear Chassis System Exhaust Fan: The chassis mounted system fan remains a critical part of the overall system solution. The rear exhausting system fan contributes to the intended low internal pressure that forces cooler external air to flow into the system vent(s). A 92mm rear fan is recommended however there are many options that will perform adequately.
2.4 TAC 2.0 Vent Size and Location The TAC 2.0 Design Guide requires a side vent as seen in Figure 1. This vent configuration has been optimized by means of thermal modeling and system level testing. The size of this vent is recommended to be 110mm wide and 150mm tall. The TAC 2.0 side vent is best located with respect to the standard ATX mounting holes as defined in the ATX Specification. Refer to Section 5 for detailed vent size and location dimensions.
Dynamics 3 Dynamics While this design guide requires no additional discrete chassis components it is recommended that the chassis be able to withstand the dynamic stress conditions listed below without displaced or damaged components. 3.1 Shock Test Unpackaged 25 g, 11 ms trapezoidal; ~ 170 in/s Two drops in each of the six directions applied to each of the test samples 3.2 Vibration Test Unpackaged Sine sweep: 5 Hz to 500 Hz @ 0.5 g ±10%; @ 0.
4 Regulatory Considerations The PC must meet a number of regulatory Safety, EMC and Ecology concerns. Specific requirements for Information Technology Equipment vary somewhat by country, however, the overall standards are somewhat unified and are based upon the following standards: Note: Certain countries may require formal certifications and many require a Declaration of Conformance (DOC) be placed in the manual or on the box. In Europe the CE mark and a DOC is required for every computing device. 4.
Regulatory Considerations 4.2 Safety This design guide is not intended to cover all safety aspects that may pertain to different countries and regulatory bodies. The safety standards listed below are a starting point for reference however, the manufacturer is ultimately responsible to ensure that all applicable safety standards are adhered to. Safety Standards: 4.
5 Mechanical Drawings
